JPS6437386A - Semiconductor receiving tube - Google Patents
Semiconductor receiving tubeInfo
- Publication number
- JPS6437386A JPS6437386A JP62189361A JP18936187A JPS6437386A JP S6437386 A JPS6437386 A JP S6437386A JP 62189361 A JP62189361 A JP 62189361A JP 18936187 A JP18936187 A JP 18936187A JP S6437386 A JPS6437386 A JP S6437386A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductors
- main body
- tube main
- projections
- lid body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
PURPOSE:To prevent the deformation or damage of each of lead terminals due to the mutual contact of the lead terminals during transport, by introducing semiconductors in a semiconductor receiving tube main body from one end thereof and interposing partitioning projections between the semiconductors while engaging a lid body with the tube main body. CONSTITUTION:A tube main body 3 has a left-and-right width as well as an up-and-down depth capable of receiving a large number of semiconductors 5,... each having lead terminals 5a,... provided to four sides thereof in a protruding state in one row. A large number of projections 8,... each having a predetermined before-and-behind width protruded in the tube main body 3 from a continuous opening 2 are arranged to the inner surface of a lid body 4 at a predetermined pitch. When the semiconductors 5... are received in the tube main body 3, the semiconductors 5 are successively charged in the tube main body and the lid body 4 deformed from the other end of the continuous opening 2 is successively pushed between guide projections 6, 6 to partition the semiconductors 5 by the projections 8. When the semiconductors 5,... are taken out, the lid body 4 is deformed from one end thereof to take out the semiconductors 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62189361A JPS6437386A (en) | 1987-07-28 | 1987-07-28 | Semiconductor receiving tube |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62189361A JPS6437386A (en) | 1987-07-28 | 1987-07-28 | Semiconductor receiving tube |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6437386A true JPS6437386A (en) | 1989-02-08 |
Family
ID=16240036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62189361A Pending JPS6437386A (en) | 1987-07-28 | 1987-07-28 | Semiconductor receiving tube |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6437386A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5145405A (en) * | 1990-05-15 | 1992-09-08 | Hirose Electric Co., Ltd. | Chip connector structure |
KR100820184B1 (en) * | 2007-02-23 | 2008-04-08 | 주식회사부원비엠에스 | Forming method for connecting part of concrete reinforcements |
-
1987
- 1987-07-28 JP JP62189361A patent/JPS6437386A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5145405A (en) * | 1990-05-15 | 1992-09-08 | Hirose Electric Co., Ltd. | Chip connector structure |
KR100820184B1 (en) * | 2007-02-23 | 2008-04-08 | 주식회사부원비엠에스 | Forming method for connecting part of concrete reinforcements |
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