JPH04103674U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPH04103674U JPH04103674U JP640391U JP640391U JPH04103674U JP H04103674 U JPH04103674 U JP H04103674U JP 640391 U JP640391 U JP 640391U JP 640391 U JP640391 U JP 640391U JP H04103674 U JPH04103674 U JP H04103674U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- recognition mark
- frame
- position recognition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 239000011889 copper foil Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000005299 abrasion Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Abstract
(57)【要約】
【構成】印刷配線板３の上で自動部品実装などに用いら
れる認識マーク２の銅箔の周囲に、任意の形状のソルダ
ーレジストの枠１ａ，１ｂまたはマーキング枠１を設け
る。
【効果】光学認識マーク２の所定形状の銅箔を、任意の
形状のソルダーレジスト枠１ａ，１ｂまたはマーキング
枠１ｃで囲むことにより、印刷配線板の部品実掃除の取
扱いの際の衝撃による認識マークの欠損や剥離を生じに
くくできる。
(57) [Summary] [Structure] Solder resist frames 1a, 1b or marking frame 1 of arbitrary shape are provided on the printed wiring board 3 around the copper foil of the recognition mark 2 used for automatic component mounting, etc. . [Effect] By surrounding the copper foil of a predetermined shape of the optical recognition mark 2 with a solder resist frame 1a, 1b or marking frame 1c of an arbitrary shape, a recognition mark can be created by impact when handling the actual cleaning of parts of printed wiring boards. This makes it difficult to cause damage or peeling.
Description
【０００１】0001
本考案は、印刷配線板に関し、特に光学位置認識用マークがある印刷（プリン ト）配線板に関する。 The present invention relates to printed circuit boards, especially those with marks for optical position recognition (printed wiring boards). g) Regarding wiring boards.
【０００２】0002
近年の表面実装技術（以下ＳＭＴという）の進展により、電子部品の外形サイ ズが小型化され、また電子部品を搭載保持し、部品間を接続するプリント配線板 も高密度化・高精度化が進んでいる。そのため部品実装の方式は、人間の目視に よる位置決めや半田付け等が行なえなくなってきており、光学位置認識装置を備 えた部品実装装置や半田付け装置等を用いる実装方式が主流となっている。また プリント配線板の検査装置や加工装置においても同様の理由により、光学位置認 識装置を備えるものが多くなってきている。 Due to recent advances in surface mount technology (hereinafter referred to as SMT), the external size of electronic components has increased. Printed wiring boards that mount and hold electronic components and connect them The technology is also becoming more dense and precise. For this reason, the component mounting method is not suitable for human visual inspection. It has become impossible to perform positioning and soldering by using optical position recognition devices. Mounting methods that use advanced component mounting equipment, soldering equipment, etc. have become mainstream. Also For the same reason, optical position recognition is also used in printed wiring board inspection equipment and processing equipment. More and more vehicles are equipped with identification devices.
【０００３】 従来の印刷配線板には、図４に示す様に、印刷配線板３の端部にエッチングで 銅箔により形成された十字形あるいは輪形等のある形状の光学位置認識用マーク ２が形成されている。この光学位置認識用マークは、部品実装装置や加工・検査 装置での位置認識に用いられるが、欠損やキズ・剥離等があってはならないもの である。0003 In conventional printed wiring boards, as shown in FIG. An optical position recognition mark in the shape of a cross or ring made of copper foil. 2 is formed. This optical position recognition mark is used for component mounting equipment, processing and inspection. Items used for position recognition in equipment, but must not have defects, scratches, peeling, etc. It is.
【０００４】0004
上述した従来の印刷配線板は、光学位置認識用マークの周辺に光学認識用マー クを保護する他の銅箔パターンのような凸部が存在しない。そのため印刷配線板 の製造工程中あるいは検査部品実装等の取扱いの際に、光学位置認識用マーク付 近に衝撃を加えたり、光学位置認識マーク付近で他の物との擦過が発生した場合 、これら衝撃や擦過を光学位置認識用マークが直接に受けて欠損や剥離が生じる 可能性が高く、欠損や剥離が生じた場合、光学位置認識用マークとして使用出来 なくなるという欠点があった。 The conventional printed wiring board mentioned above has an optical recognition mark around the optical position recognition mark. There are no protrusions like other copper foil patterns to protect the surface. Therefore printed wiring board With marks for optical position recognition during the manufacturing process or during handling such as mounting inspection parts. If an impact is applied nearby or friction occurs with another object near the optical position recognition mark. , the optical position recognition mark is directly exposed to these impacts and scratches, resulting in damage and peeling. If there is a high possibility that the mark is damaged or peeled off, it cannot be used as an optical position recognition mark. The drawback was that it disappeared.
【０００５】 本考案の目的は、このような欠点を除き、光学認識用マークの欠損や剥離をな くし、信頼性を高くした印刷配線板を提供することにある。[0005] The purpose of this invention is to eliminate these drawbacks and prevent damage and peeling of optical recognition marks. The purpose of the present invention is to provide a printed wiring board with high reliability.
【０００６】[0006]
本考案の構成は、部品実装または加工・検査のための光学位置認識用マークを 板面の一部に形成した印刷配線板において、前記光学位置認識用マークの周囲に 任意の形状の保護枠を設けたことを特徴とする。 The configuration of the present invention is for optical position recognition marks for component mounting or processing/inspection. In a printed wiring board formed on a part of the board surface, a mark is placed around the optical position recognition mark. It is characterized by having a protective frame of an arbitrary shape.
【０００７】 本考案において、保護枠はソルダーレジストまたはマーキング材からなること ができる。[0007] In this invention, the protective frame must be made of solder resist or marking material. I can do it.
【０００８】[0008]
図１は本考案の一実施例の部分平面図である。本実施例は、印刷配線板３の光 学位置認識マーク２である例えば十字形の銅箔の周囲に、ソルダレジストにより 四角い枠１ａが設けられている。この十字形の銅箔のマーク２は、塩化第二銅箔 等の溶液によるエッチングプロセスで形成され、またソルダレジストによる四角 い枠１ａは、例えばドライフィルムソルダレジストをラミネートし、紫外線によ り四角い枠状に露光し、有機溶剤等により現像し、紫外線により効果させること により形成される。 FIG. 1 is a partial plan view of an embodiment of the present invention. In this embodiment, the light of the printed wiring board 3 is For example, use solder resist around the cross-shaped copper foil that is the school location recognition mark 2. A square frame 1a is provided. This cross-shaped copper foil mark 2 is cupric chloride foil. It is formed by an etching process using a solution such as The blank frame 1a is made by laminating, for example, dry film solder resist and exposing it to ultraviolet light. Exposure to light in the form of a square frame, develop with organic solvent, etc., and effect with ultraviolet rays. formed by
【０００９】 この様な構造にすることにより、印刷配線板３の製造工程中や部品実装時の取 扱いの際に光学位置認識マークの十字形の銅箔の付近に衝撃や擦過が加わっても その周囲にソルダレジストによる四角い枠１ａを形成してあるため、衝撃や擦過 の影響を直接受けることは少くなる。また、衝撃や擦過によりソルダレジストに よる四角い枠１ａが破壊されたとしても光学位置認識マーク２には、欠損や剥離 は生じにくくなる。要するにソルダレジストによる四角い枠１ａが保護の役目を 果たしている。[0009] This structure makes it easier to handle during the manufacturing process of the printed wiring board 3 and when mounting components. Even if a shock or abrasion is applied to the area near the cross-shaped copper foil of the optical position recognition mark during handling, A rectangular frame 1a made of solder resist is formed around it, so it is protected against impact and abrasion. will be less directly affected by In addition, impact or abrasion may damage the solder resist. Even if the square frame 1a is destroyed, the optical position recognition mark 2 will not be damaged or peeled off. is less likely to occur. In short, the square frame 1a made of solder resist plays a protective role. Fulfilling.
【００１０】 図２は本考案の第２の実施例の部分平面図である。本実施例は、十字形の銅箔 の光学位置認識マーク２のソルダレジストによる丸枠１ｂが被覆するようにして 形成されている。このソルダレジストによる枠１ｂも、ドライフィルムソルダレ ジストを印刷配線板３にラミネートし、丸枠１ｂの形状に紫外線で露光し有機溶 剤により現像し紫外線で硬化させることにより形成される。0010 FIG. 2 is a partial plan view of a second embodiment of the present invention. This example uses cross-shaped copper foil. The round frame 1b made of the solder resist of the optical position recognition mark 2 covers the optical position recognition mark 2. It is formed. The frame 1b made of this solder resist is also made of dry film solder. The resist is laminated onto a printed wiring board 3, and exposed to ultraviolet light in the shape of a round frame 1b to form an organic solvent. It is formed by developing with an agent and curing with ultraviolet rays.
【００１１】 本実施例では、第１の実施例の場合より十字形の銅箔と枠１ｂとの間の距離が 狭くなり、かつソルダレジストのマーク２の一部が十字形の銅箔を被覆している ので、保護の機能をより高めることができる。このソルダレジストの形状は任意 の形状でかまわないことは、もちろんである。[0011] In this embodiment, the distance between the cross-shaped copper foil and the frame 1b is smaller than in the first embodiment. It becomes narrower, and part of the solder resist mark 2 covers the cross-shaped copper foil. Therefore, the protection function can be further enhanced. The shape of this solder mask is arbitrary. Of course, the shape may be used.
【００１２】 図３は本考案の第３の実施例の部分平面図である。本実施例も、印刷配線板３ の板端付近の自動部品実装機用の認識マーク２として使用する十字形の銅箔の周 囲に四角いマーキング枠１ｃが設けられている。この四角いマーキング枠１ｃは 、光学の認識マーク２の十字形の銅箔を形成した後に、マーキング印刷により形 成される。0012 FIG. 3 is a partial plan view of a third embodiment of the present invention. This embodiment also uses the printed wiring board 3 The circumference of the cross-shaped copper foil used as recognition mark 2 for the automatic component mounting machine near the edge of the board. A square marking frame 1c is provided around it. This square marking frame 1c is After forming the cross-shaped copper foil of optical recognition mark 2, the shape is printed by marking. will be accomplished.
【００１３】 この場合、マーキング枠１ｃの線幅は、認識マーク２の線幅と同じ位でもよい が、図のように認識マーク２の線幅より太くしたり、面積を広くしたりもできる 。こうすることにより、認識マーク２の付近に衝撃が加わっても、マーキング枠 １ｃがあるので、銅箔の認識マーク２に欠損や剥離を生じにくくし、保護の機能 を高めることができる。このマーキング枠１ｃの形状は四角でなくとも、任意の 形状でかまわない。[0013] In this case, the line width of the marking frame 1c may be about the same as the line width of the recognition mark 2. However, as shown in the figure, you can also make the line thicker than recognition mark 2 or make the area wider. . By doing this, even if an impact is applied near recognition mark 2, the marking frame will remain intact. 1c, it prevents the copper foil recognition mark 2 from being damaged or peeled off, and has a protective function. can be increased. The shape of this marking frame 1c may be any shape other than a square. It doesn't matter the shape.
【００１４】[0014]
以上説明した様に本考案は、光学位置認識マークを任意のソルダレジストまた はマーキング枠で囲むことにより、印刷配線板の製造工程中あるいは部品実装時 の取り扱いの際の衝撃や擦過による光学位置認識マークの欠損や剥離が生じにく くなり、信頼性を高められるという効果がある。 As explained above, the present invention allows optical position recognition marks to be placed on any solder resist or By surrounding it with a marking frame, you can mark it during the manufacturing process of printed wiring boards or when mounting parts. The optical position recognition mark is less likely to be damaged or peeled off due to impact or abrasion during handling. This has the effect of increasing reliability.
【図面の簡単な説明】[Brief explanation of drawings]
【図１】本考案の一実施例の部分平面図。FIG. 1 is a partial plan view of an embodiment of the present invention.
【図２】本考案の第２の実施例の部分平面図。FIG. 2 is a partial plan view of a second embodiment of the present invention.
【図３】本考案の第３の実施例の部分平面図。FIG. 3 is a partial plan view of a third embodiment of the present invention.
【図４】従来例の印刷配線板の部分平面図。FIG. 4 is a partial plan view of a conventional printed wiring board.
１ａ，１ｂ ソルダレジスト枠 １ｃ マーキング枠 ２ 光学位置認識マーク ３ 印刷配線板 1a, 1b Solder resist frame 1c marking frame 2 Optical position recognition mark 3 Printed wiring board
Claims (3)
位置認識用マークを板面の一部に形成した印刷配線板に
おいて、前記光学位置認識用マークの周囲に任意の形状
の保護枠を設けたことを特徴とする印刷配線板。1. In a printed wiring board in which an optical position recognition mark for component mounting or processing/inspection is formed on a part of the board surface, a protective frame of an arbitrary shape is provided around the optical position recognition mark. A printed wiring board characterized by:
求項１記載の印刷配線板。2. The printed wiring board according to claim 1, wherein the protective frame is made of solder resist.
１記載の印刷配線板。3. The printed wiring board according to claim 1, wherein the protective frame is made of a marking material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP640391U JPH04103674U (en) | 1991-02-18 | 1991-02-18 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP640391U JPH04103674U (en) | 1991-02-18 | 1991-02-18 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04103674U true JPH04103674U (en) | 1992-09-07 |
Family
ID=31737626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP640391U Pending JPH04103674U (en) | 1991-02-18 | 1991-02-18 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04103674U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3104771B2 (en) * | 1992-05-30 | 2000-10-30 | 前田建設工業株式会社 | Construction method of composite cable-stayed bridge by extrusion method |
-
1991
- 1991-02-18 JP JP640391U patent/JPH04103674U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3104771B2 (en) * | 1992-05-30 | 2000-10-30 | 前田建設工業株式会社 | Construction method of composite cable-stayed bridge by extrusion method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970408 |