JPH0398755A - Polishing device - Google Patents

Polishing device

Info

Publication number
JPH0398755A
JPH0398755A JP23403389A JP23403389A JPH0398755A JP H0398755 A JPH0398755 A JP H0398755A JP 23403389 A JP23403389 A JP 23403389A JP 23403389 A JP23403389 A JP 23403389A JP H0398755 A JPH0398755 A JP H0398755A
Authority
JP
Japan
Prior art keywords
polishing
polished
polishing tool
polishing member
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23403389A
Other languages
Japanese (ja)
Inventor
Kazuji Fukuda
和司 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP23403389A priority Critical patent/JPH0398755A/en
Publication of JPH0398755A publication Critical patent/JPH0398755A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To correspond to various kinds of works to be polished or the inner diameter fluctuation of the work to be polished by providing a polishing member with the polishing tool at its tip and supporting the polishing member at a supporting part in such a way as to be changeable in its radially protruding length from the supporting part. CONSTITUTION:A polishing member 12 is rotated around a shaft part 10, and a polishing tool (wire brush) 16 provided at the tip of the polishing member 12 performs circular motion. A work to be polished (resin mold) 1 is polished by the slidable contact of the polishing tool 16 at this time with the inner surface of the work to be polished 1. In this case, the polishing member 12 is supported by a supporting part 11 in such a way as to be changeable in its radially protruding length. With this change, the rotational radius of the polishing tool 16 is changed, so that plural kinds of works to be polished 1 of different inner diameters or the work to be polished 1 of fluctuating inner diameter can be performed by one polishing member 12.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明はパフ布,ブラシ.砥石等の研磨具により樹脂或
形型等の被研磨物の内面を研磨する研磨装置に関する。
[Detailed Description of the Invention] [Object of the Invention] (Field of Industrial Application) The present invention relates to puff cloths and brushes. The present invention relates to a polishing device that polishes the inner surface of an object to be polished, such as a resin mold, using a polishing tool such as a grindstone.

(従来の技術) 例えば円管形状を有する樹脂成形型にあっては、その内
面を研磨により鏡面加工することが行われている。一般
に、この種の研磨を行うための装置としては、モータ,
減速機構等から或る回転駆動機構の出力軸に、円形のパ
フ布等の研磨具を装着し、これを回転させつつそのパフ
布の外周部分を前記樹脂成形型の内面に接触させて研磨
を行うようにしたものが供されている。
(Prior Art) For example, in a resin molding mold having a cylindrical shape, the inner surface thereof is polished to a mirror finish. Generally, equipment for this type of polishing includes a motor,
A polishing tool such as a circular puff cloth is attached to the output shaft of a rotary drive mechanism from a speed reduction mechanism, etc., and polishing is performed by rotating the polishing tool while bringing the outer circumference of the puff cloth into contact with the inner surface of the resin mold. What is served is exactly as it should be.

(発明が解決しようとする課8) ところで、上記研磨装置においては、出力軸に取り付け
られる研磨具はその径が固定的であるため、被研磨物の
内径が各種異なる場合には、サイズの異なる研磨具を被
研磨物に応じて付け替えて研磨作業を行うようにしてい
る。このため、研磨作業を行うにあたり、被研磨物の種
類毎にサイズの異なる多数の研磨具を準備しておかなけ
ればならない不具合を有していた。
(Issue 8 to be solved by the invention) By the way, in the above-mentioned polishing device, the diameter of the polishing tool attached to the output shaft is fixed, so when the inner diameter of the polished object is different, Polishing work is performed by changing the polishing tool depending on the object to be polished. For this reason, when performing polishing work, there is a problem in that a large number of polishing tools of different sizes must be prepared for each type of object to be polished.

また、一つの被研磨物であっても、その被研磨物の内面
が、テーパ状をなしていたり内径が軸方向に関して変動
したりするような場合にも、一つの研磨具のままでは全
体にわたっての研磨作業がうまく行えないことが多くな
る。即ち、研磨具サイズを被研磨物のうち径大部分に対
応させて選定すれば、径小部分にて内面への圧接力が大
きくなり過ぎて過剰に磨滅したり傷を付けたりする虞が
あり、一方、研磨具サイズを径小部分に対応させれば、
径大部分での圧接力が小さ過ぎて研磨不足を招いてしま
う。従って、軸方向に関して内径が一様でない面の研磨
を行う場合には、一つの被研磨物に対して作業の途中で
研磨具を取換える必要が生じ、研磨作業が面倒で時間が
かかる問題点があった。
In addition, even if there is only one object to be polished, if the inner surface of the object is tapered or the inner diameter varies in the axial direction, one polishing tool cannot cover the entire surface. Polishing work often cannot be done properly. In other words, if the size of the polishing tool is selected in accordance with the large diameter part of the object to be polished, there is a risk that the pressing force against the inner surface of the small diameter part will be too large, causing excessive wear and damage. , On the other hand, if the polishing tool size is adapted to small diameter parts,
The pressure contact force in a large portion of the diameter is too small, resulting in insufficient polishing. Therefore, when polishing a surface whose inner diameter is not uniform in the axial direction, it is necessary to change the polishing tool during the work for one object to be polished, which causes the problem that the polishing work is troublesome and time consuming. was there.

本発明は上記事情に鑑みてなされたもので、その目的は
、被研磨物の種類の相違あるいは内径の変動に一種類の
研磨具で対応させることができ、ひいては、研磨作業の
簡易化を図ることができる研磨装置を提供するにある。
The present invention has been made in view of the above circumstances, and its purpose is to enable one type of polishing tool to cope with differences in the types of objects to be polished or variations in the inner diameter, and to simplify polishing work. Our goal is to provide polishing equipment that can.

【発明の構戊〕[Structure of the invention]

(課題を解決するための手段) 本発明の研磨装置は、パフ布,ブラシ,砥石等の研磨具
により中空部を有する被研磨物の内面を研磨する装置で
あって、回転駆動機構により回転されるシャフト部に、
被研磨物の中空部内に挿入配置される支持部を設け、こ
の支持部に、先端部に研磨具を備える研磨部材をその支
持部からの径方向への突出長さを変更自在となるように
支持させたところに特徴を有する。
(Means for Solving the Problems) The polishing device of the present invention is a device for polishing the inner surface of an object to be polished having a hollow portion using a polishing tool such as a puff cloth, a brush, or a grindstone, and is rotated by a rotation drive mechanism. In the shaft part,
A support part is provided to be inserted into the hollow part of the object to be polished, and a polishing member having a polishing tool at the tip thereof is attached to the support part so that the length of the polishing member protruding from the support part in the radial direction can be freely changed. It is characterized by its support.

(作用) 上記手段によれば、研磨部材がシャフト部を中心に回転
し、その先端に設けられた研磨具が円運動する。このと
きの研磨具の被研磨物の内面への摺接により、被研磨物
の研磨が行われる。
(Function) According to the above means, the polishing member rotates around the shaft portion, and the polishing tool provided at the tip of the polishing member rotates in a circular motion. At this time, the object to be polished is polished by sliding the polishing tool against the inner surface of the object to be polished.

この場合、研磨部材は、支持部によって径方向への突出
長さが変更可能に支持されているから、その変更により
、研磨具の回転半径を変更させることができる。これに
より、一つの研磨部材により、内径の穴なる複数種類の
被研磨物あるいは内径の変動する被研磨物の研磨が可能
となる。
In this case, since the polishing member is supported by the support portion so that the protrusion length in the radial direction can be changed, the rotation radius of the polishing tool can be changed by changing the protrusion length in the radial direction. This makes it possible to polish a plurality of types of objects to be polished, such as holes with inner diameters, or objects to be polished with varying inner diameters, using one polishing member.

(実施例) 以下本発明の一実施例について、図面を参照して説明す
る。
(Example) An example of the present invention will be described below with reference to the drawings.

第1図に示すように、被研磨物である樹脂成形型1は、
例えばステンレス鋼からなり、中空部2を有する略円筒
状をなしている。この場合、中空部2を形威している樹
脂戊形型1の内面1aは、同図に示すように、概ね上部
に向かうに従って次第に径大となるテーバ状をなしてい
る。
As shown in FIG. 1, a resin mold 1 as an object to be polished is
For example, it is made of stainless steel and has a substantially cylindrical shape with a hollow portion 2. In this case, the inner surface 1a of the resin oval mold 1 defining the hollow portion 2 has a generally tapered shape whose diameter gradually increases toward the top, as shown in the figure.

次に、この樹脂成形型1の内面1aを研磨して鏡面加工
するための研磨装置3について述べる。
Next, a polishing device 3 for polishing the inner surface 1a of the resin mold 1 to give it a mirror finish will be described.

本実施例に係る研磨装置3は、披研磨物移動機構部4,
研磨機構部5及びこれらの駆動制御を行なう制御装置6
等から構成されている。
The polishing apparatus 3 according to this embodiment includes a polishing object moving mechanism section 4,
Polishing mechanism section 5 and a control device 6 that controls the drive thereof
It is composed of etc.

第1図に示すように、被研磨物移動機構部4は、図示し
ないベースに上下方向に移動可能に設けられた台座7と
、この台座7を上下移動させる移動装置8とから構成さ
れている。台座7には、前記樹脂成形型1が固定される
ようになっている。そして、移動装置8は、モータ8a
とこれによって回転される回転軸8bとを有し、この回
転軸8bが前記台座7に周知のボールねじ機構によって
連結され、以て、移動装置8により樹脂成形型1が前記
ベースに対して上下移動されるようになっている。また
、後述するように、モータ8aの回転速度即ち台座7の
移動速度は制御装置6により制御され、これにより、樹
脂・成形型1の軸方向の送り速度Vが制御されるように
なっている。
As shown in FIG. 1, the polished object moving mechanism section 4 is composed of a pedestal 7 that is provided on a base (not shown) so as to be movable in the vertical direction, and a moving device 8 that moves the pedestal 7 up and down. . The resin mold 1 is fixed to the pedestal 7. The moving device 8 has a motor 8a.
The rotating shaft 8b is connected to the base 7 by a well-known ball screw mechanism, and the moving device 8 moves the resin mold 1 up and down with respect to the base. It is about to be moved. Further, as will be described later, the rotational speed of the motor 8a, that is, the moving speed of the pedestal 7 is controlled by the control device 6, and thereby the axial feed speed V of the resin/molding mold 1 is controlled. .

一方、研磨機構部5は、前記ベースに対して固定的に設
けられた研磨用モータ9a及び減速機構9bからなる回
転駆動機構9により、図示上下方向に延びるシャフト部
10を回転駆動するように構成されている。そして、シ
ャフト部10の先端(下端)に、後述する支持部11が
設けられ、この支持部11に研磨部材12が設けられて
いる。
On the other hand, the polishing mechanism section 5 is configured to rotationally drive a shaft section 10 extending in the vertical direction in the figure by a rotational drive mechanism 9 consisting of a polishing motor 9a and a deceleration mechanism 9b fixedly provided to the base. has been done. A support portion 11, which will be described later, is provided at the tip (lower end) of the shaft portion 10, and a polishing member 12 is provided on this support portion 11.

支持部11は、前記樹脂或形型1の中空部2内に押入配
置されるようになっており、シャフト部10の回転によ
り研磨部材12による樹脂成形型1の内面1aの研磨が
行われるようになっている。
The support part 11 is pressed into the hollow part 2 of the resin mold 1, and the rotation of the shaft part 10 causes the polishing member 12 to polish the inner surface 1a of the resin mold 1. It has become.

また、シャフト部10の回転速度(角速度ω)は、後述
するように制御装置6により制御されるようになってい
る。尚、詳しく図示はしないが、この研磨機構部5には
、樹脂成形型1の内面1aに研磨液等の研磨剤を供給す
るための研磨剤供給部13が設けられている。
Further, the rotational speed (angular velocity ω) of the shaft portion 10 is controlled by the control device 6 as described later. Although not shown in detail, the polishing mechanism section 5 is provided with an abrasive supply section 13 for supplying an abrasive such as a polishing liquid to the inner surface 1a of the resin mold 1.

さて、前記支持部11及び研磨部材12について述べる
。この支持部11は、全体として内部が上下二室に区画
された偏平な円筒容器状をなす。
Now, the support portion 11 and the polishing member 12 will be described. The support portion 11 as a whole has the shape of a flat cylindrical container whose interior is divided into two upper and lower chambers.

上室内には、第2図にも示すように、前記シャフト部1
0の軸心に対して直径方向に延び、図中左端側で開口す
る収納部14が形成されている。この収納部14内には
、基端部に鉤状の抜け止め部15a(第1図参照)を有
したスライドパー15がスライド可能に収納され、その
先端部に、ワイヤブラシからなる研磨具16が着脱可能
に装着されている。尚、この研磨具16はスライドパー
15への装着状態で、ピン16aを中心に矢印B方向に
回動自由となっている。また、研磨具16としては、こ
のワイヤブラシの他に、パフ布や砥石,水砥石等が用意
されている。
Inside the upper chamber, as shown in FIG.
A housing portion 14 is formed that extends in the diametrical direction with respect to the axis of the housing 14 and opens on the left end side in the figure. A slider 15 having a hook-shaped retaining portion 15a (see FIG. 1) at its base end is slidably accommodated in the storage portion 14, and a polishing tool 16 consisting of a wire brush is attached to its tip. is attached removably. Incidentally, when this polishing tool 16 is attached to the slide par 15, it is freely rotatable in the direction of arrow B about the pin 16a. In addition to this wire brush, the polishing tool 16 includes a puff cloth, a whetstone, a water whetstone, and the like.

本発明にいう研磨部材12は、上述のスライドパー15
とこれに装着した研磨具16とから構成され、従ってこ
の研磨部材12は、スライドパー15の基端部側が収納
部14内に挿入された状態で、支持部11に径方向にス
ライド可能に支持された形態となっている。これにより
、研磨部材12は、支持部11に対し該支持部11から
の突出長さが変更自在である。また、この突出長さは、
前記スライドパー15の抜け止め部15aが収納部14
の開口縁部に係止することにより規制されており、この
とき、その抜け止め部15aがこの開口部内縁に配設さ
れたマイクロスイッチl7をオンするようになっている
。一方、収納部14内の基端部には、研磨部材12の突
出長さを検出するための光学式距離センサ18が設けら
れている。
The polishing member 12 according to the present invention is the slide par 15 described above.
and a polishing tool 16 attached thereto, and therefore, this polishing member 12 is supported so as to be slidable in the radial direction on the support portion 11 with the base end side of the slider 15 inserted into the storage portion 14. It is in the form of Thereby, the protrusion length of the polishing member 12 from the support portion 11 can be changed freely. In addition, this protrusion length is
The retaining portion 15a of the slider 15 is connected to the storage portion 14.
At this time, the retaining portion 15a turns on a microswitch 17 disposed on the inner edge of the opening. On the other hand, an optical distance sensor 18 for detecting the protruding length of the polishing member 12 is provided at the base end within the storage portion 14 .

この距離センサ18は、周知のように、図示しない発光
部から光をスライドパー15の端面に照射してその反射
光を受光することにより、スライドパー15との間の距
離を検出するものである。以上の構成は、支持部11の
下室にも、前記上室とは180度配置が異なる状態に設
けられており、従って、支持部11には、2本の研磨部
材12,12が、両側に突出して、夫々径方向に突出長
さを変更自在に支持されている。
As is well known, the distance sensor 18 detects the distance to the slide par 15 by emitting light from a light emitting part (not shown) onto the end surface of the slide par 15 and receiving the reflected light. . In the above configuration, the lower chamber of the support part 11 is also provided in a position different from the upper chamber by 180 degrees, and therefore, the two polishing members 12, 12 are provided in the support part 11 on both sides. They protrude from each other and are supported so that their respective protrusion lengths can be changed in the radial direction.

一方、前記制御装置6は、例えばマイクロコンピュータ
を含んで構成され、第3図にも示すように、データ記憶
・読み出し部1つ,回転速度制御部20,送り速度制御
部21,人力操作部22,表示部23等から構成されて
いる。このうちデータ記憶・読み出し部1つには、予め
経験的あるいは実験的に求められた、被研磨物の材質及
び求める表面粗皮に対応する最適な研磨具16の種類,
その研磨具16の質量m.その研磨具16についての最
適な研磨力(圧接力)f及び最適な送り速度係数kがテ
ーブル化されて記憶されている。そして、詳しくは後述
するが、入力操作部22から人力される加工データに基
づいて、前記移動装置8による樹脂成形型1の送り速度
Vや、回転駆動機構9によるシャフト部10の回転速度
ωの制御を行い、樹脂成形型1の内面1aの研磨作業が
自動的に実行される。
On the other hand, the control device 6 includes, for example, a microcomputer, and as shown in FIG. , display section 23, etc. Of these, one data storage/readout section stores the type of polishing tool 16 that is most suitable for the material of the object to be polished and the desired surface roughness, determined in advance empirically or experimentally.
The mass of the polishing tool 16 is m. The optimum polishing force (pressing force) f and the optimum feed rate coefficient k for the polishing tool 16 are stored in a table form. As will be described in detail later, the feeding speed V of the resin mold 1 by the moving device 8 and the rotational speed ω of the shaft portion 10 by the rotary drive mechanism 9 are determined based on the processing data manually inputted from the input operation section 22. The polishing operation of the inner surface 1a of the resin mold 1 is automatically performed under control.

次に、上記構成の作用について説明する。Next, the operation of the above configuration will be explained.

研磨作業を行うにあたっては、作業者はまず、被研磨物
たる樹脂或形型1についての材質及び求める表面粗度等
の加工データを入力操作部22から制御装rIl6に入
力する。これにより、その加工データに対応する研磨具
16,送り速度係数kがデータ記憶●読み出し部1つか
ら読み出されると共に、研磨具16の種類が表示部23
に表示される。作業者は、その表示に基づいて研磨具1
6(ワイヤブラシ)をスライドパー15に取付けると共
に、樹脂或形型1を台座7に固定し、さらに台座7を例
えば手動にて上下動させて研磨部材12が樹脂成形型1
の中空部2内の下端部分に位置するようにセットする。
To perform the polishing work, the operator first inputs machining data such as the material and desired surface roughness for the resin mold 1, which is the object to be polished, from the input operation section 22 to the control device rI16. As a result, the polishing tool 16 and feed rate coefficient k corresponding to the machining data are read out from one data storage/reading section, and the type of polishing tool 16 is displayed on the display section 23.
will be displayed. The operator uses the polishing tool 1 based on the display.
6 (wire brush) is attached to the slider 15, the resin mold 1 is fixed to the pedestal 7, and the pedestal 7 is moved up and down manually, for example, so that the polishing member 12 is attached to the resin mold 1.
Set it so that it is located at the lower end inside the hollow part 2.

そして、図示しないスタートスイッチをオン操作すれば
、研磨作業が開始される。この研磨作業は、第1図に示
すように、シャフト部1oが例えば矢印A方向に回転す
ると共に、台座7が下方に移動することにより行われる
。このとき、シャフト部10の回転による遠心力により
、研磨部材12は、先端の研磨具16が、樹脂成形型l
の内而1aに接するまで、支持部11から径方向に突出
する。この状態で、研磨部材12がシャフト部1Oを中
心に回転し、その先端の研磨具16が内面1aに摺接し
つつ円運動し、これにより、樹脂成形型1の内面1aが
研磨される。そして、これと同時に、移動装置8による
樹脂成形型1の下方への送り移動によって、研磨具16
は相対的に内面1aを上昇して行く。この相対的な上昇
に伴い、中空部2の内径は次第に大きくなるが、研磨部
材12は、収納部14内をスライドして支持部11から
の径方向への突出長さを自在に変更できるから、研磨具
16は遠心力により常に樹脂成形型1の内面1aに摺接
するようになり、内面1a形状に応じて回転半径rを変
化させつつ内而1a全体の研磨を行う。内面1aの上端
までの研磨が終了すると、研磨部材12が内面1aを外
れて遠心力により最大量の所まで突出し、このとき、ス
ライドパー15の抜け止め部15aがマイクロスイッチ
17をオンさせるため、研磨装置3は停止する。
Then, by turning on a start switch (not shown), the polishing work is started. This polishing work is performed by rotating the shaft portion 1o in the direction of arrow A, for example, and moving the base 7 downward, as shown in FIG. At this time, due to the centrifugal force caused by the rotation of the shaft portion 10, the polishing tool 16 at the tip of the polishing member 12 is moved into the resin molding mold.
It protrudes in the radial direction from the support portion 11 until it comes into contact with the inner portion 1a of the support portion 11. In this state, the polishing member 12 rotates around the shaft portion 1O, and the polishing tool 16 at its tip moves circularly while slidingly contacting the inner surface 1a, thereby polishing the inner surface 1a of the resin mold 1. At the same time, the polishing tool 16 is moved downward by the moving device 8 to move the resin mold 1 downward.
relatively rises on the inner surface 1a. With this relative rise, the inner diameter of the hollow part 2 gradually increases, but the polishing member 12 can slide inside the storage part 14 and freely change the length of the protrusion in the radial direction from the support part 11. The polishing tool 16 always comes into sliding contact with the inner surface 1a of the resin mold 1 due to centrifugal force, and polishes the entire inner surface 1a while changing the radius of rotation r according to the shape of the inner surface 1a. When the polishing to the upper end of the inner surface 1a is completed, the polishing member 12 comes off the inner surface 1a and protrudes to the maximum amount due to centrifugal force, and at this time, the retaining portion 15a of the slider 15 turns on the micro switch 17. The polishing device 3 stops.

尚、この研磨作業中、研磨剤供給部13により、内面1
aに研磨剤が供給されるようになっている。
During this polishing work, the inner surface 1 is
The abrasive is supplied to a.

而して、この研磨作業の行程で、制御装置6は、シャフ
ト部10の回転速度ω及び樹脂成形型1の送り速度Vの
制御を、次のように行い、これにより内面1a全体が均
一に研磨される。
In the course of this polishing work, the control device 6 controls the rotation speed ω of the shaft portion 10 and the feed speed V of the resin mold 1 as follows, so that the entire inner surface 1a is uniformly coated. Polished.

即ち、前述したように、制御装置6のデータ記憶・読み
出し部1つには、研磨具16の質量m1樹脂成形型1の
材質と求める表面粗度とに応じた研磨力(圧接力)f及
び送り速度係数kのデータが収納されている。第3図に
示すように、回転速度制御部20は、まず、支持部11
に設けられた距離センサ18からの入力信号により、現
在の研磨部材12の回転半径r(樹脂成形型1のうち研
磨している部位の内径)を演算する。次に、求められた
回転半径『と、前記データ記憶・読み出し部20の研磨
具16の質量m及び最適な研磨力fとから、その最適な
研磨力fを得るための角速度ωを演算する。この場合、
例えば、理想状態では研磨力fは遠心力と同等と考えら
れるから、遠心力の式f−mrω2からωが演算される
。回転速度制御部20は、この求めた角速度ωに応じた
出力信号を回転駆動機構9に出力し、シャフト部1Oひ
いては研磨具16をその角速度ωにて回転させる。この
角速度ωは研磨部材12の回転半径rの変動に応じて次
第に変動し、樹脂或形型1の内i[1aのうち径小の部
位では大きな角速度ωで、径大な部位では小さな角速度
ωで研磨部材12が回転されるようになる。これにより
、常に研磨具16の最適な圧接力にて研磨作業が行われ
る。
That is, as described above, one data storage/readout section of the control device 6 stores the polishing force (pressing force) f and the mass m1 of the polishing tool 16, the material of the resin mold 1, and the desired surface roughness. Data of the feed rate coefficient k is stored. As shown in FIG. 3, the rotational speed control section 20 first controls the support section 11.
The current rotation radius r of the polishing member 12 (inner diameter of the part of the resin mold 1 being polished) is calculated based on an input signal from a distance sensor 18 provided at the position. Next, from the obtained rotation radius ``, the mass m of the polishing tool 16 of the data storage/reading section 20, and the optimum polishing force f, the angular velocity ω for obtaining the optimum polishing force f is calculated. in this case,
For example, in an ideal state, polishing force f is considered to be equivalent to centrifugal force, so ω is calculated from the centrifugal force equation f-mrω2. The rotational speed control section 20 outputs an output signal corresponding to the obtained angular velocity ω to the rotational drive mechanism 9, and rotates the shaft portion 1O and thus the polishing tool 16 at the angular velocity ω. This angular velocity ω gradually changes depending on the variation of the rotation radius r of the polishing member 12, and the angular velocity ω is large in the small diameter part of the resin mold 1 [1a], and the small angular velocity ω is in the large diameter part. The polishing member 12 is now rotated. As a result, the polishing work is always performed with the optimum pressing force of the polishing tool 16.

そして、送り速度制御部21では、前記回転速度制御部
20にて求められた角速度ωと、前記データ記憶・読み
出し部1つの送り速度係数kとから、最適な送り速度V
(樹脂或形型1の下降速度)が演算される。これは、式
v−kωにより求められ、送り速度制御部21は、この
送り速度Vの値に応じた出力信号を前記移動装置8に出
力し、以て、樹脂或形型1をその速度Vにて下降させる
Then, the feed speed control section 21 determines the optimum feed speed V from the angular velocity ω determined by the rotation speed control section 20 and the feed speed coefficient k of the data storage/reading section.
(the descending speed of the resin mold 1) is calculated. This is determined by the formula v-kω, and the feed speed control section 21 outputs an output signal corresponding to the value of this feed speed V to the moving device 8, thereby moving the resin or mold 1 at the speed V. lower it.

この送り速度Vも角速度ωひいては回転半径rの変動に
応じて次第に変動し、樹脂成形型1の内面1aのうち径
小の部位では大きな速度Vで、径大な部位では小さな速
度Vで研磨部材12が相.対的に上方に送られるように
なる。これにより、樹脂成形型1の内面1aは、単位面
積当たりの研磨具16の摺接時間(研磨時間)を一定に
して研磨が行なわれる。
This feed rate V also gradually changes according to the angular velocity ω and thus the rotation radius r, and the polishing member is polished at a large speed V at a small diameter portion of the inner surface 1a of the resin mold 1 and at a small speed V at a large diameter portion. 12 is phase. In contrast, it will be sent upward. Thereby, the inner surface 1a of the resin mold 1 is polished while keeping the sliding contact time (polishing time) of the polishing tool 16 constant per unit area.

従って、以上のようなシャフト部10の回転速度ω及び
台座7の送り速度Vの制御により、樹脂成形型1の内面
1aにおいて、単位面積当たりの研磨力f及び研磨時間
が常に最適な一定値となり、この結果、内面1a全体の
均一な研磨が実行されるのである。
Therefore, by controlling the rotational speed ω of the shaft portion 10 and the feed rate V of the pedestal 7 as described above, the polishing force f and polishing time per unit area on the inner surface 1a of the resin mold 1 are always kept at optimum constant values. As a result, the entire inner surface 1a is uniformly polished.

このように本実施例によれば、研磨部材12を支持部1
1からの径方向への突出長さを変更可能に設けたので、
研磨具16の回転半径を変更させることができて、一つ
の研磨部材12により、内径の変動する樹脂成形型1の
内面1a全体を研磨することができる。従って、被研磨
物の種類毎にサイズの異なる多数の研磨具を準備してお
かなければならなかった従来のものと異なり、種類の相
違する被研磨物に対して一つのサイズの研磨具16にて
対応させることができる。また、被研磨物1の内面1a
が略テーバ状で内径が変動する場合でも、研磨具を途中
で取替える必要のあった従来のものと異なり、研磨具1
6の交換作業が不要で、研磨作業の容易化、時間の短縮
化を図ることができる。
In this way, according to this embodiment, the polishing member 12 is
Since the protrusion length in the radial direction from 1 can be changed,
The radius of rotation of the polishing tool 16 can be changed, and one polishing member 12 can polish the entire inner surface 1a of the resin mold 1 whose inner diameter varies. Therefore, unlike the conventional method in which a large number of polishing tools of different sizes had to be prepared for each type of workpiece, one size polishing tool 16 is used for different types of workpieces. It is possible to correspond to In addition, the inner surface 1a of the object to be polished 1
Unlike conventional polishing tools, where the polishing tool had to be replaced mid-way even when the inner diameter fluctuated due to the approximately tapered shape, the polishing tool 1
6 is not necessary, and the polishing work can be facilitated and the time can be shortened.

さらに、特に本実施例では、上記したように制御装置6
により、被研磨物の材質及び求める表面粗度に応じた、
最適な研磨具16の選択ができると共に、最適な研磨力
f及び単位面積当たりの研磨時間にて自動的に研磨作業
が行われる等の利点が得られる。この場合にも、被研磨
物1の内面1aが略テーパ状で内径が変動するときでも
、シャフト部10の回転速度(角速度ω)及び台座7の
送り速度Vは、単位面積当たりの研磨力f及び研磨時間
が常に最適な一定値となるように制御され、この結果、
内面1a全体にわたってむらのない均一な研磨が実行さ
れるものである。
Furthermore, especially in this embodiment, as described above, the control device 6
Depending on the material of the object to be polished and the desired surface roughness,
Advantages such as being able to select the optimum polishing tool 16 and automatically performing the polishing work with the optimum polishing force f and polishing time per unit area can be obtained. In this case as well, even when the inner surface 1a of the object 1 to be polished is substantially tapered and the inner diameter varies, the rotational speed (angular velocity ω) of the shaft portion 10 and the feed speed V of the pedestal 7 are determined by the polishing force f per unit area. The polishing time and polishing time are always controlled to an optimal constant value, and as a result,
Even and uniform polishing is performed over the entire inner surface 1a.

尚、本発明は上記実施例に限定されるものではなく、例
えば台座7を移動させるのではなく固定された被研磨物
に対して研磨部材側を移動させるように構成しても良く
、また、必ずしもシャフト部の回転速度及び被研磨物の
送り速度の$1111は行わなくても良い等、要旨を逸
脱しない範囲内で適宜変更して実施し得るものである。
It should be noted that the present invention is not limited to the above-mentioned embodiments, and for example, instead of moving the pedestal 7, the polishing member side may be moved relative to a fixed object to be polished; The rotating speed of the shaft portion and the feeding speed of the object to be polished do not necessarily have to be set at $1111, and can be implemented with appropriate changes within the scope of the gist.

[発明の効果] 以上の説明にて明らかなように、本発明の研磨装置によ
れば、被研磨物の種類の相違あるいは内径の変動に一つ
の研磨具で対応させることができ、ひいては、多種の研
磨具の準備を不要となし得ると共に研磨作業の簡易化を
図ることができるという優れた効果を奏する。
[Effects of the Invention] As is clear from the above explanation, according to the polishing apparatus of the present invention, a single polishing tool can cope with differences in the types of objects to be polished or variations in the inner diameter, and can even be applied to various types of objects. This has excellent effects in that it is not necessary to prepare a polishing tool and the polishing work can be simplified.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明の一実施例を示すもので、第1図は全体構
成を一部縦断して示す正面図、第2図は支持部を示す横
断上面図、第3図は制御装置内の機能ブロック図である
。 図面中、1は樹脂成形型(被研磨物)、1aは内面、2
は中空部、3は研磨装置、4は被研磨物移動機構部、5
は研磨機構部、6は制御装置、8は移動装置、9は回転
駆動機構、1oはシャフト部、11は支持部、12は研
磨部材、16はワイヤブラシ(研磨具)を示す。 七 第 2 図
The drawings show one embodiment of the present invention; Fig. 1 is a partially longitudinal front view of the overall configuration, Fig. 2 is a cross-sectional top view showing the support section, and Fig. 3 shows functions within the control device. It is a block diagram. In the drawing, 1 is a resin mold (object to be polished), 1a is an inner surface, 2 is
3 is a hollow part, 3 is a polishing device, 4 is a polished object moving mechanism part, 5
1 is a polishing mechanism, 6 is a control device, 8 is a moving device, 9 is a rotary drive mechanism, 1o is a shaft portion, 11 is a support portion, 12 is a polishing member, and 16 is a wire brush (polishing tool). Figure 7 2

Claims (1)

【特許請求の範囲】[Claims] 1、バフ布、ブラシ、砥石等の研磨具により中空部を有
する被研磨物の内面を研磨する装置であって、回転駆動
機構により回転されるシャフト部と、このシャフト部に
設けられ前記被研磨物の中空部内に挿入配置される支持
部と、先端部に前記研磨具を備え前記支持部に該支持部
からの径方向への突出長さを変更自在に支持された研磨
部材とを具備したことを特徴とする研磨装置。
1. A device for polishing the inner surface of a workpiece having a hollow part using a polishing tool such as a buffing cloth, a brush, or a grindstone, which includes a shaft part rotated by a rotational drive mechanism, and a shaft part provided on the shaft part to be polished. The polishing member includes a support part that is inserted into a hollow part of an object, and a polishing member that has the polishing tool at its tip and is supported by the support part so that its protrusion length in the radial direction from the support part can be freely changed. A polishing device characterized by:
JP23403389A 1989-09-09 1989-09-09 Polishing device Pending JPH0398755A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23403389A JPH0398755A (en) 1989-09-09 1989-09-09 Polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23403389A JPH0398755A (en) 1989-09-09 1989-09-09 Polishing device

Publications (1)

Publication Number Publication Date
JPH0398755A true JPH0398755A (en) 1991-04-24

Family

ID=16964510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23403389A Pending JPH0398755A (en) 1989-09-09 1989-09-09 Polishing device

Country Status (1)

Country Link
JP (1) JPH0398755A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081778A (en) * 2005-09-14 2007-03-29 Kyocera Mita Corp Image forming apparatus
JP2009177274A (en) * 2008-01-22 2009-08-06 Nec Access Technica Ltd Facsimile, printing method and program
US8736868B2 (en) 2005-09-14 2014-05-27 Kyocera Document Solutions Inc. Image forming apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081778A (en) * 2005-09-14 2007-03-29 Kyocera Mita Corp Image forming apparatus
US8736868B2 (en) 2005-09-14 2014-05-27 Kyocera Document Solutions Inc. Image forming apparatus
JP2009177274A (en) * 2008-01-22 2009-08-06 Nec Access Technica Ltd Facsimile, printing method and program

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