JPH0397963U - - Google Patents
Info
- Publication number
- JPH0397963U JPH0397963U JP651790U JP651790U JPH0397963U JP H0397963 U JPH0397963 U JP H0397963U JP 651790 U JP651790 U JP 651790U JP 651790 U JP651790 U JP 651790U JP H0397963 U JPH0397963 U JP H0397963U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- leaded electronic
- chip
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP651790U JPH0397963U (pt) | 1990-01-26 | 1990-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP651790U JPH0397963U (pt) | 1990-01-26 | 1990-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397963U true JPH0397963U (pt) | 1991-10-09 |
Family
ID=31510193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP651790U Pending JPH0397963U (pt) | 1990-01-26 | 1990-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397963U (pt) |
-
1990
- 1990-01-26 JP JP651790U patent/JPH0397963U/ja active Pending