JPH0397964U - - Google Patents
Info
- Publication number
- JPH0397964U JPH0397964U JP651890U JP651890U JPH0397964U JP H0397964 U JPH0397964 U JP H0397964U JP 651890 U JP651890 U JP 651890U JP 651890 U JP651890 U JP 651890U JP H0397964 U JPH0397964 U JP H0397964U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- leaded electronic
- board
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP651890U JPH0397964U (pt) | 1990-01-26 | 1990-01-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP651890U JPH0397964U (pt) | 1990-01-26 | 1990-01-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0397964U true JPH0397964U (pt) | 1991-10-09 |
Family
ID=31510194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP651890U Pending JPH0397964U (pt) | 1990-01-26 | 1990-01-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0397964U (pt) |
-
1990
- 1990-01-26 JP JP651890U patent/JPH0397964U/ja active Pending