JPH0397927U - - Google Patents

Info

Publication number
JPH0397927U
JPH0397927U JP1990007252U JP725290U JPH0397927U JP H0397927 U JPH0397927 U JP H0397927U JP 1990007252 U JP1990007252 U JP 1990007252U JP 725290 U JP725290 U JP 725290U JP H0397927 U JPH0397927 U JP H0397927U
Authority
JP
Japan
Prior art keywords
tool
bonding
workpiece
thin metal
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990007252U
Other languages
English (en)
Other versions
JPH0744019Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990007252U priority Critical patent/JPH0744019Y2/ja
Publication of JPH0397927U publication Critical patent/JPH0397927U/ja
Application granted granted Critical
Publication of JPH0744019Y2 publication Critical patent/JPH0744019Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図はワイヤボンデイング装置の側面図、第
２図乃至第５図はボンデイング作業時のＸＹθテ
ーブルの移動動作を示す図、第６図は従来のワイ
ヤボンデイング装置の側面図、第７図乃至第１１
図は従来のＸＹθテーブルの移動動作を示す図で
ある。 １……ツール、２……ボンデイングアーム、３
……Ｘテーブル、７……Ｙテーブル、９……θテ
ーブル、１３……ＸＹθテーブル。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワークに金属細線をボンデイングするワイヤボ
    ンデイング装置に於いて、前記ワークに金属細線
    をボンデイングする上下動可能なツールと、該ツ
    ールの下方に位置され回転センターがツールと一
    致するように配置されたθテーブルと、該θテー
    ブル上に設けられ前記ワークを載置してＸＹ移動
    可能なＸＹテーブルとを設けたことを特徴とする
    ワイヤボンデイング装置。
JP1990007252U 1990-01-29 1990-01-29 作業装置 Expired - Fee Related JPH0744019Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990007252U JPH0744019Y2 (ja) 1990-01-29 1990-01-29 作業装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990007252U JPH0744019Y2 (ja) 1990-01-29 1990-01-29 作業装置

Publications (2)

Publication Number Publication Date
JPH0397927U true JPH0397927U (ja) 1991-10-09
JPH0744019Y2 JPH0744019Y2 (ja) 1995-10-09

Family

ID=31510914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990007252U Expired - Fee Related JPH0744019Y2 (ja) 1990-01-29 1990-01-29 作業装置

Country Status (1)

Country Link
JP (1) JPH0744019Y2 (ja)

Also Published As

Publication number Publication date
JPH0744019Y2 (ja) 1995-10-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees