JPH0396048U - - Google Patents
Info
- Publication number
- JPH0396048U JPH0396048U JP451190U JP451190U JPH0396048U JP H0396048 U JPH0396048 U JP H0396048U JP 451190 U JP451190 U JP 451190U JP 451190 U JP451190 U JP 451190U JP H0396048 U JPH0396048 U JP H0396048U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- package cage
- groove
- grid
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005336 cracking Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP451190U JPH0396048U (ko) | 1990-01-22 | 1990-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP451190U JPH0396048U (ko) | 1990-01-22 | 1990-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396048U true JPH0396048U (ko) | 1991-10-01 |
Family
ID=31508256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP451190U Pending JPH0396048U (ko) | 1990-01-22 | 1990-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396048U (ko) |
-
1990
- 1990-01-22 JP JP451190U patent/JPH0396048U/ja active Pending