JPH0396041U - - Google Patents
Info
- Publication number
- JPH0396041U JPH0396041U JP1990004045U JP404590U JPH0396041U JP H0396041 U JPH0396041 U JP H0396041U JP 1990004045 U JP1990004045 U JP 1990004045U JP 404590 U JP404590 U JP 404590U JP H0396041 U JPH0396041 U JP H0396041U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- width
- bumps
- covered
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004045U JPH0396041U (en:Method) | 1990-01-19 | 1990-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004045U JPH0396041U (en:Method) | 1990-01-19 | 1990-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396041U true JPH0396041U (en:Method) | 1991-10-01 |
Family
ID=31507814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990004045U Pending JPH0396041U (en:Method) | 1990-01-19 | 1990-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396041U (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299376A (ja) * | 2001-01-23 | 2002-10-11 | Shibaura Mechatronics Corp | ボンディング装置及びボンディンク方法 |
-
1990
- 1990-01-19 JP JP1990004045U patent/JPH0396041U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299376A (ja) * | 2001-01-23 | 2002-10-11 | Shibaura Mechatronics Corp | ボンディング装置及びボンディンク方法 |