JPH0272579U - - Google Patents
Info
- Publication number
- JPH0272579U JPH0272579U JP15147488U JP15147488U JPH0272579U JP H0272579 U JPH0272579 U JP H0272579U JP 15147488 U JP15147488 U JP 15147488U JP 15147488 U JP15147488 U JP 15147488U JP H0272579 U JPH0272579 U JP H0272579U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- electronic component
- electrode pad
- printed wiring
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15147488U JPH0272579U (en:Method) | 1988-11-21 | 1988-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15147488U JPH0272579U (en:Method) | 1988-11-21 | 1988-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272579U true JPH0272579U (en:Method) | 1990-06-01 |
Family
ID=31425552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15147488U Pending JPH0272579U (en:Method) | 1988-11-21 | 1988-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272579U (en:Method) |
-
1988
- 1988-11-21 JP JP15147488U patent/JPH0272579U/ja active Pending