JPH0396027U - - Google Patents
Info
- Publication number
- JPH0396027U JPH0396027U JP554190U JP554190U JPH0396027U JP H0396027 U JPH0396027 U JP H0396027U JP 554190 U JP554190 U JP 554190U JP 554190 U JP554190 U JP 554190U JP H0396027 U JPH0396027 U JP H0396027U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component body
- external
- resist layer
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 4
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP554190U JPH0396027U (de) | 1990-01-24 | 1990-01-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP554190U JPH0396027U (de) | 1990-01-24 | 1990-01-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0396027U true JPH0396027U (de) | 1991-10-01 |
Family
ID=31509244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP554190U Pending JPH0396027U (de) | 1990-01-24 | 1990-01-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0396027U (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014036149A (ja) * | 2012-08-09 | 2014-02-24 | Tdk Corp | 電子部品 |
CN103928231A (zh) * | 2013-01-14 | 2014-07-16 | 三星电机株式会社 | 多层陶瓷电容器和该多层陶瓷电容器的安装板及制造方法 |
-
1990
- 1990-01-24 JP JP554190U patent/JPH0396027U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014036149A (ja) * | 2012-08-09 | 2014-02-24 | Tdk Corp | 電子部品 |
CN103928231A (zh) * | 2013-01-14 | 2014-07-16 | 三星电机株式会社 | 多层陶瓷电容器和该多层陶瓷电容器的安装板及制造方法 |
JP2014187058A (ja) * | 2013-01-14 | 2014-10-02 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ、積層セラミックキャパシタの実装基板及び積層セラミックキャパシタの製造方法 |