JPS6289184U - - Google Patents
Info
- Publication number
- JPS6289184U JPS6289184U JP18075585U JP18075585U JPS6289184U JP S6289184 U JPS6289184 U JP S6289184U JP 18075585 U JP18075585 U JP 18075585U JP 18075585 U JP18075585 U JP 18075585U JP S6289184 U JPS6289184 U JP S6289184U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- solder
- solder resistance
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18075585U JPS6289184U (de) | 1985-11-26 | 1985-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18075585U JPS6289184U (de) | 1985-11-26 | 1985-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289184U true JPS6289184U (de) | 1987-06-08 |
Family
ID=31125001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18075585U Pending JPS6289184U (de) | 1985-11-26 | 1985-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289184U (de) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103498A (en) * | 1980-01-22 | 1981-08-18 | Matsushita Electric Ind Co Ltd | Method of solder resisting through hole of printed circuit board |
| JPS6049664B2 (ja) * | 1975-02-28 | 1985-11-02 | チバ・ガイキー、アクチエンゲゼルシヤフト | 有機材料仕上げ用の水溶性化合物の貯蔵安定性にすぐれた水性分散物 |
-
1985
- 1985-11-26 JP JP18075585U patent/JPS6289184U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049664B2 (ja) * | 1975-02-28 | 1985-11-02 | チバ・ガイキー、アクチエンゲゼルシヤフト | 有機材料仕上げ用の水溶性化合物の貯蔵安定性にすぐれた水性分散物 |
| JPS56103498A (en) * | 1980-01-22 | 1981-08-18 | Matsushita Electric Ind Co Ltd | Method of solder resisting through hole of printed circuit board |