JPH0395676U - - Google Patents
Info
- Publication number
- JPH0395676U JPH0395676U JP216390U JP216390U JPH0395676U JP H0395676 U JPH0395676 U JP H0395676U JP 216390 U JP216390 U JP 216390U JP 216390 U JP216390 U JP 216390U JP H0395676 U JPH0395676 U JP H0395676U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- layer
- pattern layer
- insulating
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP216390U JPH0395676U (bs) | 1990-01-12 | 1990-01-12 | |
| GB9100480A GB2240663A (en) | 1990-01-12 | 1991-01-10 | Metal base wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP216390U JPH0395676U (bs) | 1990-01-12 | 1990-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395676U true JPH0395676U (bs) | 1991-09-30 |
Family
ID=31506043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP216390U Pending JPH0395676U (bs) | 1990-01-12 | 1990-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395676U (bs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006187882A (ja) * | 2004-12-28 | 2006-07-20 | Chinsei Enami | 中綴じ製本装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61254039A (ja) * | 1985-05-02 | 1986-11-11 | Sony Corp | 回路パタ−ン形成方法 |
| JPS622591A (ja) * | 1985-06-28 | 1987-01-08 | 電気化学工業株式会社 | 金属ベ−ス混成集積回路基板の製法 |
-
1990
- 1990-01-12 JP JP216390U patent/JPH0395676U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61254039A (ja) * | 1985-05-02 | 1986-11-11 | Sony Corp | 回路パタ−ン形成方法 |
| JPS622591A (ja) * | 1985-06-28 | 1987-01-08 | 電気化学工業株式会社 | 金属ベ−ス混成集積回路基板の製法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006187882A (ja) * | 2004-12-28 | 2006-07-20 | Chinsei Enami | 中綴じ製本装置 |
| JP4515250B2 (ja) * | 2004-12-28 | 2010-07-28 | 鎭生 江浪 | 中綴じ製本装置 |