JPH0395628U - - Google Patents
Info
- Publication number
- JPH0395628U JPH0395628U JP250190U JP250190U JPH0395628U JP H0395628 U JPH0395628 U JP H0395628U JP 250190 U JP250190 U JP 250190U JP 250190 U JP250190 U JP 250190U JP H0395628 U JPH0395628 U JP H0395628U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor device
- utility
- wiring layer
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は、本考案の半導体装置を示す平面図ａ
と断面図ｂ。 １０１……ウエハー、１０２……認識符号領域
、１０３……基板、１０４……第１層目配線、１
０５……第２層目配線。
と断面図ｂ。 １０１……ウエハー、１０２……認識符号領域
、１０３……基板、１０４……第１層目配線、１
０５……第２層目配線。
Claims (1)
- バーコードによるウエハー認識符号を配線層の
パターニング工程でウエハー上に形成することを
特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP250190U JPH0395628U (ja) | 1990-01-16 | 1990-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP250190U JPH0395628U (ja) | 1990-01-16 | 1990-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395628U true JPH0395628U (ja) | 1991-09-30 |
Family
ID=31506375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP250190U Pending JPH0395628U (ja) | 1990-01-16 | 1990-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395628U (ja) |
-
1990
- 1990-01-16 JP JP250190U patent/JPH0395628U/ja active Pending