JPH0394975A - Automatic soldering device - Google Patents
Automatic soldering deviceInfo
- Publication number
- JPH0394975A JPH0394975A JP23091889A JP23091889A JPH0394975A JP H0394975 A JPH0394975 A JP H0394975A JP 23091889 A JP23091889 A JP 23091889A JP 23091889 A JP23091889 A JP 23091889A JP H0394975 A JPH0394975 A JP H0394975A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- volume
- liquid level
- immersed
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 113
- 239000007788 liquid Substances 0.000 claims abstract description 62
- 230000007423 decrease Effects 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 241001070941 Castanea Species 0.000 description 1
- 235000014036 Castanea Nutrition 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
自動はんだ付け装置に関し、
はんだ接合部の品質の均一化を図ることを目的とし、
はんだ槽内に貯留したはんだをノズルより噴流させ、液
面にプリント基板を浸漬してはんだ付けする自動はんだ
付け装置において、はんだ槽のはんだ内に浸漬される容
積補充体と、この容積補充体のはんだ内に浸漬される体
積をはんだ付けにより消費されたはんだの体積と等しく
なるように制御してはんだ槽内のはんだの液面を一定に
制御する液面補償装置とを設けた構成とした。[Detailed Description of the Invention] [Summary] The purpose of this automatic soldering device is to uniformize the quality of solder joints by jetting solder stored in a solder bath from a nozzle and placing a printed circuit board on the liquid surface. In an automatic soldering device that performs immersion soldering, a volume replenisher is immersed in the solder in the solder bath, and the volume of the volume replenisher immersed in the solder is equal to the volume of solder consumed by soldering. The configuration includes a liquid level compensation device that controls the solder liquid level in the solder bath to be constant by controlling the solder liquid level so that the solder liquid level is constant.
本発明は、いわゆる、噴流方式の自動はんだ付け装置に
関する。The present invention relates to a so-called jet type automatic soldering device.
はんだ槽内に貯留した溶融はんだをノズルより噴流させ
、液面にプリント基板を浸漬してはんだ付けする、いわ
ゆる、噴流方式の自動はんだ付け装置は、例えば、プリ
ント基板のスルーホールに挿入実装型電子部品を実装す
る場合や、両面実装基板の下面に表面実装型電子部品を
実装する場合に多用されている。The so-called jet-type automatic soldering equipment, in which molten solder stored in a solder bath is jetted from a nozzle and a printed circuit board is immersed in the liquid surface for soldering, is used for example to solder a mounted electronic device inserted into a through hole of a printed circuit board. It is often used when mounting components or when mounting surface-mounted electronic components on the bottom surface of a double-sided mounting board.
この種の自動はんだ付け装置は、例えば第２図に示すよ
うに、挿入実装型電子部品を装着したプリント基板５を
搬送する搬送装置９を備え、搬送装置９の搬送経路に沿
って上手側から下手側に順にフラクサ１０，エアーナイ
フ１１、ブリヒータｌ２、熱風ヒータ１３、噴流式はん
だ槽１、冷却ファン１４等が配設される。For example, as shown in FIG. 2, this type of automatic soldering apparatus is equipped with a transport device 9 that transports a printed circuit board 5 on which an insertion-mounted electronic component is mounted. A fluxer 10, an air knife 11, a pre-heater 12, a hot air heater 13, a jet solder bath 1, a cooling fan 14, etc. are arranged in this order on the lower side.
上記噴流式はんだ槽１は、例えば第３図に示すように、
断熱材で作られた槽本体１５内にヒータ１６とノズル３
と、ボンブ１７とを設け、ヒータ１６で溶解したはんだ
２をボンブ１７でノズル３に送り込み、ノズル３の上端
から所定の噴流高さｈにはんだ２を噴流させ、噴流液面
４を形或するようになっている。上記ボンブＩ７は槽本
体１５外に設けた変速機１９を介してモータ２０で駆動
されるようになっており、また、ヒータ１６は熱電対２
１によって検出されるはんだ２の温度が所定の温度とな
るように制御される．
〔発明が解決しようとする課題〕
ところで、この自動はんだ付け装置を使用してはんだ付
けを行うと、はんだ２がプリント基板５に付着して次第
にその量が減少し、槽本体１５内のはんだ２の噴流液面
４が次第に低下し、槽本体１５内に十分な量のはんだ２
が貯留されているにもかかわらず噴流液面４の高さが低
くなり、プリント基板５が十分に噴流液面４下のはんだ
２に浸漬されなぐなる結果、はんだ接合部の品質にむら
が生じ、極端な場合にははんだ不良が発生することがあ
る。For example, as shown in FIG. 3, the jet solder bath 1 has
A heater 16 and a nozzle 3 are installed inside the tank body 15 made of heat insulating material.
and a bomb 17, the solder 2 melted by the heater 16 is fed into the nozzle 3 by the bomb 17, and the solder 2 is jetted from the upper end of the nozzle 3 to a predetermined jet height h to form the jet liquid level 4. It looks like this. The bomb I7 is driven by a motor 20 via a transmission 19 provided outside the tank body 15, and the heater 16 is connected to a thermocouple 2.
The temperature of the solder 2 detected by the solder 2 is controlled to a predetermined temperature. [Problem to be Solved by the Invention] By the way, when soldering is performed using this automatic soldering device, the solder 2 adheres to the printed circuit board 5 and the amount thereof gradually decreases, and the solder 2 in the tank body 15 The jet liquid level 4 gradually decreases, and a sufficient amount of solder 2 is deposited in the tank body 15.
The height of the jet liquid level 4 becomes low even though the solder is stored, and the printed circuit board 5 is not sufficiently immersed in the solder 2 below the jet liquid level 4, resulting in uneven quality of the solder joint. In extreme cases, solder defects may occur.
本発明は、上記の事情を考慮してなされたものであり、
はんだ接合部の品質の均一化を図れるようにした自動半
田付け装置を提供することを目的とするものである。The present invention has been made in consideration of the above circumstances,
It is an object of the present invention to provide an automatic soldering device that can achieve uniform quality of solder joints.
本発明は、例えば第１図に示すように、はんだ［１内に
貯留したはんだ２をノズル３より噴流させ、その噴流液
面４にプリント基板５を浸漬してはんだ付けする自動は
んだ付け装置を前提として、上記の目的を達威するため
、次のような手段を講じている。For example, as shown in FIG. 1, the present invention provides an automatic soldering device that jets solder 2 stored in solder 1 from a nozzle 3 and immerses a printed circuit board 5 in the jet liquid level 4 to solder the solder. As a premise, the following measures have been taken to achieve the above objectives.
すなわち、はんだ槽ｌのはんだ２内に浸漬される容積補
充体２５と、この容積補充体２５のはんだ２内に浸漬さ
れる体積をはんだ付けにより使用されたはんだ２の体積
と等しくなるように制御してはんだ槽ｌ内のはんだ２の
液面４ａを一定の高さに制御する液面補償装置６とを設
ける。That is, the volume replenisher 25 is immersed in the solder 2 of the solder bath l, and the volume of the volume replenisher 25 immersed in the solder 2 is controlled so as to be equal to the volume of the solder 2 used in soldering. A liquid level compensation device 6 is provided to control the liquid level 4a of the solder 2 in the solder bath l to a constant height.
本発明においては、溶融はんだ２がプリント基板５に付
着して次第に減少するのに対応して、液面補償装置６が
容積補充体２５をはんだ付けにより使用された溶融はん
だ２の体積と等しい体積だけはんだに浸漬される。これ
により、はんだ槽１内に残されたばんだ２の体積と容積
補充体２５が溶融はんだ２内に浸漬された部分の体積と
の合計体積が一定になり、はんだ槽１内のはんだ２の液
面４ａの高さが一定に保持される．
〔実施例〕
以下、本発明の実施例を第１図に基づき説明する．
この自動はんだ付け装置のはんだ槽ｌは、断熱材で作ら
れた槽本体１５を有し、この槽本体１５内にヒータ１６
と、ノズル３と、ボンブ１７とが設けられる。また、槽
零体１５にはばんだ２が入れられ、ヒータ１６で溶解し
たはんだ２がボンブｌ７でノズル３に送り込まれ、ノズ
ル３の上端から所定の噴流高さｈに噴流して、噴流液面
４を形或するようになっている。そして、プリント基板
５はこの噴流液面４下に浸漬されながらノズル３の上方
を一方向に移動され、この間にその下面にはんだ２が付
着さるようになっている。In the present invention, as the molten solder 2 adheres to the printed circuit board 5 and gradually decreases, the liquid level compensation device 6 increases the volume replenishing body 25 to a volume equal to the volume of the molten solder 2 used by soldering. Only to be dipped in solder. As a result, the total volume of the solder 2 left in the solder bath 1 and the volume of the portion of the volume filler 25 immersed in the molten solder 2 becomes constant, and the volume of the solder 2 in the solder bath 1 becomes constant. The height of the liquid level 4a is maintained constant. [Example] Hereinafter, an example of the present invention will be explained based on FIG. 1. The soldering bath l of this automatic soldering apparatus has a bath body 15 made of a heat insulating material, and a heater 16 is installed inside this bath body 15.
, a nozzle 3, and a bomb 17 are provided. Further, the solder 2 is placed in the tank zero body 15, and the solder 2 melted by the heater 16 is sent to the nozzle 3 by the bomb 17, and is jetted from the upper end of the nozzle 3 to a predetermined jet height h, and the jet liquid is It is designed to shape the surface 4. The printed circuit board 5 is moved in one direction above the nozzle 3 while being immersed below the jet liquid level 4, and during this time the solder 2 is attached to the lower surface thereof.
上記ボンブ１７は槽本体１５外に設けた変速機ｌ９を介
してモータ２０で駆動されるようになっており、また、
ヒータ１６への通電は熱電対２１によって検出される溶
融はんだ２の温度が所定の温度となるように制御される
。The bomb 17 is driven by a motor 20 via a transmission l9 provided outside the tank body 15, and
The power supply to the heater 16 is controlled so that the temperature of the molten solder 2 detected by the thermocouple 21 becomes a predetermined temperature.
上記槽本体１５内には、溶融はんだ２に浸漬される容積
補充体２５が設けられ、更に、この容積補充体２５の溶
融はんだ２内に浸漬される体積がはんだ付けにより使用
された溶融はんだ２の体積と等しくなるように容積補充
体２５のはんだ２への浸漬量を制御して溶融はんだ２の
液面４ａの高さを一定に制御する液面補償装置６が設け
られる。Inside the tank body 15, a volume replenisher 25 is provided which is immersed in the molten solder 2, and furthermore, the volume of the volume replenisher 25 immersed in the molten solder 2 is the molten solder 2 used in soldering. A liquid level compensation device 6 is provided which controls the height of the liquid level 4a of the molten solder 2 to be constant by controlling the amount of the volume replenisher 25 immersed in the solder 2 so that the volume is equal to the volume of the solder 2.
この液面補償装置６は、溶融はんだ２の液面４ａの高さ
を検出する液面センサ２２と、制御回路２３と、容積補
充体２５を上下方向に変位させる昇降装置２４とを備え
、液面センサ２２が検出する溶融はんだ２の液面４ａが
所定の高さＨを下回る時に制御回路２３が昇降装置２４
を作動させて容積補充体２５を下降させることにより、
溶融はんだ２の液面４ａを所定の高さＨまで回復させる
ようになっている。The liquid level compensation device 6 includes a liquid level sensor 22 that detects the height of the liquid level 4a of the molten solder 2, a control circuit 23, and a lifting device 24 that displaces the volume replenisher 25 in the vertical direction. When the liquid level 4a of the molten solder 2 detected by the surface sensor 22 falls below a predetermined height H, the control circuit 23 activates the lifting device 24.
By lowering the volume replenisher 25 by activating the
The liquid level 4a of the molten solder 2 is restored to a predetermined height H.
上記液面センサ２２ははんだ２の液面４ａの高さを検出
できるように構威してあればよく、ここでは、液面セン
サ２２を電気良導体で形威し、これとばんだ２との間の
通電の有無によって溶融はんだ２の液面４ａが所定の高
さＨ以下に低下しているか否かを検出できるように構威
してある。The liquid level sensor 22 may be configured to be able to detect the height of the liquid level 4a of the solder 2. Here, the liquid level sensor 22 is made of a good electrical conductor, and the liquid level sensor 22 is configured to be able to detect the height of the liquid level 4a of the solder 2. The arrangement is such that it can be detected whether the liquid level 4a of the molten solder 2 has fallen below a predetermined height H or not based on the presence or absence of current between the two.
上記容積補充体２５は、これを固形はんだで形威して溶
融はんだ２内に浸漬された部分が溶融するようにｔｉ或
してもよいが、ここでは、液面４ａの高さの制御をより
正確に安定良く行うため、ステンレス、耐熱合或樹脂、
ガラス等、はんだよりも融解温度が高い金属、合或樹脂
、あるいはセラミックスで構成してある．
この自動はんだ付け装置によれば、はんだ付けが行われ
、槽本体１５内のはんだ２が徐々に消費されてその量が
減少し、はんだ２の液面４ａが所定の高さＨよりも低く
なると、液面センサ２２がその液面４ａの低下を検出し
、制御回路２３が昇降装置２４を作動させて容積補充体
２５を下降させることにより、溶融はんだ２の液面４ａ
を所定の高さＨまで回復させる。したがって、はんだ付
けを開始した後、容積補充体２５を溶融はんだ２に浸漬
し始め、その全体を溶融はんだに浸漬させるまでの間、
槽本体ｌ５内のはんだ２の液面４ａの高さは常時ほぼＨ
に保持され、ボンブ１７によりノズル３の上方に噴流さ
れるはんだ２の噴流液面４の高さ、すなわち、噴流高さ
ｈが一定の高さに保持されることになる。したがって、
プリント基板５を噴流液面４下の同じ深さまで浸漬させ
ることができ、プリント基板５へのはんだ２の付着量を
一定に制御することができる。その結果、製品のはんだ
接合部の品質を均一化でき、はんだ接合部の品質に対す
る信頼性を高めることができる．上記の実施例において
、液面センサ２２は溶融はんだ２の接触の有無によりオ
ンオフされるスイッチで構成されているが、この液面セ
ンサ２２を例えば超音波を使用して液面４ａの高さを検
出したり、液面４ａからの放射温度を検出することによ
り液面４ａの高さを検出したりするように、液面４ａと
接触せずに液面高さを検出するように構威してもよい。The volume replenisher 25 may be formed with solid solder so that the portion immersed in the molten solder 2 is melted, but here, the height of the liquid level 4a is controlled. For more accurate and stable operation, stainless steel, heat-resistant composite or resin,
It is made of metal such as glass, which has a higher melting temperature than solder, composite resin, or ceramics. According to this automatic soldering device, when soldering is performed, the solder 2 in the tank body 15 is gradually consumed and its amount decreases, and when the liquid level 4a of the solder 2 becomes lower than a predetermined height H. , the liquid level sensor 22 detects a decrease in the liquid level 4a, and the control circuit 23 operates the lifting device 24 to lower the volume replenisher 25, thereby lowering the liquid level 4a of the molten solder 2.
to a predetermined height H. Therefore, after starting soldering, the volume replenisher 25 is started to be immersed in the molten solder 2 until the entire volume is immersed in the molten solder.
The height of the liquid level 4a of the solder 2 in the tank body l5 is always approximately H.
The height of the jet liquid level 4 of the solder 2 jetted above the nozzle 3 by the bomb 17, that is, the jet height h, is maintained at a constant height. therefore,
The printed circuit board 5 can be immersed to the same depth below the jet liquid level 4, and the amount of solder 2 attached to the printed circuit board 5 can be controlled to be constant. As a result, the quality of the solder joints of the product can be made uniform, and the reliability of the quality of the solder joints can be increased. In the above embodiment, the liquid level sensor 22 is constituted by a switch that is turned on and off depending on the presence or absence of contact with the molten solder 2, and the liquid level sensor 22 is used, for example, to measure the height of the liquid level 4a using ultrasonic waves. The height of the liquid level 4a can be detected without coming into contact with the liquid level 4a, such as by detecting the temperature of the liquid surface 4a or by detecting the radiation temperature from the liquid level 4a. You can.
また、ポンブｌ７は定常回転させてもよく、また、脈動
回転させてもよい。ただし、ボンプｌ７を脈動回転させ
る場合には、液面センサ２２の検出値を平均化して液面
４ａの高さを求める必要がある。Further, the pump 17 may be rotated constantly or may be rotated in a pulsating manner. However, when the pump 17 is rotated in a pulsating manner, it is necessary to average the detection values of the liquid level sensor 22 to obtain the height of the liquid level 4a.
以上のように、本発明によれば、はんだ槽内の溶融はん
だの液面が所定の高さよりも低下すれば液面補償装置に
よって容積補充体を溶融はんだ内に入れてその浸漬体積
を大きくすることによりはんだ槽内のはんだの液面を所
定の高さに回復させるようにしてあるので、はんだ槽内
のはんだの液面が長期間にわたってほぼ一定に保持され
、ノズルの上方に噴流されるはんだの噴流液面の高さ、
すなわち、噴流高さを長期間にわたって一定の高さに保
持できる。その結果、プリント基板へのはんだの付着量
を一定に制御して、製品のはんだ接合部の品質を均一化
でき、はんだ接合部の品質に対する信頼性を高めること
ができる。また、はんだ付け作業の連続処理時間を長期
化させて生産性を高めることもできる。As described above, according to the present invention, when the liquid level of the molten solder in the solder bath drops below a predetermined height, a volume replenisher is introduced into the molten solder by the liquid level compensation device to increase the immersion volume. As a result, the solder liquid level in the solder bath is restored to a predetermined height, so that the solder liquid level in the solder bath is kept almost constant for a long period of time, and the solder jetted above the nozzle is reduced. The height of the jet liquid level,
That is, the jet height can be maintained at a constant height for a long period of time. As a result, the amount of solder adhered to the printed circuit board can be controlled to a constant level, and the quality of the solder joints of the product can be made uniform, and the reliability of the quality of the solder joints can be improved. Furthermore, productivity can be increased by lengthening the continuous processing time of soldering work.
第１図は本発明の一実施例に係る自動はんだ付け装置の
はんだ槽の概略縦断面図、第２図は自動はんだ付け装置
の一般的な構戒を示す側面図、第３図は従来のはんだ槽
の概略縦断面図である。
図中、
１・・・はんだ槽、 ２・・・はんだ、３・・
・ノズル、 ４・・・噴流液面、４ａ・・・
液面、 ５・・・プリント基板、６・・・液
面補償装置、 ２５・・・容積補充体。
１之栗の｛丁んｒ５不曹＾，Ｊｉｌｌ
第 ３ 図FIG. 1 is a schematic longitudinal sectional view of a soldering bath of an automatic soldering device according to an embodiment of the present invention, FIG. 2 is a side view showing the general configuration of an automatic soldering device, and FIG. FIG. 3 is a schematic vertical cross-sectional view of a solder bath. In the figure, 1...Solder bath, 2...Solder, 3...
・Nozzle, 4...jet liquid level, 4a...
Liquid level, 5... Printed circuit board, 6... Liquid level compensator, 25... Volume replenisher. 1 no chestnut {ding r5 unso ^, Jill Fig. 3
Claims (1)
ル（３）より噴流させ、その噴流液面（４）にプリント
基板（５）を浸漬してはんだ付けする自動はんだ付け装
置において、 はんだ槽（１）のはんだ（２）内に浸漬される容積補充
体（２５）と、 この容積補充体（２５）のはんだ（２）内に浸漬される
体積をはんだ付けにより消費されたはんだ（２）の体積
と等しくなるように制御してはんだ槽（１）内のはんだ
（２）の液面（４ａ）を一定に制御する液面補償装置（
６）とを設けたことを特徴とする自動はんだ付け装置。[Claims] [1] Solder (2) stored in a solder bath (1) is jetted from a nozzle (3), and a printed circuit board (5) is immersed in the jet liquid surface (4) for soldering. In an automatic soldering device, a volume replenishing body (25) is immersed in the solder (2) of the solder bath (1), and a volume of the volume replenishing body (25) to be immersed in the solder (2) is soldered. A liquid level compensator (4a) that controls the liquid level (4a) of the solder (2) in the solder bath (1) to be constant so that it is equal to the volume of the solder (2) consumed by soldering.
6) An automatic soldering device characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23091889A JPH0394975A (en) | 1989-09-05 | 1989-09-05 | Automatic soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23091889A JPH0394975A (en) | 1989-09-05 | 1989-09-05 | Automatic soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0394975A true JPH0394975A (en) | 1991-04-19 |
Family
ID=16915323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23091889A Pending JPH0394975A (en) | 1989-09-05 | 1989-09-05 | Automatic soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0394975A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0569124A (en) * | 1991-09-09 | 1993-03-23 | Tokyo Seisan Giken Kk | Solder tank device |
| JP2012213782A (en) * | 2011-03-31 | 2012-11-08 | Fujitsu Ten Ltd | Soldering device and automatic soldering device |
| JP2013240832A (en) * | 2013-07-25 | 2013-12-05 | Fujitsu Ten Ltd | Soldering device |
-
1989
- 1989-09-05 JP JP23091889A patent/JPH0394975A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0569124A (en) * | 1991-09-09 | 1993-03-23 | Tokyo Seisan Giken Kk | Solder tank device |
| JP2012213782A (en) * | 2011-03-31 | 2012-11-08 | Fujitsu Ten Ltd | Soldering device and automatic soldering device |
| JP2013240832A (en) * | 2013-07-25 | 2013-12-05 | Fujitsu Ten Ltd | Soldering device |
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