JPH0392051U - - Google Patents

Info

Publication number
JPH0392051U
JPH0392051U JP1989152868U JP15286889U JPH0392051U JP H0392051 U JPH0392051 U JP H0392051U JP 1989152868 U JP1989152868 U JP 1989152868U JP 15286889 U JP15286889 U JP 15286889U JP H0392051 U JPH0392051 U JP H0392051U
Authority
JP
Japan
Prior art keywords
diffusion plate
heat diffusion
bonded
adhesive
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989152868U
Other languages
English (en)
Japanese (ja)
Other versions
JP2509092Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989152868U priority Critical patent/JP2509092Y2/ja
Publication of JPH0392051U publication Critical patent/JPH0392051U/ja
Application granted granted Critical
Publication of JP2509092Y2 publication Critical patent/JP2509092Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W70/681—
    • H10W72/884—
    • H10W72/931—
    • H10W90/734—
    • H10W90/754—
JP1989152868U 1989-12-29 1989-12-29 半導体装置 Expired - Lifetime JP2509092Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989152868U JP2509092Y2 (ja) 1989-12-29 1989-12-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989152868U JP2509092Y2 (ja) 1989-12-29 1989-12-29 半導体装置

Publications (2)

Publication Number Publication Date
JPH0392051U true JPH0392051U (enExample) 1991-09-19
JP2509092Y2 JP2509092Y2 (ja) 1996-08-28

Family

ID=31699107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989152868U Expired - Lifetime JP2509092Y2 (ja) 1989-12-29 1989-12-29 半導体装置

Country Status (1)

Country Link
JP (1) JP2509092Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184351A (ja) * 2006-01-05 2007-07-19 Nec Electronics Corp 半導体装置及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3057986U (ja) * 1998-09-25 1999-06-08 モリト株式会社 スポーツ靴用靴底

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3057986U (ja) * 1998-09-25 1999-06-08 モリト株式会社 スポーツ靴用靴底

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184351A (ja) * 2006-01-05 2007-07-19 Nec Electronics Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2509092Y2 (ja) 1996-08-28

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term