JPH0392045U - - Google Patents
Info
- Publication number
- JPH0392045U JPH0392045U JP1990013052U JP1305290U JPH0392045U JP H0392045 U JPH0392045 U JP H0392045U JP 1990013052 U JP1990013052 U JP 1990013052U JP 1305290 U JP1305290 U JP 1305290U JP H0392045 U JPH0392045 U JP H0392045U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- sealing structure
- hollow covering
- structure according
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990013052U JPH0392045U (enExample) | 1989-10-31 | 1990-02-15 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12663789 | 1989-10-31 | ||
| JP1990013052U JPH0392045U (enExample) | 1989-10-31 | 1990-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392045U true JPH0392045U (enExample) | 1991-09-19 |
Family
ID=31889815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990013052U Pending JPH0392045U (enExample) | 1989-10-31 | 1990-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392045U (enExample) |
-
1990
- 1990-02-15 JP JP1990013052U patent/JPH0392045U/ja active Pending