JPH0392044U - - Google Patents
Info
- Publication number
- JPH0392044U JPH0392044U JP15257589U JP15257589U JPH0392044U JP H0392044 U JPH0392044 U JP H0392044U JP 15257589 U JP15257589 U JP 15257589U JP 15257589 U JP15257589 U JP 15257589U JP H0392044 U JPH0392044 U JP H0392044U
- Authority
- JP
- Japan
- Prior art keywords
- package
- base substrate
- bonded
- lid
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15257589U JPH0392044U (en, 2012) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15257589U JPH0392044U (en, 2012) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392044U true JPH0392044U (en, 2012) | 1991-09-19 |
Family
ID=31698830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15257589U Pending JPH0392044U (en, 2012) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392044U (en, 2012) |
-
1989
- 1989-12-29 JP JP15257589U patent/JPH0392044U/ja active Pending