JPH0392037U - - Google Patents

Info

Publication number
JPH0392037U
JPH0392037U JP15308689U JP15308689U JPH0392037U JP H0392037 U JPH0392037 U JP H0392037U JP 15308689 U JP15308689 U JP 15308689U JP 15308689 U JP15308689 U JP 15308689U JP H0392037 U JPH0392037 U JP H0392037U
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit element
mounting structure
electrically conductive
connection terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15308689U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15308689U priority Critical patent/JPH0392037U/ja
Publication of JPH0392037U publication Critical patent/JPH0392037U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Wire Bonding (AREA)
JP15308689U 1989-12-29 1989-12-29 Pending JPH0392037U (bs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15308689U JPH0392037U (bs) 1989-12-29 1989-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15308689U JPH0392037U (bs) 1989-12-29 1989-12-29

Publications (1)

Publication Number Publication Date
JPH0392037U true JPH0392037U (bs) 1991-09-19

Family

ID=31699312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15308689U Pending JPH0392037U (bs) 1989-12-29 1989-12-29

Country Status (1)

Country Link
JP (1) JPH0392037U (bs)

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