JPH0390474U - - Google Patents
Info
- Publication number
- JPH0390474U JPH0390474U JP15083289U JP15083289U JPH0390474U JP H0390474 U JPH0390474 U JP H0390474U JP 15083289 U JP15083289 U JP 15083289U JP 15083289 U JP15083289 U JP 15083289U JP H0390474 U JPH0390474 U JP H0390474U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder fillet
- chip
- soldering structure
- fillet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 5
- 230000000873 masking effect Effects 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15083289U JPH0749826Y2 (ja) | 1989-12-28 | 1989-12-28 | チップ部品の半田付構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15083289U JPH0749826Y2 (ja) | 1989-12-28 | 1989-12-28 | チップ部品の半田付構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0390474U true JPH0390474U (xx) | 1991-09-13 |
JPH0749826Y2 JPH0749826Y2 (ja) | 1995-11-13 |
Family
ID=31697164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15083289U Expired - Lifetime JPH0749826Y2 (ja) | 1989-12-28 | 1989-12-28 | チップ部品の半田付構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0749826Y2 (xx) |
-
1989
- 1989-12-28 JP JP15083289U patent/JPH0749826Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0749826Y2 (ja) | 1995-11-13 |