JPH0390364A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0390364A JPH0390364A JP22795589A JP22795589A JPH0390364A JP H0390364 A JPH0390364 A JP H0390364A JP 22795589 A JP22795589 A JP 22795589A JP 22795589 A JP22795589 A JP 22795589A JP H0390364 A JPH0390364 A JP H0390364A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- film
- thermal head
- platinum
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 125000002524 organometallic group Chemical group 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 14
- 239000010948 rhodium Substances 0.000 abstract description 11
- 238000009966 trimming Methods 0.000 abstract description 8
- 238000005530 etching Methods 0.000 abstract description 7
- 229910052703 rhodium Inorganic materials 0.000 abstract description 7
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 239000011521 glass Substances 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052797 bismuth Inorganic materials 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 239000000306 component Substances 0.000 abstract 3
- 238000010304 firing Methods 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ファクシミリやプリンターに搭載するサー
マルヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head installed in a facsimile or printer.
Ｌ従来の技術〕
第６図は、例えばＩＳＥＬＭ ’８８ＰＲＯＣ［ＤＩＮ
Ｇ８に発表されたｒ ｒｏｕｖＡｒｘｏＮｏｒ ｒａｘ
ＮｒｘＬｗ ＲｇｓｘｓｒＯＲＢ７ Ｕ８Ｋ ＯＬｉ’
ＭＩ’ｌ’ＡＬＬＯ−ＯＧＡＮＩＣＤＩＰ０８に’ｌ
’ＩＯＮＭＩＴＥＩＯＤ Ａ！ＩＤ Ｉ’ｒ８ ＡＰＰ
ＬＩＣＡＴＩＯＮ ｌ’ＯＲ’Ｉ’ＥＩＥＲ埴ＡＬ Ｐ
ＲＨｌＴ ＨＥｊＡＤ Ｊ のサーマルヘッドの断面図
であり、図にかいて、（１）は絶縁基板、（２）はこの
絶縁基板（１）上に形成されたグレーズ層、（３）は発
熱素子（４）は発熱素子（３〉に電流を供給する電極導
体、（５）は発熱素子（３）や電極導体（４）を保護す
る保護膜である。L Prior Art] FIG. 6 shows, for example, ISELM '88 PROC [DIN
r rouvArxoNor rax announced at G8
NrxLw RgsxsrORB7 U8K OLi'
MI'l'ALLO-OGANICDIP08'l
'IONMITEIOD A! ID I'r8 APP
LICATION l'OR'I'EIERHani AL P
This is a cross-sectional view of the thermal head of RHIT HEjAD J. In the figure, (1) is an insulating substrate, (2) is a glaze layer formed on this insulating substrate (1), and (3) is a heating element (4). ) is an electrode conductor that supplies current to the heating element (3), and (5) is a protective film that protects the heating element (3) and the electrode conductor (4).
第７図は上記第６図の発熱素子（３）や電極導体（４）
の構成を示す部分平面図であり、（４ａ）は共通電極、
（４ｂ）は個別電極である。Figure 7 shows the heating element (3) and electrode conductor (4) shown in Figure 6 above.
4a is a partial plan view showing the configuration of a common electrode,
(4b) is an individual electrode.
次に製法について第８図により説明する。第６図に示し
た絶縁基板（１）上に形成されたグレーズ層（２）表面
に、メタルオーガニック抵抗ペーストを所定域に印刷（
ア、抵抗体成膜）６００〜５ｏｏｃの温度で焼成する。Next, the manufacturing method will be explained with reference to FIG. A metal organic resistance paste is printed in a predetermined area on the surface of the glaze layer (2) formed on the insulating substrate (1) shown in Figure 6.
A. Resistor film formation) Baking at a temperature of 600 to 500°C.
（イ、抵抗体焼成）。次に所定の発熱素子（３）に形成
するため露光、現像、エツチングする、（つ、抵抗体エ
ツチング）。次にメタルオーガニック導体ペーストを所
定域に印刷し、（工、導体成膜）、６００〜８００℃の
温度で焼成する（オ、導体焼成）。次に所定の電極導体
（４）に形成するため、露光、現像、エツチングする、
（力、導体エツチング）。次に保護膜を形成するため、
所望のパターンで印刷し、（キ、保ｄ膜成膜）、６００
〜８００Ｃの温度で焼成する。（り、保護膜焼成）。(B. Firing the resistor). Next, exposure, development, and etching are performed to form a predetermined heating element (3) (resistor etching). Next, a metal organic conductor paste is printed in a predetermined area (E., conductor film formation), and fired at a temperature of 600 to 800° C. (E., conductor firing). Next, in order to form a predetermined electrode conductor (4), exposure, development, and etching are performed.
(force, conductor etching). Next, to form a protective film,
Print with desired pattern (ki, d retention film formation), 600
Calcinate at a temperature of ~800C. (i. Protective film firing).
以上のようにしてサーマルヘッドが作製されてぃる。The thermal head is manufactured as described above.
ここで従来の抵抗体の材料は上記ＸＳＨＭ ’８８ Ｐ
ＲＯＣＲＥＤＩＮＧ８に記載されているようにその組成
をＲｕ ：Ｓｉ ：Ｐｂ ：Ａｌ、 Ｉｒ：Ｓｉ ：Ｂ
ｉ：Ｚｒ、 Ｉｒ：８１ ：Ｂｉ：Ａｌ、 Ｉｒ：Ｓｉ
：Ｂｉ ：Ｃａ、 工ｒ： Ｓｉ ：Ｂｉ： Ｐｂ、
Ｒｈ ：８１８Ｂｉ等を主体としたメタルオーガニッ
ク抵抗ペーストが使用されている
次に動作について説明する。第６図、第７図にかいて、
共通電極（４ａ）に電圧を印加し、個別電極（４ｂ）を
スイッチングすることにより、発熱素子（３）に発生し
たジュール熱が、保護膜（５）上に接する感熱紙（図示
せず）に伝わり、感熱紙が発色して所望の記録がなされ
る。Here, the material of the conventional resistor is the above-mentioned XSHM '88 P.
Its composition is Ru:Si:Pb:Al, Ir:Si:B as described in ROCREDING8.
i:Zr, Ir:81:Bi:Al, Ir:Si
:Bi :Ca, Engineering: Si :Bi: Pb,
Rh: A metal organic resistance paste mainly composed of 818Bi or the like is used.Next, the operation will be explained. In Figures 6 and 7,
By applying a voltage to the common electrode (4a) and switching the individual electrodes (4b), the Joule heat generated in the heating element (3) is transferred to the thermal paper (not shown) in contact with the protective film (5). The heat is transmitted, the thermal paper develops color, and the desired recording is made.
従来のサーマルヘッドは以上のように抵抗体材料として
メタルオーガニック抵抗ペーストラ使用していたので、
以下の問題点があった。Conventional thermal heads used metal organic resistance pastera as the resistor material as described above.
There were the following problems.
１、発熱素子の膜厚が１μｍ以下が要求され、かつ材料
の組成上機械的に弱く、筐た熱応力によってもクラック
が発生しやすい。1. The film thickness of the heating element is required to be 1 μm or less, and the material is mechanically weak due to its composition, and cracks are likely to occur due to the thermal stress of the casing.
２、メタルオーガニック抵抗ペーストの有機金属成分の
金属間結合が連続しているので発熱素子形成後電圧印加
等のトリフグ法による抵抗値のバラツキの調整が不可能
である。2. Since the intermetallic bonds of the organometallic components of the metal-organic resistance paste are continuous, it is impossible to adjust the variation in resistance value by the trifrug method such as applying a voltage after forming the heating element.
この発明は上記のような問題点を解消するためになされ
たもので、発熱素子のクラックの発生の少く、かつ、完
成したサーマルヘッドの発熱素子の抵抗値のばらつきを
調整することが容易なサーマＮヘッドを得ることを目的
とする。This invention was made in order to solve the above-mentioned problems, and it is possible to provide a thermal head which is less prone to cracking of the heating element and which makes it easy to adjust the variation in the resistance value of the heating element of the completed thermal head. The purpose is to obtain N heads.
この発明に係るサーマルヘッドは、発熱素子の有機金属
成分の一部に白金（Ｐｔ）を含めたものである。The thermal head according to the present invention includes platinum (Pt) as part of the organic metal component of the heating element.
この発明にかけるサーマルヘッドは白金によりメタルオ
ーガニック抵抗体の連続膜が、しゃ断され、不連続の焼
成膜となるため、クラックの発生はなくなυ、かつ、不
運続映境界部のＭ−Ｉａ−υ（メタル−インシュレータ
ー−メタル）の絶ｍ効ｉを利用してパルストリミング等
の発熱素子の抵抗値の調整が容易にできる。In the thermal head according to the present invention, the continuous film of the metal-organic resistor is interrupted by platinum and becomes a discontinuous fired film, so there is no cracking υ, and M-Ia-υ at the unfavorable continuous film boundary. By utilizing the absolute m effect of (metal-insulator-metal), the resistance value of the heating element can be easily adjusted by pulse trimming or the like.
〔発明の実施例Ｊ
以下、この発明の一実施例を図について説明する。第１
図にかいて、（３１）は発熱素子、（４１）は電極導体
であ沙、（４１ａ）は共通電極、（４１ｂ）は個別電極
である。次に製法について説明する。第２図にかいて、
絶縁基板上に形成されたグレーズ層表面にメタルオーガ
ニック導体ペーストを印刷し電極導体（４１）ｌｉ２１
１１Ｌ（ア、導体酸Ｗ４）、次に６００〜８ｏＯ℃の温
度で焼成する（イ、導体焼成）。ついで所定の電極導体
（４１）に形成するため、露光、現像、エツチングを行
う（つ、導体エツチング）。次に後述する第１表の試料
Ｂで、有機金属成分に白金（Ｐｔ）とロジウム（Ｒｈ）
とを混合し、ガラス成分としてシリコン（Ｓｉ）、ビス
マス（Ｂ１）を含むメタルオーガニック抵抗ペーストを
所定域に印刷して発熱素子（３１）ｔ−成膜しく工、抵
抗体酸１１１）、次に６００〜８００℃の温度で焼成す
る（オ、抵抗体焼成）。ついで保護膜を形成するため、
所定のパターンで印刷し、（力、保護膜酸ｇＩ）、６０
０〜ＳＯＯ℃の温度で焼成する（キ、保護膜成膜）。[Embodiment J of the Invention An embodiment of the invention will be described below with reference to the drawings. 1st
In the figure, (31) is a heating element, (41) is an electrode conductor, (41a) is a common electrode, and (41b) is an individual electrode. Next, the manufacturing method will be explained. In Figure 2,
A metal organic conductor paste is printed on the surface of the glaze layer formed on the insulating substrate to form an electrode conductor (41) li21.
11L (A, conductor acid W4), and then fired at a temperature of 600 to 8oO°C (B, conductor firing). Next, in order to form a predetermined electrode conductor (41), exposure, development, and etching are performed (conductor etching). Next, in sample B in Table 1, which will be described later, platinum (Pt) and rhodium (Rh) were used as organic metal components.
A metal organic resistance paste containing silicon (Si) and bismuth (B1) as glass components is printed on a predetermined area to form a heat generating element (31). Fire at a temperature of 600 to 800°C (e. Resistor firing). Then, to form a protective film,
Print with a predetermined pattern, (force, protective film acid gI), 60
Baking is performed at a temperature of 0°C to SOO°C (ki, protective film formation).
その後、パルストリミング電圧を印加して発熱素子（３
１）の抵抗値を調整する（り、抵抗値調整）このように
作製されたサーマルヘッドの特性を第１表および第３図
、第４図により説明する。After that, a pulse trimming voltage is applied to the heating element (3
1) Adjusting the Resistance Value (Resistance Value Adjustment) The characteristics of the thermal head thus manufactured will be explained with reference to Table 1 and FIGS. 3 and 4.
第１表の試料Ｂは本発明による一実施例における発熱素
子（３１）の（メタルオーガニック抵抗ペースト）の組
成特性・性能を示す。尚試料Ａは従来の、試料Ｃは試料
ＡにＳｉフリットを加えたものである。Sample B in Table 1 shows the composition characteristics and performance of the (metal organic resistance paste) of the heating element (31) in one embodiment of the present invention. Note that sample A is a conventional sample, and sample C is the same as sample A with Si frit added.
第１表
第３図は発熱素子（３１）の抵抗値を共通電極と個別電
極間をブロービングして抵抗測定し、次に微少パルス電
圧を印加し、その電圧を順次上げて行くトリミング法に
よう、抵抗値は減少し、最後に増加に転することを示し
ている。本−実施例では１５ｇ６のトリム量が見込める
。Table 1 and Figure 3 show a trimming method in which the resistance value of the heating element (31) is measured by blowing between the common electrode and the individual electrodes, then a minute pulse voltage is applied, and the voltage is gradually increased. This shows that the resistance value decreases and finally turns to increase. In this example, a trim amount of 15g6 can be expected.
第４図は所望の抵抗値を得るために、抵抗体焼成の温度
範囲を変化させたものである。たとえば６０００の抵抗
値を必要とする場合は６００℃で焼成する。その後、第
３図に示すトリミング電圧を印加することにより、６０
０〜５１０Ωの範囲で抵抗値を調整することが可能であ
る。これはロジウム（Ｒｈ）に、白金（Ｐｔ）を混合す
ることにより、発熱素子（３１）の連続膜が白金膜によ
りしやへいされ、ロジウムと白金間との結合部（Ｍ−Ｉ
５１−Ｍ）にパルス電圧による電流バスが生じるためで
ある。第１表を更に詳しく説明すると本発明の一実施例
の試料Ｂと、白金を含まない試料Ａと、白金を含ませな
いが、不連続膜を発生させるために絶縁ガラスフリット
を混入させた試料Ｃとの性能の差異を示す。FIG. 4 shows the temperature range for firing the resistor element changed in order to obtain the desired resistance value. For example, if a resistance value of 6000 is required, firing is performed at 600°C. Thereafter, by applying the trimming voltage shown in FIG.
It is possible to adjust the resistance value in the range of 0 to 510Ω. By mixing platinum (Pt) with rhodium (Rh), the continuous film of the heating element (31) is suppressed by the platinum film, and the joint between rhodium and platinum (M-I
51-M), a current bus is generated due to the pulse voltage. To explain Table 1 in more detail, sample B is an example of the present invention, sample A does not contain platinum, and sample does not contain platinum but contains insulating glass frit to generate a discontinuous film. This shows the difference in performance from C.
試料Ａの場合、発熱素子の表面は光沢は有るがクラック
が生じやすい。トリム量は全くない。（第３図）。試料
Ｃの場合、クラックはないが、トリム量が、トリミング
電圧で安定しない。（第３図）。In the case of sample A, the surface of the heating element is glossy, but cracks are likely to occur. There is no amount of trim at all. (Figure 3). In the case of sample C, there are no cracks, but the amount of trimming is not stable depending on the trimming voltage. (Figure 3).
なか、試料Ｂ％Ｃで対クラック性が良いのは、試料Ｂで
はｐｔ （白金）が試料Ｃではガラスフリットノ
が微細クヲツクが大きなりラックに発達していくクラッ
ク伝播を阻止しているからである。Among them, the crack resistance of sample B%C is good because the PT (platinum) in sample B and the glass frit in sample C prevent crack propagation, which occurs when fine cracks become large and develop into racks. be.
なか上記実施例では、Ｒｈ（ロジウム）溶液とｐｔ （
白金）溶液とを混合、焼成して発熱素子（３１）の不連
続膜を形成したが、白金フリットとＴｈ（ロジウム）溶
液との混合でも、トリム量に関しては大差のないことを
実験で確めている。In the above example, Rh (rhodium) solution and pt (
A discontinuous film of the heating element (31) was formed by mixing and firing a platinum frit solution and a Th (rhodium) solution, but it was confirmed through experiments that there was no significant difference in the amount of trim even when a platinum frit was mixed with a Th (rhodium) solution. ing.
また、上記実施例では第１図に示した如く５くし形電極
の上部に発熱素子を形成したが、従来例である第７図の
構成であってもよい。Further, in the above embodiment, the heating element was formed on the top of the five-comb electrode as shown in FIG. 1, but the conventional structure shown in FIG. 7 may be used.
さらに、第５図に示すように発熱素子（３１）を共通電
極（４１ａ）の領域まで覆うように形成すると、発熱素
子（３１）の印刷領域が広くとることができ、発熱素子
（３１）のタテとヨコ（７））比が小さくなり、電極導
体やグレーズ層材質との熱膨張率が異っていても焼成時
のクラック発生は減少させることができる・なかまた、
上記実施例第１図および、第５図に示したものではくし
形電極の電極導体上部に発熱素子を形成したが、発熱素
子の上部に電極導体を形成してもよい。Furthermore, if the heating element (31) is formed so as to cover the area of the common electrode (41a) as shown in FIG. 5, the printing area of the heating element (31) can be widened, and The vertical-to-horizontal ratio (7) is small, and even if the coefficient of thermal expansion is different from that of the electrode conductor or glaze layer material, the occurrence of cracks during firing can be reduced.
In the embodiments shown in FIG. 1 and FIG. 5, the heating element is formed above the electrode conductor of the comb-shaped electrode, but the electrode conductor may be formed above the heating element.
（発明の効果］
以上のように、この発明によれば発熱素子の有機金１ｌ
ｌＥ戒分の一部に白金を混合させたので、発熱素子の表
面にクラックの発生がなく、また、発熱素子のトリミン
グが可能なので、発熱素子の個々の抵抗値のばらつきを
補正した精度の高い安定したサーマルヘッドが得られる
効果がある０(Effect of the invention) As described above, according to the present invention, the organic gold 1l of the heating element
Since platinum is mixed into a part of the precepts, there will be no cracks on the surface of the heating element, and the heating element can be trimmed, making it highly accurate to compensate for variations in the resistance values of individual heating elements. Effective in obtaining a stable thermal head0
第１図〜第４図はこの発明の一実施例の図で、第１図は
サーマルヘッドの発熱素子周辺の外観図、第２図はサー
マルヘッドの製法を示すフロー図、第３図はトリミング
電圧と抵抗値の変化率を示す図、第４図は焼成温度と抵
抗値の変化を示す図である。第５図はこの発明の他の一
実施例によるサーマルヘッドの発熱素子周辺の外観図、
第６図は従来のサーマルヘッドの断面図、第７図は従来
のサーマルヘッドの発熱素子周辺の外観図、第８図は従
来のサーマルヘッドの製法を示すフロー図である。
（３１）は発熱素子、（４１）は電極導体、（４１ａ
）は共通電極、（４１ｂ）は個別！極である。
なか、図中、同一符号は同一、又は相当部分を示す。Figures 1 to 4 are diagrams of an embodiment of the present invention. Figure 1 is an external view of the area around the heating element of the thermal head, Figure 2 is a flow diagram showing the manufacturing method of the thermal head, and Figure 3 is a trimming process. FIG. 4 is a diagram showing voltage and resistance change rate, and FIG. 4 is a diagram showing firing temperature and resistance value change. FIG. 5 is an external view of the vicinity of a heating element of a thermal head according to another embodiment of the present invention;
FIG. 6 is a sectional view of a conventional thermal head, FIG. 7 is an external view of the vicinity of a heating element of a conventional thermal head, and FIG. 8 is a flow diagram showing a method for manufacturing a conventional thermal head. (31) is a heating element, (41) is an electrode conductor, (41a
) is a common electrode, (41b) is an individual electrode! It is extreme. In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
供給する電極導体とが設けられ、上記発熱素子の有機金
属成分の一部に少くとも白金が含まれていることを特徴
とするサーマルヘッド。A thermal device comprising a heating element formed on a substrate and an electrode conductor for supplying current to the heating element, the heating element containing at least platinum as part of the organometallic component. head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22795589A JPH0390364A (en) | 1989-08-31 | 1989-08-31 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22795589A JPH0390364A (en) | 1989-08-31 | 1989-08-31 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390364A true JPH0390364A (en) | 1991-04-16 |
Family
ID=16868882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22795589A Pending JPH0390364A (en) | 1989-08-31 | 1989-08-31 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390364A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002067366A (en) * | 2000-09-01 | 2002-03-05 | Rohm Co Ltd | Heating resistor for thermal print head, thermal print head, and method of manufacturing the heating resistor |
| JP2007011458A (en) * | 2005-06-28 | 2007-01-18 | Nidec Sankyo Corp | Card reader |
-
1989
- 1989-08-31 JP JP22795589A patent/JPH0390364A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002067366A (en) * | 2000-09-01 | 2002-03-05 | Rohm Co Ltd | Heating resistor for thermal print head, thermal print head, and method of manufacturing the heating resistor |
| JP2007011458A (en) * | 2005-06-28 | 2007-01-18 | Nidec Sankyo Corp | Card reader |
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