JPH0389542A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To give sufficient strength to the lead terminal section of a hybrid integrated circuit and, at the same time, to obtain a tight sealing by firmly fixing the first and second supporting members united to structures to be fitted to recessed sections, and through holes formed in two substrates of the circuit and the two substrates at an interval. CONSTITUTION:This hybrid integrated circuit is composed of two substrates 1 and 2 respectively provided with recessed sections 11 and 12 formed at their end sections, the first and second supporting members 7 and 8 respectively provided with structures 17 and 18 to be fitted to the sections 11 and 12 and molded to one body so that the members 7 and 8 can support a plurality of lead terminals 9 and 10, and a casing member 15 which fixes the two substrates 1 and 2 at an interval and, at the same time, forms a sealed space between the substrates by covering the side faces of the space. The fitting structures 17 and 18 formed on the upper and lower surfaces of the members 7 and 8 can be fitted to the recessed sections 11 and 12 and structures 37 and 38 formed on the side faces can be fitted to the casing member 15. Therefore, the members 7 and 8 can be tied with the member 15 more firmly and, at the same time, entering of moisture etc., into the sealed space can be prevented perfectly, because the joining area increases.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to a lead terminal structure of a hybrid integrated circuit consisting of two hybrid integrated circuit boards.

(0) Prior Art A conventional hybrid integrated circuit will be explained with reference to FIGS. 5 and 6.

In the hybrid integrated circuit shown in FIG. 5, a conductive path (not shown) of a predetermined shape is formed on the surface of a ceramic substrate or an insulated metal substrate (51), and a plurality of circuit elements (not shown) are formed on the conductive path.
53) and a metal lead terminal (56) is fixed to a fixing pad (not shown) that is continuous with a predetermined conductive path to form a hybrid integrated circuit board, and this hybrid integrated circuit board is placed in a resin case. (52) by circuit element (53)
The lead terminals (56) are sealed tightly and filled with resin (59) to reinforce the fixed portions of the lead terminals (56).

With the increasing density of hybrid integrated circuits, a hybrid integrated circuit constructed from two hybrid integrated circuit boards (61) and (62) as shown in FIG. 6 has been proposed.

In the same figure, substrates (61) and (62) are insulated metal substrates in which one side of metal such as aluminum is coated with resin, and a conductive path (not shown) of a predetermined shape is formed on each substrate. A plurality of circuit elements (63) (64)
) is fixed. In addition, metal lead terminals (65) (66) for external connection are fixed to fixed pads (not shown) that are continuous with a predetermined conductive path, and 0 circuit elements and lead terminals are fixed to form a hybrid integration. The substrates (61) (62) on which circuits are formed are connected to respective circuit elements (63).
) (64) are fixed and integrally fixed to the case material (67) so as to face each other. In addition.

After adapting the vertical pitch Q of the lead terminals to the standardized pitch between electrodes of the socket, the lead terminals are spaced apart from the substrate by Qo at a predetermined portion, and take on an abbreviated shape.

Such a hybrid integrated circuit is attached to the main circuit board, or a socket (not shown) is inserted into the lead terminals (65) and (66) to connect it to an external circuit.

(c) Problems to be Solved by the Invention In conventional hybrid integrated circuits, prior to fixing the lead terminals, the vertical and horizontal positioning and tilt adjustment of the lead terminals are simultaneously performed to fix the fixed portion of the lead terminals. The assembly required a high degree of skill as it had to be aligned correctly with the conductive path.

Furthermore, the pitch between the electrodes in the vertical direction of the lead terminals often did not reach the designed value.

Furthermore, the fixed portions of the lead terminals are likely to peel off due to external force, and special care must be taken when handling the hybrid integrated circuit board immediately after the lead terminals are fixed.

(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes two hybrid integrated circuit boards having four parts or through holes formed at their ends, a fixing pad connection part, A structure that supports the lead-out portions of a plurality of lead terminals having a substantially crank shape, each consisting of a vertical spacing setting portion and a lead-out portion, at a predetermined interval, and a structure that fits into a recess or a through hole formed in a hybrid integrated circuit board. first and second supporting members integrally molded together, and a case that fixes the two hybrid integrated circuit boards at a predetermined distance and covers the sides thereof to form a sealed space between the two hybrid integrated circuit boards. material to solve the above problems.

(f) Function According to the present invention, the fitting structure formed on the support member is brought into contact with and fitted into the four parts or through-holes formed on the end of the hybrid integrated circuit board, so that the upper and lower, right and left sides of the lead terminal are Since positioning and tilt adjustment are completed, the work of fixing the lead terminals is simplified.

In addition, by fitting the support member, sufficient strength can be obtained in the lead terminal portion immediately after the lead terminal is fixed, and the contact area between the support member and the substrate is increased, so that sealing can be performed efficiently.

〈〈〉〉Example　The present invention will be explained in detail based on the example shown in Figs. 1 and 2 below.

First, referring to FIG. 1 for explaining the cross-sectional structure, the hybrid integrated circuit of the present invention has recesses (11) and (12) at the ends, respectively.
) are formed on two hybrid integrated circuit boards (1) (2)
(hereinafter simply referred to as the substrate) and a recessed portion (11) of the substrate.
) (12) and structures (17) and (18) that fit respectively.
are formed, and are integrally molded to support a plurality of lead terminals (9) and (10) at predetermined intervals, and two substrates (1) and (2). ) are spaced apart and fixed together, and the case material (
15). Note that the recesses (11) and (12) of the substrates (1) and (2) can be through holes,
The convex structures (17) and (18) of the support members (7) and (8) can be a stepped structure, or a structure in which the entire upper or lower surfaces of the support members (7) and (8) fit together. be.

Substrates (1) and (2) are made by forming a metal layer on a ceramic substrate or an insulating substrate with one side of a metal such as aluminum coated with a resin by vapor deposition, plating, or adhesion, and selectively etching this to form a conductive path ( 3) A fixing pad (13) formed from (4), in which a predetermined conductive path extends to the ends of the substrates (1) and (2) and connects the lead terminal.
(14) is formed simultaneously with the formation of this conductive path.

There are transistors, ICs, and LSIs on the conductive paths (3) and (4).
Alternatively, a plurality of circuit elements (5) and (6) such as chip resistors are fixed.

Next, the structure of the support members (7) and (8) will be explained in more detail with reference to FIG.

In the same figure, the fitting structures (17) and (18) formed on the upper and lower surfaces of the support members (7) and (8) respectively fit into the recesses (11 and 12) of the substrates (1 and 2), respectively. A fitting structure formed on the entire surface, a part of the surface, or dividedly on the surface is an essential structure for the present invention.

On the other hand, the structure (27) (28) of the surface opposite to this
) have a structure that fits with the corresponding surfaces of the other supporting members (8) and (7), and the side structures (37 and 38) have a structure that fits with the case material (15), and have a structure that fits with the corresponding surfaces of the other support members (8) and (7). Can be formed accordingly. However, when such a structure is adopted, the gap between the support members (7) and (8) and the support member (7
) (8) and the case material (15) becomes stronger and the joint area increases, which is expected to have the effect of more completely preventing moisture etc. from entering into the hybrid integrated circuit. Note that the stepped structures (47) and (48) become resin filling holes when the support members (7) and (8) are engaged.

The lead terminals (9) and (10) connect the lead terminals to the board (1).
Vertical spacing setting parts (19) and (20) are spaced apart from (2) by a predetermined length in the vertical direction, and fixing pads (1) of the substrates (1) and (2)
3) Connections (29) (30) soldered to (14)
, and lead-out portions (39) and (40), and has a substantially crank shape. Lead terminal shaped like this (9)
The illustrated supporting member structure in which the lead-out portions (39) and (40) of (10) are integrated at predetermined intervals can be easily obtained by a manufacturing method similar to molding of a lead frame in the manufacture of monolithic integrated circuits.

Referring again to FIG. 1, support members (7) and (8) are placed in the recesses (11) and (12) formed at the ends of the substrates (1) and (2).
When the convex structures (17) and (18) are brought into contact and fitted, the aforementioned connection parts (29) and (30) of all the lead terminals (9) and (10) are connected to the boards (1) and (2), respectively. Correctly abut against the fixing pads (13) and (14) with appropriate pressing force. This greatly simplifies the soldering work between the fixing pads (13, 14) and the connecting parts (29, 30), and provides a good connection without residual stress.

Thereafter, the substrates (1) and (2) are fixed to the resin case material (15) using an adhesive sheet or the like so that the respective circuit elements (5) and (6) face each other, and the step structure (47) is fixed to the resin case material (15). )
(48) from the resin filling hole formed by the lead terminal (
9) The space of the fixed part (10) is filled with resin to complete the hybrid integrated circuit. The completed hybrid integrated circuit is connected to an external circuit by inserting sockets (16) into lead terminals (9) and (10). At this time, as shown in FIG. 1, the end structures (21) (22) of the substrates (1) (2)
), the end of the case material (15) and the supporting members (7) (8
) to lead out the lead terminals (9) (10) (39) (
40) When a recess is formed nearby, the recess serves as a guide when inserting the socket, facilitating insertion of the socket (16) and preventing deformation of the lead terminals (9) and (10).

Next, a modification of the support member will be described with reference to FIGS. 3 and 4. Note that members having the same functions as those used in the previous embodiment are given the same reference numerals, and their explanations will be omitted.

As shown in FIGS. 3 and 4, tabs (57) and (58) are formed on the support members (7) and (8) of this example. Although some of them are omitted for convenience of drawing, The tabs (57) and (58) are formed to surround the four sides of the lead-out portions of the lead terminals (9) and (10), and the internal dimensions of the surrounding structure are approximately equal to the external dimensions of the socket H16). has been done.

The above support member structure makes it possible to set the spacing between the boards (1) and (2) without being restricted by the external dimensions of the socket socket (16), and also allows the adoption of a socket locking mechanism that utilizes the elasticity of resin. possible.

0) Effects of the Invention As described above, according to the present invention, the positioning of the lead terminals is completed when the support member is fitted to the substrate, so the work of soldering the lead terminals is extremely simplified.
A good connection with no residual stress can be obtained.

Further, since external force applied to the lead terminal is absorbed by the fitting portion of the support member, separation of the lead terminal connection portion is prevented.

Furthermore, by forming the socket surrounding structure on the support member, the socket is prevented from coming off, and the surrounding structure serves as a guide to facilitate insertion of the socket.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a cross-sectional view showing a hybrid integrated circuit of the present invention, FIG. 2 is a perspective view of the support member used in FIG. 1, and FIG. 3 is a cross-sectional view showing a modified example of the support member. 4 are perspective views of the support member used in FIG. 3, and FIGS. 5 and 6 are sectional views of conventional hybrid integrated circuits, respectively. (1)(2)...Hybrid integrated circuit board, (3)(4)
...Conducting path, (5) (6)...Circuit element, (
7) (8) Support member, (9) (10) Lead terminal, (15) Case material, (16) Socket.

Claims (5)

[Claims] (1) Two hybrid integrated circuit boards with recesses or through holes formed at their ends, and a plurality of lead terminal lead-out parts that have a substantially crank shape and are comprised of a fixed pad connection part, a vertical spacing setting part, and a lead-out part. first and second support members that are integrally molded with structures that support the hybrid integrated circuits at predetermined intervals and structures that fit into recesses or through holes formed in the hybrid integrated circuit board, respectively; 1. A hybrid integrated circuit comprising: a case material for fixing a board at a predetermined distance and covering the side surfaces of the board to form a sealed space between two hybrid integrated circuit boards. (2) The hybrid integrated circuit according to claim 1, wherein a fitting structure is formed on surfaces of the first and second support members that abut against each other. (3) A structure that fits into the case material is formed on the side surfaces of the first and second support members.
Hybrid integrated circuit as described. (4) The hybrid integrated circuit according to claim 1, wherein the socket insertion hole is formed by the hybrid integrated circuit board, the case material, and the support member. (5) The hybrid integrated circuit according to claim 1, wherein each support member is formed with a structure surrounding the lead-out portion of the lead terminal.