JPH0389359A - Functional toner for circuit wiring and production thereof - Google Patents
Functional toner for circuit wiring and production thereofInfo
- Publication number
- JPH0389359A JPH0389359A JP1226777A JP22677789A JPH0389359A JP H0389359 A JPH0389359 A JP H0389359A JP 1226777 A JP1226777 A JP 1226777A JP 22677789 A JP22677789 A JP 22677789A JP H0389359 A JPH0389359 A JP H0389359A
- Authority
- JP
- Japan
- Prior art keywords
- toner
- circuit wiring
- wiring patterns
- metallic particles
- binder resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 12
- 239000011230 binding agent Substances 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims description 17
- 239000002923 metal particle Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 3
- 238000010298 pulverizing process Methods 0.000 claims 2
- 238000004898 kneading Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 22
- 238000007639 printing Methods 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 6
- 238000007650 screen-printing Methods 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 239000010931 gold Substances 0.000 abstract description 3
- 229910052763 palladium Inorganic materials 0.000 abstract description 3
- 238000005245 sintering Methods 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229910052697 platinum Inorganic materials 0.000 abstract description 2
- 239000013528 metallic particle Substances 0.000 abstract 3
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920005792 styrene-acrylic resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は電子回路配線パターンを電子写真技術により形
成するための静電荷現像用トナーおよびその製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electrostatic charge developing toner for forming an electronic circuit wiring pattern by electrophotography and a method for producing the same.
(従来の技術)
半導体工業の飛躍的な進展に伴ってIC,LSIが幅広
く使用されるようになってきた。これらのIC。(Prior Art) With the dramatic progress of the semiconductor industry, ICs and LSIs have come into wide use. These ICs.
LSIを実装するためには回路パターンが形成されたセ
ラミック基板やプリント基板を用いている。セラミック
基板の回路パターン形成方法としては例えばアルミナ焼
成基板上にスクリーン印刷法により導体ペーストを印刷
、約850°C程度の温度で熱処理することにより得ら
れる。ここでは印刷の際回路パターンに対応したスクリ
ーンマスクを使用しなければならない。Ceramic substrates or printed circuit boards on which circuit patterns are formed are used to mount LSIs. A method for forming a circuit pattern on a ceramic substrate is, for example, printing a conductive paste on a fired alumina substrate by screen printing and heat-treating it at a temperature of about 850°C. Here, a screen mask corresponding to the circuit pattern must be used during printing.
プリント基板では銅箔にレジストを塗布しマスクをかけ
て露光、現像して回路パターン以外をエツチングし形成
する。For printed circuit boards, resist is applied to copper foil, exposed to light using a mask, and developed to etch everything other than the circuit pattern.
以上の方法においては、回路パターンを形成する材料と
しては導電性金属粒子とバインダー及び有機溶剤からな
る有機ビヒクルを混合した導体ペーストを用いるか又は
銅箔を用いている。In the above method, as the material for forming the circuit pattern, a conductive paste containing a mixture of conductive metal particles, a binder, and an organic vehicle consisting of an organic solvent is used, or copper foil is used.
一方従来の電子写真用トナー技術を次に示す。On the other hand, the conventional electrophotographic toner technology is shown below.
電気的潜像の形成法は、通常光伝導体層を帯電させた後
、原稿に基づいた光像を照射し、光照射部分の静電荷を
減少または消滅させて静電潜像を形成する。次いでこの
潜像をトナーと呼ばれる現像剤で現像する。乾式現像法
に関しては、一般に現像剤の構成に基づいて、−成分現
像法と二成分現像法の2種類に分類できる。−成分現像
法は、画像形成を基本的にトナー粒子のみで行うもので
あり、また二成分現像法とはキャリアとトナーからなる
現像剤を用いて画像形成を行うものである。The method for forming an electric latent image is usually to charge a photoconductor layer and then irradiate it with a light image based on an original, thereby reducing or eliminating the electrostatic charge in the light-irradiated area to form an electrostatic latent image. This latent image is then developed with a developer called toner. Dry development methods can generally be classified into two types based on the composition of the developer: -component development methods and two-component development methods. - The component development method basically forms an image using only toner particles, and the two-component development method uses a developer consisting of a carrier and toner to form an image.
二成分現像法におけるトナーは通常バインダー樹脂、着
色剤等から戒っている。The toner used in the two-component development method is usually limited to binder resin, colorant, etc.
(発明が解決しようとする問題点)
従来の回路配線パターンを変更するには、露光用マスク
やスクリーンマスクの取り替えが必要になることはもち
ろん、スクリーン印刷法の場合は、印刷中に目詰まりが
発生したり印刷機の条件設定やペースト粘度の調整など
が極めて困難であるという欠点があった。一方プリント
基板ではプロセスが複雑で長い製造時間を要し、製造コ
ストも高くなる欠点があった。(Problems to be Solved by the Invention) Changing the conventional circuit wiring pattern requires replacing the exposure mask and screen mask, and in the case of screen printing, clogging occurs during printing. There have been disadvantages in that it is extremely difficult to set printing machine conditions and adjust paste viscosity. Printed circuit boards, on the other hand, have the drawbacks of complex processes, long manufacturing times, and high manufacturing costs.
そこで電子写真技術を利用した断回路パターン形成方法
を開発するに至ったが、従来の静電荷現像用トナー組成
分は導電性金属材料を全く含んでおらず電子回路を形成
することは不可能であった。Therefore, we developed a method for forming disconnection patterns using electrophotographic technology, but conventional toner compositions for electrostatic charge development do not contain any conductive metal materials and are impossible to form electronic circuits. there were.
(問題点を解決するための手段)
本発明を上述した従来技術の欠点を除去し、エツチング
等の科学的な処理が不用でしかもスクリーン印刷機に使
用するパターンマスクも、ペーストも使用しない、導体
パターンの偏光にマスクレスで対処できる回路配線パタ
ーンを形成できる機能性トナー組成物および製造方法を
提供することにある。(Means for Solving the Problems) The present invention eliminates the drawbacks of the prior art described above, and provides a conductor that does not require scientific treatments such as etching, and does not use pattern masks or pastes used in screen printing machines. It is an object of the present invention to provide a functional toner composition and a manufacturing method that can form a circuit wiring pattern that can cope with the polarization of the pattern without a mask.
本発明は、電子写真技術により回路配線パターンを形成
するトナーにおいても、少なくともバインダー樹脂およ
び金、銀、パラジウム、白金、銅、ニッケルの単体もし
くは2種以上がら選ばれた混合物の導電性金属粒子から
なる平均粒径1011m以下の機能性トナーである。The present invention also provides a toner for forming a circuit wiring pattern using electrophotographic technology, which is made of at least a binder resin and conductive metal particles of gold, silver, palladium, platinum, copper, and nickel alone or in a mixture of two or more of them. This is a functional toner with an average particle diameter of 1011 m or less.
また、該機能性トナーの製造においてバインダー樹脂お
よび導電性金属粒子を加熱混練し、その後混合物を粗粉
砕および微粉砕し、該微粉粒子を分級する工程である。Further, in the production of the functional toner, the binder resin and the conductive metal particles are heated and kneaded, the mixture is then coarsely pulverized and finely pulverized, and the fine powder particles are classified.
(作用)
本発明は、静電荷現像用トナーの組成として導電性金属
粒子を含んでいるため電子写真技術を用いた回路配線パ
ターンをセラミック基板およびセラミック粉末からなる
グリーンシート上に形成したのち、焼結工程を経ること
により電子回路配線が形成することができる。(Function) Since the composition of the toner for electrostatic charge development includes conductive metal particles, the present invention uses electrophotographic technology to form a circuit wiring pattern on a ceramic substrate and a green sheet made of ceramic powder, and then bakes it. Electronic circuit wiring can be formed through the bonding process.
更に電子写真技術を利用することに露光用マスクやスク
リーンマスクが不必要であるばかりでなく、スクリーン
印刷法の場合の印刷中の目詰まりや印刷機の諸条件、ペ
ースト粘度調整等のわずられしさが解消できる。またプ
リント基板のようなエツチング等の面倒で時間を要する
化学的処理プロセスがなく、コスト的にも有利である。Furthermore, using electrophotographic technology not only eliminates the need for exposure masks and screen masks, but also prevents problems such as clogging during printing, printing machine conditions, paste viscosity adjustment, etc. in the case of screen printing. The discomfort can be resolved. Furthermore, unlike printed circuit boards, there is no cumbersome and time-consuming chemical treatment process such as etching, which is advantageous in terms of cost.
また、回路パターンの形成も電気的信号を直接電子写真
する方法を採用することにより、コンピュータによるグ
ラフィック表示するパターン形成が可能となり、CAD
システムによる導体回路パターンの設計、変更が極めて
容易になる。In addition, by adopting a method of directly electrophotographing electrical signals to form circuit patterns, it becomes possible to form patterns that are displayed graphically on a computer, and CAD
Designing and changing conductor circuit patterns using the system becomes extremely easy.
したがって多種類の配線パターンの設計から製造まで一
貫したマスクを用いない自動製造ラインの実現が可能と
なる。Therefore, it is possible to realize an automatic manufacturing line that does not use a mask and is consistent from designing to manufacturing many types of wiring patterns.
(実施例1)
以下に本発明を実施例により説明するが、もちろん本発
明はこれらの例によって限定されるものではない。(Example 1) The present invention will be explained below with reference to Examples, but of course the present invention is not limited to these Examples.
ポリエステル樹脂 50重量部
銀粒子 47重量部
ガラスフリット 3重量部
を100’C以上の温度で溶融混練し、冷却後粗粉砕し
1mm以下の粒子による。該粉砕をジェットミルにより
微粉砕化し15pm以下の微粒子を作成する。次に分級
により下カットをし211m以下を除去した。したがっ
て2pm〜15pm、平均粒径7.3pmのトナー粒子
を得た。該トナー粒子を一次粒子に分散した状態で吹き
込み、トナーと熱風がぶつかる箇所で温度約200°C
になるように調整した熱風にあてて、球形の微粉トナー
とした。この球形化処理された微粉トナーとシリカ微粉
末1重量部混合付着させてトナーとした。Polyester resin 50 parts by weight Silver particles 47 parts by weight Glass frit 3 parts by weight are melt-kneaded at a temperature of 100'C or more, cooled and coarsely ground to form particles of 1 mm or less. The pulverized material is pulverized by a jet mill to create fine particles of 15 pm or less. Next, a lower cut was made by classification to remove 211 m or less. Therefore, toner particles having a particle size of 2 pm to 15 pm and an average particle size of 7.3 pm were obtained. The toner particles are blown in a state where they are dispersed into primary particles, and the temperature is about 200°C at the point where the toner and hot air collide.
The particles were exposed to hot air adjusted to give a spherical fine powder toner. This spheroidized fine powder toner and 1 part by weight of fine silica powder were mixed and deposited to form a toner.
該トナーを電子写真方式によりアルミナ基板上に配線パ
ターンを形成し、900℃の温度で酸化性雰囲気中で坑
底した。A wiring pattern was formed on an alumina substrate using the toner using an electrophotographic method, and the resulting toner was placed at the bottom of a hole in an oxidizing atmosphere at a temperature of 900°C.
(実施例2)
ポリエステル樹脂 55重量部
銀 40重量部
パラジウム 4重量部
帯電制御剤 1重量部
をローター回転型混練機で110°C110分間溶融混
練し、冷却後せん新式粉砕造粒機により粗粉砕する。次
にジェットミルにより微分化し、気流分級機により平均
粒径6.011mの分級粉体を得た。該粉体を実施例1
と同様の方法により熱風にて球形化処理し、シリカ粉末
1重量部混合付着させてトナーとした。(Example 2) Polyester resin 55 parts by weight Silver 40 parts by weight Palladium 4 parts by weight 1 part by weight of charge control agent was melt-kneaded at 110°C for 110 minutes in a rotor-rotating kneader, and after cooling, coarsely pulverized by a new type pulverizer and granulator. do. Next, it was finely divided using a jet mill, and a classified powder having an average particle size of 6.011 m was obtained using an air classifier. The powder was prepared in Example 1.
The mixture was spheroidized using hot air in the same manner as described above, and 1 part by weight of silica powder was mixed and deposited to obtain a toner.
該トナーを電子写真方式によりセラミックグリーンシー
ト上に配線パターンを形成し、複数のシートを110’
C1150kg/cm2の条件で熱プレスし積層体を得
た。次にグリーンシートに含まれている樹脂部を除去す
る熱処理工程後920’Cで焼結し多層セラミック配線
基板を作製した。A wiring pattern is formed on a ceramic green sheet using the toner using an electrophotographic method, and a plurality of sheets are stacked at 110'.
A laminate was obtained by hot pressing under the condition of C1150 kg/cm2. Next, after a heat treatment step to remove the resin portion contained in the green sheet, the green sheet was sintered at 920'C to produce a multilayer ceramic wiring board.
ここで用いたグリーンシートはアルミナ55重量部、ホ
ウケイ酸鉛系ガラス45重量部の組成をもつ混合粉末を
用いた。シート厚みは約1100pであった。The green sheet used here was a mixed powder having a composition of 55 parts by weight of alumina and 45 parts by weight of lead borosilicate glass. The sheet thickness was approximately 1100p.
(実施例3)
スチレンアクリル系樹脂 40重量部
金 59重量部
帯電制御剤 1重量部
ローター回転型混練機で130°C15分間溶融し、冷
却後、粗粉砕し更にジェットミルにより15pm以下に
微粉化した。次に気流分級機により平均粒径5.2重m
で211m〜15¥1mの範囲にした。該粉体を実施例
1と同様の方法で球形化処理およびシリカ処理した。(Example 3) Styrene acrylic resin 40 parts by weight Gold 59 parts by weight Charge control agent 1 part by weight Melt at 130°C for 15 minutes in a rotor kneader, cool, coarsely pulverize, and further finely powder to 15 pm or less using a jet mill. did. Next, the average particle size was 5.2 m by an air classifier.
The range was set to 211m to 15 yen 1m. The powder was spheronized and treated with silica in the same manner as in Example 1.
(実施例4)
ポリエステル樹脂 50重量部
銅 47重量部
帯電制御剤 1重量部
ガラスフリット 2重量部
を100°C115分間溶融混練し、冷却後粗粉砕、微
粉砕を経て分級し平均粒径4.511mで2重m〜12
11mの範囲にした。(Example 4) Polyester resin 50 parts by weight Copper 47 parts by weight Charge control agent 1 part by weight Glass frit 2 parts by weight were melt-kneaded at 100°C for 115 minutes, cooled, coarsely pulverized, finely pulverized, and classified to obtain an average particle size of 4. 511m and double m~12
The range was 11m.
次に熱風による球形化処理およびシリカ0.8重量部混
合しトナーを得た。Next, the mixture was spheronized with hot air and 0.8 parts by weight of silica was mixed to obtain a toner.
該トナーを電子写真方式によりアルミナ基板上に配線パ
ターンを形成し中性雰囲気中で850°Cの温度で坑底
した。A wiring pattern was formed on an alumina substrate using the toner by electrophotography, and the wiring pattern was placed at the bottom of a hole at a temperature of 850° C. in a neutral atmosphere.
本発明は、トナー粒子中に導電性金属材料を含んでいる
ため電子写真記述によりセラミック基板やグリーンシー
ト上に配線パターンを形成でき、更に焼結させることに
より電子回路を形成することができた。In the present invention, since the toner particles contain a conductive metal material, a wiring pattern can be formed on a ceramic substrate or a green sheet by electrophotographic description, and an electronic circuit can be formed by further sintering.
ただし平均粒径が10pmを越える場合、トナー粒子が
大きくなることにより焼結時に導電性金属粒子どうしが
接触しなくなり、配線の導通がえられないか又は配線抵
抗が高くなるため実用的でない。However, if the average particle size exceeds 10 pm, the toner particles become so large that the conductive metal particles do not come into contact with each other during sintering, and it is not practical because the conductivity of the wiring cannot be obtained or the wiring resistance becomes high.
(発明の効果)
本方法を採用することにより露光用マスクやスクリーン
マスクが不必要であるばかりでなく、スクリーン印刷法
の場合の印刷中の目詰まりの心配はなく更に印刷機の諸
条件の設定、ペーストの粘度調整などが必要なくなる。(Effects of the invention) By adopting this method, not only is an exposure mask and a screen mask unnecessary, but there is no need to worry about clogging during printing, which is the case with the screen printing method. , there is no need to adjust the viscosity of the paste.
またプリント基板のようなエツチング等の面倒で時間を
要する化学的処理プロセスがなく、コスト的にも有利で
ある。Further, unlike printed circuit boards, there is no need for troublesome and time-consuming chemical treatment processes such as etching, which is advantageous in terms of cost.
また回路パターンの形成も電気的信号を直接電子写真印
刷する方法を採用することにより、コンピュータによる
グラフィック表示のパターン形成が可能となり、CAD
システムによる導体回路パターンの設計・変更が極めて
容易になる。In addition, by adopting a method of directly electrophotographically printing electrical signals to form circuit patterns, it becomes possible to form graphic display patterns using a computer, and CAD
Designing and changing conductor circuit patterns using the system becomes extremely easy.
Claims (2)
トナーにおいて、バインダー樹脂と導電性金属粒子を含
むことを特徴とする回路配線用機能性トナー。(1) A functional toner for circuit wiring, which is a toner for forming a circuit wiring pattern by electrophotography, and is characterized by containing a binder resin and conductive metal particles.
し複合混合物を形成する工程と、該複合混合物を粗粉砕
する工程と更に微粉砕する工程と該微粉粒子を分級する
工程を有することを特徴とする回線配線用機能性トナー
の製造方法。(2) It is characterized by comprising a step of heating and kneading a binder resin and conductive metal particles to form a composite mixture, a step of coarsely pulverizing the composite mixture, a step of further pulverizing the composite mixture, and a step of classifying the fine powder particles. A method for producing a functional toner for line wiring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1226777A JPH0389359A (en) | 1989-09-01 | 1989-09-01 | Functional toner for circuit wiring and production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1226777A JPH0389359A (en) | 1989-09-01 | 1989-09-01 | Functional toner for circuit wiring and production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0389359A true JPH0389359A (en) | 1991-04-15 |
Family
ID=16850448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1226777A Pending JPH0389359A (en) | 1989-09-01 | 1989-09-01 | Functional toner for circuit wiring and production thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0389359A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6214508B1 (en) * | 1998-03-03 | 2001-04-10 | Murata Manufacturing Co., Ltd. | Circuit-forming charging powder and multilayer wiring board using the same |
US20110017834A1 (en) * | 2007-12-22 | 2011-01-27 | Detlef Schulze-Hagenest | Method for producing an antenna structure for an rfid device, and dry toner for use in producing such antenna structure |
US7939171B2 (en) | 2003-12-26 | 2011-05-10 | Kabushiki Kaisha Toshiba | Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54126959A (en) * | 1978-03-25 | 1979-10-02 | Nippon Mektron Kk | Method of producing circuit board |
JPS59123848A (en) * | 1982-12-29 | 1984-07-17 | Matsushita Electric Ind Co Ltd | Developer for printing wiring board |
JPS59150493A (en) * | 1983-02-16 | 1984-08-28 | 松下電器産業株式会社 | Method of forming circuit pattern of circuit board |
JPS6388893A (en) * | 1986-10-02 | 1988-04-19 | 三洋電機株式会社 | Manufacture of flexible printed substrate |
-
1989
- 1989-09-01 JP JP1226777A patent/JPH0389359A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54126959A (en) * | 1978-03-25 | 1979-10-02 | Nippon Mektron Kk | Method of producing circuit board |
JPS59123848A (en) * | 1982-12-29 | 1984-07-17 | Matsushita Electric Ind Co Ltd | Developer for printing wiring board |
JPS59150493A (en) * | 1983-02-16 | 1984-08-28 | 松下電器産業株式会社 | Method of forming circuit pattern of circuit board |
JPS6388893A (en) * | 1986-10-02 | 1988-04-19 | 三洋電機株式会社 | Manufacture of flexible printed substrate |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6214508B1 (en) * | 1998-03-03 | 2001-04-10 | Murata Manufacturing Co., Ltd. | Circuit-forming charging powder and multilayer wiring board using the same |
US7939171B2 (en) | 2003-12-26 | 2011-05-10 | Kabushiki Kaisha Toshiba | Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit |
US20110017834A1 (en) * | 2007-12-22 | 2011-01-27 | Detlef Schulze-Hagenest | Method for producing an antenna structure for an rfid device, and dry toner for use in producing such antenna structure |
US8758969B2 (en) * | 2007-12-22 | 2014-06-24 | Eastman Kodak Company | Method for producing an antenna structure for an RFID device, and dry toner for use in producing such antenna structure |
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