JPH0388353U - - Google Patents
Info
- Publication number
- JPH0388353U JPH0388353U JP1989150386U JP15038689U JPH0388353U JP H0388353 U JPH0388353 U JP H0388353U JP 1989150386 U JP1989150386 U JP 1989150386U JP 15038689 U JP15038689 U JP 15038689U JP H0388353 U JPH0388353 U JP H0388353U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- whose surface
- module substrate
- nickel
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989150386U JPH0388353U (enExample) | 1989-12-26 | 1989-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989150386U JPH0388353U (enExample) | 1989-12-26 | 1989-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388353U true JPH0388353U (enExample) | 1991-09-10 |
Family
ID=31696736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989150386U Pending JPH0388353U (enExample) | 1989-12-26 | 1989-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388353U (enExample) |
-
1989
- 1989-12-26 JP JP1989150386U patent/JPH0388353U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2527828B2 (ja) | 半導体パッケ―ジ | |
| JPH0388353U (enExample) | ||
| CA2251875A1 (en) | Aluminum nitride heater | |
| JPH0388354U (enExample) | ||
| JP2000128654A5 (enExample) | ||
| JPH0199904U (enExample) | ||
| JPH0377440U (enExample) | ||
| JPS6364048U (enExample) | ||
| JPS641268A (en) | Ceramic circuit substrate | |
| JP2002094192A (ja) | 回路基板の冷却構造 | |
| JPS6420727U (enExample) | ||
| JPS5991404U (ja) | セラミツクを用いたロツカ−ア−ム | |
| JPH0325247U (enExample) | ||
| HELLMANN | SURFACE CRYSTALLIZATION ON METALLIZED 94% ALUMINA CERAMICS | |
| JPH0230123U (enExample) | ||
| JPH0367444U (enExample) | ||
| JPS61292942A (ja) | 半導体用基板 | |
| JPH02111538U (enExample) | ||
| JPS63185595U (enExample) | ||
| JPS6375044U (enExample) | ||
| JPS6453748U (enExample) | ||
| JPS6311166U (enExample) | ||
| JPH0338653U (enExample) | ||
| JPH04331781A (ja) | セラミックス複合体 | |
| JPH03122549U (enExample) |