JPH0388174U - - Google Patents
Info
- Publication number
- JPH0388174U JPH0388174U JP15030489U JP15030489U JPH0388174U JP H0388174 U JPH0388174 U JP H0388174U JP 15030489 U JP15030489 U JP 15030489U JP 15030489 U JP15030489 U JP 15030489U JP H0388174 U JPH0388174 U JP H0388174U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- holding plate
- press plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15030489U JPH0388174U (no) | 1989-12-27 | 1989-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15030489U JPH0388174U (no) | 1989-12-27 | 1989-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388174U true JPH0388174U (no) | 1991-09-09 |
Family
ID=31696656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15030489U Pending JPH0388174U (no) | 1989-12-27 | 1989-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388174U (no) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010237061A (ja) * | 2009-03-31 | 2010-10-21 | Tdk Corp | 基板保持具、電子部品検査装置及び電子部品検査方法 |
| KR101943750B1 (ko) * | 2017-09-14 | 2019-01-30 | 매그나칩 반도체 유한회사 | 플렉서블 반도체 칩 패키지의 벤딩 테스트 소켓 및 이를 이용한 벤딩 테스트 방법 |
-
1989
- 1989-12-27 JP JP15030489U patent/JPH0388174U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010237061A (ja) * | 2009-03-31 | 2010-10-21 | Tdk Corp | 基板保持具、電子部品検査装置及び電子部品検査方法 |
| KR101943750B1 (ko) * | 2017-09-14 | 2019-01-30 | 매그나칩 반도체 유한회사 | 플렉서블 반도체 칩 패키지의 벤딩 테스트 소켓 및 이를 이용한 벤딩 테스트 방법 |
| US10705116B2 (en) | 2017-09-14 | 2020-07-07 | Magnachip Semiconductor, Ltd. | Test socket of flexible semiconductor chip package and bending test method using the same |