JPH0383991U - - Google Patents

Info

Publication number
JPH0383991U
JPH0383991U JP14613489U JP14613489U JPH0383991U JP H0383991 U JPH0383991 U JP H0383991U JP 14613489 U JP14613489 U JP 14613489U JP 14613489 U JP14613489 U JP 14613489U JP H0383991 U JPH0383991 U JP H0383991U
Authority
JP
Japan
Prior art keywords
chassis
cooling structure
thermal bath
cooling
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14613489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14613489U priority Critical patent/JPH0383991U/ja
Publication of JPH0383991U publication Critical patent/JPH0383991U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例による冷却構造を
示す断面図、第2図は従来の冷却構造を示す断面
図である。 図において、1……電子部品、1a……リード
、2……基板、3……サーマルバス、4……シヤ
ーシ、4a……台座、5……ネジ、6……ネジで
ある。なお、図中、同一符号は同一、又は相当部
分を示す。
FIG. 1 is a sectional view showing a cooling structure according to an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional cooling structure. In the figure, 1... electronic component, 1a... lead, 2... board, 3... thermal bus, 4... chassis, 4a... pedestal, 5... screw, 6... screw. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上の電子部品等の冷却に用いられるサーマ
ルバスとシヤーシとを結合して成る冷却構造にお
いて、シヤーシに設けられた台座にサーマルバス
を結合したことを特徴とする冷却構造。
A cooling structure comprising a chassis and a thermal bath used for cooling electronic components on a board, the cooling structure being characterized in that the thermal bath is coupled to a pedestal provided on the chassis.
JP14613489U 1989-12-18 1989-12-18 Pending JPH0383991U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14613489U JPH0383991U (en) 1989-12-18 1989-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14613489U JPH0383991U (en) 1989-12-18 1989-12-18

Publications (1)

Publication Number Publication Date
JPH0383991U true JPH0383991U (en) 1991-08-26

Family

ID=31692740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14613489U Pending JPH0383991U (en) 1989-12-18 1989-12-18

Country Status (1)

Country Link
JP (1) JPH0383991U (en)

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