JPH0383390A - Low dielectric circuit board - Google Patents
Low dielectric circuit boardInfo
- Publication number
- JPH0383390A JPH0383390A JP22104489A JP22104489A JPH0383390A JP H0383390 A JPH0383390 A JP H0383390A JP 22104489 A JP22104489 A JP 22104489A JP 22104489 A JP22104489 A JP 22104489A JP H0383390 A JPH0383390 A JP H0383390A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- fluororesin
- cloth material
- low dielectric
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004744 fabric Substances 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 31
- 239000003989 dielectric material Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000002759 woven fabric Substances 0.000 abstract description 11
- 229920001577 copolymer Polymers 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- -1 polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer Polymers 0.000 abstract description 2
- 239000013032 Hydrocarbon resin Substances 0.000 abstract 3
- 229920006270 hydrocarbon resin Polymers 0.000 abstract 3
- 238000005470 impregnation Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 description 8
- 239000011888 foil Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- LVGKZTVMAHRVFR-UHFFFAOYSA-N 4-(phenoxazine-10-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=CC=C2OC2=CC=CC=C21 LVGKZTVMAHRVFR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明Ｆ′ｉ電子機器、コンピュータ等の高周波域にも
適用可能な低誘電率回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a low dielectric constant circuit board that can be applied to high frequency ranges such as F'i electronic equipment and computers.
（従来の技術）
回路基板としては、フッ素樹脂を含浸せしめたガラス布
の表面に、フッ素樹脂フィルムを介して金属箔を接合せ
しめたものが知られている。(Prior Art) As a circuit board, one in which a metal foil is bonded to the surface of a glass cloth impregnated with a fluororesin via a fluororesin film is known.
この回路基板は熱膨張率が高い場合があり、防用環境の
温度変化に対応して膨張・収縮現象を生じ、そのため高
周波特性が変動し易く、高周波域への適用には懸念があ
った。This circuit board sometimes has a high coefficient of thermal expansion, causing expansion and contraction phenomena in response to temperature changes in the protective environment, and as a result, its high-frequency characteristics tend to fluctuate, creating concerns about its application to high-frequency ranges.
（発明が解決しようとする課題）
一方、近年、フッ素樹脂を含浸せしめた芳香族ポリアミ
ド繊維布の表面に、フッ素樹脂フィルムを介して金属箔
を接合せしめた回路基板も提案されている（特開昭６３
−２９０７３５号公報）。(Problem to be Solved by the Invention) On the other hand, in recent years, a circuit board in which metal foil is bonded to the surface of an aromatic polyamide fiber cloth impregnated with a fluororesin via a fluororesin film has also been proposed (Unexamined Japanese Patent Publication No. Showa 63
-290735).
この回路基板は上記従来品に比べ、低誘ｔ″４化され、
しかも熱膨張も小さいという利点がある。This circuit board has a lower dielectric potential of t″4 compared to the conventional product mentioned above,
Moreover, it has the advantage of low thermal expansion.
ところで、最近の回路基板に対する性能向上の要求は強
く０例えばコンピュータにかける信号伝送速度の高速化
遠吠のため１回路基板の一層の低誘電率化が求められて
いる。Incidentally, in recent years, there has been a strong demand for improved performance of circuit boards. For example, in order to increase the signal transmission speed of computers, there is a demand for circuit boards with even lower dielectric constants.
（課題を解決するための手段） 本発明者はかような現状に鑑み鋭意検討の結果。(Means for solving problems) The inventors of the present invention have conducted extensive studies in view of the current situation.
回路基板の基材として特定の布材を用いると、誘電率が
２．３台と一段と低くでき、且つ熱膨張率の小さなもの
となることを見出し１本発明に至った。The inventors have discovered that when a specific cloth material is used as a base material for a circuit board, the dielectric constant can be lowered to 2.3, and the coefficient of thermal expansion can be lowered, leading to the present invention.
即ち０本発明に係る低誘ｍ率回路基板は、フッ素樹脂が
含浸＋ｉ″１７められたコポリパラフェニレン３．４′
オキシジフエニレン・テレフタラミド（以下、ＰＰ０Ｄ
ＴＡと称す）！！ｌＩ布材の表面に、フッ素樹脂層を介
して金Ｈ４Ｍがａｔ層せしめられて成るものである。That is, the low permittivity circuit board according to the present invention is made of copolyparaphenylene 3.4' impregnated with a fluororesin.
Oxydiphenylene terephthalamide (hereinafter referred to as PP0D)
(referred to as TA)! ! It consists of an at layer of gold H4M on the surface of the lI cloth material via a fluororesin layer.
本発明にかいて用いられる布材は下記構造式（１）で示
されるＰＰ０ＤＴＡから成るもので、Ｉ＆布あるいは不
織布のいずれも用いることができる。The cloth material used in the present invention is made of PP0DTA represented by the following structural formula (1), and either I& cloth or nonwoven fabric can be used.
そして、この布材Ｖｃはポリテトラフルオロエチレン（
ＰＴＦＥ）、テトラフルオロエチレン−へキサフルオロ
プロピレン共重合体（ＦＥＰ）、テトラフルオロエチレ
ン−パーフルオロアルキルビニルエーテル共重合体（Ｐ
ＦＡ）等のフッ素樹脂が含浸せしめられる。This cloth material Vc is polytetrafluoroethylene (
PTFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (P
It is impregnated with a fluororesin such as FA).
布材に対するフッ素樹脂の含浸量は、布材の織目の粗密
、布材を構成する繊維の太さ等に応じて設定できるが、
織目を充填して空隙を残さないこと、および含浸後の表
面を平滑にするため、含浸率を４０〜７５％とするのが
好適であることが判明した。The amount of fluororesin impregnated into the cloth material can be set depending on the density of the weave of the cloth material, the thickness of the fibers constituting the cloth material, etc.
It has been found that an impregnation rate of 40 to 75% is suitable in order to fill the texture and leave no voids and to smooth the surface after impregnation.
布材に対するフッ素樹脂の含浸率が小さすぎる場合およ
び大きすぎる場合には、その理由は明らかではないが、
布材にフッ素樹脂層を介して金属層を積層する際に両者
の密２が悪くて気泡が残存することがあジ、接合強度の
低下を生ずることがある。Although the reason is not clear when the impregnation rate of fluororesin to cloth material is too small or too large,
When a metal layer is laminated on a cloth material via a fluororesin layer, air bubbles may remain due to poor density between the two, which may result in a decrease in bonding strength.
との含浸ｙ４はフッ素樹脂含浸前の布材の重量をＷｌ、
フッ素樹脂含浸後の布材の重ｔをＷｌとし。For impregnation y4, the weight of the cloth material before fluororesin impregnation is Wl,
Let Wl be the weight t of the cloth material after impregnated with fluororesin.
１Ｆ記（１）式によって算出された値である。This is a value calculated by formula (1) in 1F.
布材へのフグ素ｆＭ脂の含浸により、フッ素樹脂は布材
の織百空隙を充填し、筐た布材表面に薄層を形成する。By impregnating the cloth material with the fluororesin fM resin, the fluororesin fills the woven voids of the cloth material and forms a thin layer on the surface of the cloth material.
かようなフッ素樹脂含浸布材は１枚で用いてもよく、２
枚以上を用いてもよい。Such fluororesin-impregnated cloth material may be used in one piece, or in two pieces.
More than one sheet may be used.
本発明はこのように布材Ｖｃ７り素樹脂を含浸して用い
るものであり、フッ素樹脂含浸後ＶｃＤける布材の表面
平滑性の点から、布材が織布の場合。In the present invention, the cloth material Vc7 is impregnated with the fluororesin and used, and from the viewpoint of the surface smoothness of the cloth material after impregnation with the fluororesin, the cloth material is a woven cloth.
その厚さを０．１５朋以下とするのが好適である、布材
としての織布が厚すぎると、７ツ素樹脂含浸後に会いて
も、布材の表面に形成されたフッ素樹脂薄層に、布材の
織目凹凸が現われる。そして、これに金ｊＪＭｔを積層
せしめると、該金属層の表置状態は、布材の織目凹凸に
起因して１表面粗さが太きくなり、高周波特性の悪化を
招くことになる。It is preferable that the thickness is 0.15mm or less.If the woven fabric is too thick, even after impregnation with 7-carbon resin, a thin layer of fluororesin will form on the surface of the fabric. The unevenness of the texture of the cloth material appears. When gold jJMt is laminated thereon, the surface roughness of the metal layer increases due to the unevenness of the texture of the cloth material, resulting in deterioration of high frequency characteristics.
本−発明においては、かようなフッ素樹脂含浸布材の表
面に、ＰＴＦＥ、ＦＥＰ、ＰＦ’Ａ等のフッｇｌＡ樹脂
層を介して、銅、アルミニウム等の金属層が積層せしめ
られる。In the present invention, a metal layer such as copper or aluminum is laminated on the surface of such a fluororesin-impregnated cloth material via a fluorocarbon resin layer such as PTFE, FEP, or PF'A.
布材と金Ｆ４層の接合には、布材と金属層の間にフッ素
樹脂フィルムを介在せしめ、このフィルムを接着剤とし
て用いるのがよいが、布材表面に形成さｆしたフッ素樹
脂薄層が比較的厚く、接着機能を果すに足る場合は、フ
ィルムを０用せずに接合することも可能でるる。To bond the cloth material and the gold F4 layer, it is preferable to interpose a fluororesin film between the cloth material and the metal layer and use this film as an adhesive. If the film is relatively thick and sufficient to perform the adhesive function, it is possible to bond without using any film.
以下０図面を参照しながら本発明の詳細な説明する。第
１図Ｋ＞いて、１はフッ素樹脂を含浸せしめた布材でろ
９１本例ではこの布材３枚をフッ素樹脂フィルム２）Ｃ
よって互に接合して用いている。そして、この布材ｌの
両面上［Ｕ各々フッ素樹脂フィルム２を介して金属層３
が接合されている。The present invention will be described in detail below with reference to the drawings. Figure 1 K>, 1 is a cloth material impregnated with fluororesin.91 In this example, three pieces of this cloth material are used as fluororesin film 2)C
Therefore, they are used by joining them together. Then, on both sides of this cloth material 1, a metal layer 3
are joined.
上記実例では金属層が板状であるが１回路基板をコンピ
ュータ等に組み込むＶＣは、金属層を所定の回路とする
必要があり、従って、！２図に示すように金属層３をパ
ターン状とし１回路を形成する。In the example above, the metal layer is plate-shaped, but in a VC that incorporates one circuit board into a computer, etc., the metal layer needs to be a predetermined circuit, so! As shown in FIG. 2, the metal layer 3 is patterned to form one circuit.
（実施例） 以下、実施例により本発明を更に詳細に説明する。(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.
実施例１
厚さ０．１１ ｔｘｔＤ ＰＰ０ＤＴＡ製織布（奇人■
製、商品名テクノーラ） ｔ−ＰＴＦＥディスバージ首
ン（ＰＴＦε濃度５８重量％）中に浸漬して引き上げ、
３７０℃の温度で３分間加熱する。Example 1 Thickness 0.11 txtD PP0DTA woven fabric (strange)
t-PTFE disbarge neck (PTFε concentration 58% by weight) and pulled up.
Heat at a temperature of 370°C for 3 minutes.
この浸漬、加熱を更に３回線シ返し、厚さ０．１２朋、
ＰＴＦｇ含浸率６３％のフッ素樹脂含浸織布を得る。This dipping and heating process was repeated three more times until the thickness was 0.12 mm.
A fluororesin-impregnated woven fabric with a PTFg impregnation rate of 63% is obtained.
そして、このフッ素樹脂含浸織布３枚を重ね合せ、更に
この重ね合わせ体の両面上に厚さ１８μ駕の鋼箔を重ね
合せる。なか、織布相互間および織布と金Ｉｆ箔の間に
は、厚さ６０μ惰のＰＴＦＥフィルムを介在せしめる。Then, these three fluororesin-impregnated woven fabrics are stacked one on top of the other, and steel foil with a thickness of 18 μm is further stacked on both sides of this stacked body. Among them, a 60 μm thick PTFE film was interposed between the woven fabrics and between the woven fabric and the gold If foil.
次いで、この重ね合わせ体を温度４００℃、圧力５０
ｋＰ／−の条件で７７０熱加圧し、第１図と同構造の回
路基板（厚さ０．７３１１１）を得た。Next, this stacked body was heated at a temperature of 400°C and a pressure of 50°C.
A circuit board (thickness: 0.73111 mm) having the same structure as that shown in FIG. 1 was obtained by heating and pressing at 770 kP/-.
実施例２
ＰＴＦＥ１００重量部に対し、ＦＥＰを１０重量部混合
したディスバージョンを用いること以外は実施例１と同
様にして１回路板を得た。Example 2 One circuit board was obtained in the same manner as in Example 1 except that a dispersion mixture of 10 parts by weight of FEP and 100 parts by weight of PTFE was used.
比較例１
ＰＰＯＤＴＡ＠織布に代え、厚さ０．１１ｍのガラス比
較例２
ＰＰＯＤＴＡ製織布に代え、厚さ０．１１１１のポリ（
Ｐ−フェニレンテレ７タルアミド）製織布（デュボ比較
例３
ＰＴＦＥディスバージョンへの浸漬訃よびその後た。Comparative Example 1 Glass with a thickness of 0.11 m instead of PPODTA woven fabric Comparative Example 2 Glass with a thickness of 0.1111 m instead of PPODTA woven fabric
P-Phenylene 7 Talamide) woven fabric (Duveau Comparative Example 3) Immersion in PTFE dispersion and subsequent treatment.
比較例４
ＰＴＦＥディスバーン３ンへの浸？ｊｌｆｋよびその後
の加熱の回数を３０回とし、織布への含浸率を８１比較
例５
ＰＰＯＤＴＡ製織布として、厚さ０．１８ｉｕｇのもの
を用いること以外は実施例１と同様にして１回路基板を
得た。Comparative Example 4 Immersion in PTFE Disburn 3? Comparative Example 5 One circuit was carried out in the same manner as in Example 1, except that the number of jlfk and subsequent heating was 30 times, and the impregnation rate into the woven fabric was 81. I got the board.
これら実施例）よび比較例によって得られた回路基板に
ついて、下記試験を打ない、得られた結果を第１表に示
す。The circuit boards obtained in these examples) and comparative examples were not subjected to the following tests, and the results obtained are shown in Table 1.
Ａ、誘電率
安！＠電気社製、誘電体損自動測定器ＴＲ１１００を用
い１周波数ＩＫＨｚにて測定した。A. Low dielectric constant! Measurement was performed at one frequency of IKHz using an automatic dielectric loss measuring device TR1100 manufactured by @Denkisha.
Ｂ、熱膨張率
セイコー社製、ＳＳＳＳＣ５０００（Ｔ／５Ｓ）−１０
０型を用いて測定し、実施例１を基準として比較値で示
した。B, thermal expansion coefficient manufactured by Seiko Corporation, SSSSC5000 (T/5S)-10
Measurements were made using Type 0, and comparative values are shown based on Example 1.
Ｃ１表面粗さ
東京精密社製１表面粗さ計にて測定し、実施例１を基準
として比較値で示した。C1 Surface Roughness Measured using a surface roughness meter manufactured by Tokyo Seimitsu Co., Ltd., and shown as a comparative value using Example 1 as a standard.
Ｄ、気泡の有無
回路基板の断面を走査型電子顕微鏡（倍率５０倍）で観
察し１重ね合せた各材料間に気泡が有るか否かを判定し
た。D. Presence or absence of air bubbles The cross section of the circuit board was observed using a scanning electron microscope (50x magnification) to determine whether or not there were air bubbles between the stacked materials.
以下余白
第
表
（発明の効果）
本発明は上記のように構成され、ＰＰ０ＤＴＡ製布材を
用いているので０回路基板の誘１ｃ率を１段と低くでき
る。The following is a table with blank spaces (Effects of the Invention) Since the present invention is constructed as described above and uses the PP0DTA cloth material, the dielectric constant of the zero circuit board can be lowered by one level.
第１図および第２図はいずれも本発明に係る低誘電率回
路基板の実例を示す断面図である。
ｌ・・・布材 ２パ・・フッ素樹脂フィルム３・・・
金属層FIG. 1 and FIG. 2 are both sectional views showing examples of low dielectric constant circuit boards according to the present invention. l...Fabric material 2P...Fluororesin film 3...
metal layer
Claims (3)
レン・３，４′オキシジフエニレン・テレフタラミド製
布材の表面に、フツ素樹脂層を介して金属層が積層せし
められて成る低誘電率回路基板。(1) Low dielectric material made by laminating a metal layer on the surface of a copolyparaphenylene/3,4'oxydiphenylene/terephthalamide cloth impregnated with a fluororesin via a fluororesin layer. rate circuit board.
せしめられている請求項１記載の低誘電率回路基板。(2) The low dielectric constant circuit board according to claim 1, wherein at least two cloth materials are bonded together by a fluororesin layer.
２記載の低誘電率回路基板。(3) The low dielectric constant circuit board according to claim 1 or 2, wherein the metal layer is patterned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22104489A JPH0383390A (en) | 1989-08-28 | 1989-08-28 | Low dielectric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22104489A JPH0383390A (en) | 1989-08-28 | 1989-08-28 | Low dielectric circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0383390A true JPH0383390A (en) | 1991-04-09 |
Family
ID=16760612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22104489A Pending JPH0383390A (en) | 1989-08-28 | 1989-08-28 | Low dielectric circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0383390A (en) |
-
1989
- 1989-08-28 JP JP22104489A patent/JPH0383390A/en active Pending
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