JPH0381652U - - Google Patents

Info

Publication number
JPH0381652U
JPH0381652U JP1989142390U JP14239089U JPH0381652U JP H0381652 U JPH0381652 U JP H0381652U JP 1989142390 U JP1989142390 U JP 1989142390U JP 14239089 U JP14239089 U JP 14239089U JP H0381652 U JPH0381652 U JP H0381652U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
diode chip
lead frame
reflector plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989142390U
Other languages
English (en)
Japanese (ja)
Other versions
JP2553342Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989142390U priority Critical patent/JP2553342Y2/ja
Publication of JPH0381652U publication Critical patent/JPH0381652U/ja
Application granted granted Critical
Publication of JP2553342Y2 publication Critical patent/JP2553342Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1989142390U 1989-12-08 1989-12-08 発光ダイオードランプ Expired - Lifetime JP2553342Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Publications (2)

Publication Number Publication Date
JPH0381652U true JPH0381652U (de) 1991-08-21
JP2553342Y2 JP2553342Y2 (ja) 1997-11-05

Family

ID=31689220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989142390U Expired - Lifetime JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Country Status (1)

Country Link
JP (1) JP2553342Y2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185046A (ja) * 2000-12-19 2002-06-28 Sharp Corp チップ部品型ｌｅｄとその製造方法
JP2004363635A (ja) * 2004-09-27 2004-12-24 Nichia Chem Ind Ltd 発光ダイオード

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124654U (de) * 1977-03-14 1978-10-04
JPS53151376U (de) * 1977-05-04 1978-11-29
JPS54159977U (de) * 1978-04-27 1979-11-08
JPS61156779A (ja) * 1984-12-28 1986-07-16 Toshiba Corp 発光表示装置用電極部材の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124654U (de) * 1977-03-14 1978-10-04
JPS53151376U (de) * 1977-05-04 1978-11-29
JPS54159977U (de) * 1978-04-27 1979-11-08
JPS61156779A (ja) * 1984-12-28 1986-07-16 Toshiba Corp 発光表示装置用電極部材の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185046A (ja) * 2000-12-19 2002-06-28 Sharp Corp チップ部品型ｌｅｄとその製造方法
JP2004363635A (ja) * 2004-09-27 2004-12-24 Nichia Chem Ind Ltd 発光ダイオード

Also Published As

Publication number Publication date
JP2553342Y2 (ja) 1997-11-05

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term