JPH0379450U - - Google Patents
Info
- Publication number
- JPH0379450U JPH0379450U JP1989141354U JP14135489U JPH0379450U JP H0379450 U JPH0379450 U JP H0379450U JP 1989141354 U JP1989141354 U JP 1989141354U JP 14135489 U JP14135489 U JP 14135489U JP H0379450 U JPH0379450 U JP H0379450U
- Authority
- JP
- Japan
- Prior art keywords
- injection nozzle
- heat radiation
- radiation surface
- electronic component
- coolant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002826 coolant Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989141354U JPH0379450U (US07413550-20080819-C00001.png) | 1989-12-05 | 1989-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989141354U JPH0379450U (US07413550-20080819-C00001.png) | 1989-12-05 | 1989-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379450U true JPH0379450U (US07413550-20080819-C00001.png) | 1991-08-13 |
Family
ID=31688258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989141354U Pending JPH0379450U (US07413550-20080819-C00001.png) | 1989-12-05 | 1989-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379450U (US07413550-20080819-C00001.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013121237A (ja) * | 2011-12-07 | 2013-06-17 | Denso Corp | 電気自動車の電力機器冷却装置 |
| JP2019513296A (ja) * | 2016-06-16 | 2019-05-23 | 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． | ハイパワー部品用の作動媒体接触式冷却システム及びその作動方法 |
| JP2019153240A (ja) * | 2018-03-06 | 2019-09-12 | 株式会社Ｉｄｃフロンティア | 冷却装置、データセンター、及び冷却方法 |
-
1989
- 1989-12-05 JP JP1989141354U patent/JPH0379450U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013121237A (ja) * | 2011-12-07 | 2013-06-17 | Denso Corp | 電気自動車の電力機器冷却装置 |
| JP2019513296A (ja) * | 2016-06-16 | 2019-05-23 | 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． | ハイパワー部品用の作動媒体接触式冷却システム及びその作動方法 |
| JP2019153240A (ja) * | 2018-03-06 | 2019-09-12 | 株式会社Ｉｄｃフロンティア | 冷却装置、データセンター、及び冷却方法 |
