JPH0378768U - - Google Patents
Info
- Publication number
- JPH0378768U JPH0378768U JP13987489U JP13987489U JPH0378768U JP H0378768 U JPH0378768 U JP H0378768U JP 13987489 U JP13987489 U JP 13987489U JP 13987489 U JP13987489 U JP 13987489U JP H0378768 U JPH0378768 U JP H0378768U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thickness
- cover tape
- heat
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 8
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000002216 antistatic agent Substances 0.000 claims 1
- 239000011247 coating layer Substances 0.000 claims 1
- 239000004922 lacquer Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
Landscapes
- Packages (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139874U JP2511761Y2 (ja) | 1989-12-04 | 1989-12-04 | チップ型電子部品包装用カバ―テ―プ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139874U JP2511761Y2 (ja) | 1989-12-04 | 1989-12-04 | チップ型電子部品包装用カバ―テ―プ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0378768U true JPH0378768U (US20100056889A1-20100304-C00004.png) | 1991-08-09 |
| JP2511761Y2 JP2511761Y2 (ja) | 1996-09-25 |
Family
ID=31686891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989139874U Expired - Fee Related JP2511761Y2 (ja) | 1989-12-04 | 1989-12-04 | チップ型電子部品包装用カバ―テ―プ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511761Y2 (US20100056889A1-20100304-C00004.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08324676A (ja) * | 1995-05-30 | 1996-12-10 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
| JP2011121602A (ja) * | 2009-12-09 | 2011-06-23 | Denki Kagaku Kogyo Kk | キャリアテープ体の剥離帯電量低減方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4002131B2 (ja) * | 2002-04-09 | 2007-10-31 | 旭化成テクノプラス株式会社 | カバーテープ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0185261U (US20100056889A1-20100304-C00004.png) * | 1987-11-26 | 1989-06-06 | ||
| JPH0194268U (US20100056889A1-20100304-C00004.png) * | 1987-12-17 | 1989-06-21 |
-
1989
- 1989-12-04 JP JP1989139874U patent/JP2511761Y2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0185261U (US20100056889A1-20100304-C00004.png) * | 1987-11-26 | 1989-06-06 | ||
| JPH0194268U (US20100056889A1-20100304-C00004.png) * | 1987-12-17 | 1989-06-21 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08324676A (ja) * | 1995-05-30 | 1996-12-10 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
| JP2011121602A (ja) * | 2009-12-09 | 2011-06-23 | Denki Kagaku Kogyo Kk | キャリアテープ体の剥離帯電量低減方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2511761Y2 (ja) | 1996-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |