JPH0377790A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPH0377790A JPH0377790A JP1209572A JP20957289A JPH0377790A JP H0377790 A JPH0377790 A JP H0377790A JP 1209572 A JP1209572 A JP 1209572A JP 20957289 A JP20957289 A JP 20957289A JP H0377790 A JPH0377790 A JP H0377790A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- cut
- laser beam
- discriminating
- mal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 32
- 230000002950 deficient Effects 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000005856 abnormality Effects 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 9
- 239000012530 fluid Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野1
この発明は、レーザによる材料の切断加工時に切断不良
を検知する機能を有するレーザ加工装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a laser processing device having a function of detecting cutting defects when cutting a material using a laser.
[従来の技術]
第3図は従来のレーザ加工機を示す断面図であり、図に
おいて(1)は加工ヘッド、(2〉はこの加工ヘッド(
1)内の図示しないレーザ源からのレーザビーム、(3
)はこのレーザビーム(2〉を後述する被切断材に集光
する集光レンズ、(4)は切断加工を補助する02やN
2などのアシストガス、(5)は被切断材である。[Prior Art] Fig. 3 is a sectional view showing a conventional laser processing machine, in which (1) is a processing head, (2> is this processing head (
A laser beam from a laser source not shown in (1), (3
) is this laser beam (2) is a condensing lens that focuses the light on the material to be cut, which will be described later, and (4) is 02 or N that assists the cutting process.
Assist gas such as 2 and (5) are the material to be cut.
従来のレーザ加工機は上記のように構成され、集光レン
ズ(3〉で集光したレーザビーム(2)をアシストガス
(4)の噴射と共に被切断材(5〉に照射し、この照射
部位を蒸発または溶融させ、除去することにより被切断
材(5)を切断している。A conventional laser processing machine is configured as described above, and irradiates the workpiece (5) with a laser beam (2) focused by a condensing lens (3) together with an assist gas (4), The material to be cut (5) is cut by evaporating or melting and removing it.
[発明が解決しようとする課題]
上記のような従来のレーザ加工機では、被切断材の切断
部位を蒸発または溶融により除去する熱加工が行われる
。このため加工時に被切断部位から蒸気などが発生し、
集光レンズの表面が汚れたり、被切断材のそりなどに起
因して焦点位置でパワー密度が変動するなどにより切断
不良が生じるなどの問題点があった。特に、無人運転を
行った場合は、切り残しが生じたまま加工ををしてしま
うという問題点もあった。[Problems to be Solved by the Invention] In the conventional laser processing machine as described above, thermal processing is performed in which the cut portion of the material to be cut is removed by evaporation or melting. For this reason, steam etc. are generated from the part to be cut during processing,
There have been problems such as poor cutting due to fluctuations in power density at the focal point due to dirt on the surface of the condenser lens or warping of the material to be cut. In particular, when unmanned operation is performed, there is a problem in that machining is performed with uncut parts remaining.
この発明は、このような問題点を解決するためになされ
たもので、被切断材の切断時に切断不良を判別し、これ
を報知できる高信頼度のレーザ加工装置を得ることを目
的とする。The present invention has been made to solve these problems, and an object of the present invention is to provide a highly reliable laser processing device that is capable of determining cutting defects when cutting a material to be cut, and notifying the user of the defective cutting.
[課題を解決するための手段]
この発明に係るレーザ加工装置は、レーザビームの走査
移動方向に配置され、被切断材の切断部を通過したレー
ザビームを検知する複数の光電変換素子からなる光検知
装置と、この光検知装置により検出された切断情況を示
す信号に基づいて被切断材の切断不良を判断し、外部に
報知する切断不良判別報知手段とを設けたものである。[Means for Solving the Problems] A laser processing device according to the present invention includes a plurality of photoelectric conversion elements that are arranged in the scanning movement direction of a laser beam and detect a laser beam that has passed through a cutting section of a material to be cut. The present invention is provided with a detection device and a cutting defect determination/notifying means for determining a cutting defect in a material to be cut based on a signal indicating the cutting status detected by the photodetecting device and notifying the outside.
[fil−用〕
この発明においては、光検知装置により被切断材からの
レーザビームを検知し、この検知情報に基づいて切断不
良判別報知手段により被切断材の切断不良を判断する。[For fil-] In the present invention, the laser beam from the material to be cut is detected by the optical detection device, and based on this detection information, the cutting defect determination and notification means determines whether the material to be cut is defective.
[実施例〕
第1図はこの発明によるレーザ加工装置の一実施例を示
す斜視図であり、(1〉〜(5)は上記従来装置と全く
同一のものである。(6)は加工ヘッド(1)の移動方
向にかつ被切断材(5〉の下方に配置され、被切断材(
5)の切断部を通過したレーザビーム(2〉を検知する
複数の光電変換素子例えば光電池や光ファイバからなる
光検知装置、(7)はこの光検知装置(6)に電気的に
接続され5その出力信号に基づいて被切断材(5〉の切
断不良を判別する、切断不良判別報知手段の一部をなす
判別装置、(8)はこの判別装置(7)に電気的に接続
され、判別装置(7)で判別された切断不良を外部に報
知する、切断不良判別報知手段の残部をなす警報装置で
ある。[Embodiment] Fig. 1 is a perspective view showing an embodiment of the laser processing apparatus according to the present invention, in which (1> to (5)) are completely the same as the conventional apparatus described above. (6) is a processing head. It is placed in the moving direction of (1) and below the workpiece (5>), and
A photodetection device (7) consisting of a plurality of photoelectric conversion elements such as photocells or optical fibers for detecting the laser beam (2) that has passed through the cutting section of 5) is electrically connected to this photodetection device (6). A discriminating device (8), which is part of a cutting defect discriminating and informing means, which discriminates whether a cut material to be cut (5) is defective based on the output signal, is electrically connected to this discriminating device (7), and is connected to the discriminating device (7). This alarm device constitutes the remainder of the defective cutting determination and notification means that notifies the outside of the defective cutting determined by the device (7).
上記のように構成されたレーザ加工袋、置においては1
図示しないテーブルに被切断材(5〉を固定し、このテ
ーブルを例えばX軸方向に移動させ、加工ヘッド(1)
をy軸方向に移動させて被切断材(5〉を任意の形状に
加工するようにしている。被切断材(5)が正常に切断
加工されているときは、加工ヘッド(1〉の移動方向、
即ちy軸方向に複数個配置された光1変換素子から被切
断材(5〉の切断部を通過したレーザビーム(2〉が検
知され、パルス状の電圧信号が順次判別装置!(7)に
送出される。ここで切断不良が生じると、例えば切断時
のレーザビーム(2)の熟により被切断材(5)から蒸
気などが発生してレンズ表面が汚れるとか、熱による被
切断材(5)のそりなどのひずみに起因して焦点位置で
のパワー密度の変動が生じるなどのため切断不良が生じ
ると、レーザビーム(2〉は波切Wr材(5〉を通過せ
ずそれからずれるようになる。In the case of the laser processing bag configured as above, 1
A workpiece to be cut (5) is fixed on a table (not shown), and the table is moved, for example, in the X-axis direction, and the processing head (1) is
is moved in the y-axis direction to process the material to be cut (5) into an arbitrary shape. When the material to be cut (5) is being cut normally, the processing head (1) is moved in the direction of the y-axis. direction,
That is, the laser beam (2) that passes through the cutting part of the material to be cut (5) is detected from a plurality of light 1 conversion elements arranged in the y-axis direction, and a pulsed voltage signal is sequentially sent to the discrimination device (7). If a cutting failure occurs here, for example, the laser beam (2) matures during cutting and steam is generated from the material to be cut (5) and the lens surface becomes dirty, or the material to be cut (5) is damaged due to heat. ) If a cutting defect occurs due to fluctuations in the power density at the focal point due to distortion such as warping of the laser beam (2), the laser beam (2) will not pass through the wave-cut Wr material (5) and will deviate from it. .
このため光検知装置く6)の出力信号がゼロになり、判
別装置(7)は切断不良を検知することができる。Therefore, the output signal of the photodetector (6) becomes zero, and the discriminator (7) can detect a cutting defect.
判別装置1F (7)の出力により警報装置く8〉は警
報を出して周囲に異常を報知する。このようにして高信
頼度の無人運転が可能になる。The alarm device (8) issues an alarm based on the output of the discriminator 1F (7) to notify the surroundings of the abnormality. In this way, highly reliable unmanned operation becomes possible.
第2図はこの発明の他の実施例を示す構成図であり、(
1)〜(8)は第1図の装置と全く同一のものである。FIG. 2 is a block diagram showing another embodiment of the present invention, (
1) to (8) are exactly the same as the apparatus shown in FIG.
(9〉は気体や水などの噴射用流体、(10)は光検知
装置(6)の近傍に装着され、流体(9〉を光検知袋!
(6)の表面に噴射し、被切断材(5)からの切断微
粉末を除去するためのノズル手段としてのノズルである
6
上記のように構成されたレーザ加工装置においては、切
断時のレーザビーム(2ンの熱により被切断材(5)か
ら生じた微粉末や蒸気などが光検知袋W(6)の表面に
落下付着したとき、ノズル(10)から空気や水などの
流体(9)をその表面に吹き付けることによりそれらの
汚染物が除去される。このようにすれば、装置を長期間
にわたって使用したときも、光検知装置(6)の検出感
度の低下を防止でき、高信頼度の光検知装置ft(6)
、従ってレーザ加工装置が得られる。(9> is a jetting fluid such as gas or water, (10) is attached near the light detection device (6), and the fluid (9>) is placed in a light detection bag!
(6) is a nozzle as a nozzle means for removing cutting fine powder from the material to be cut (5) by injecting it onto the surface of the material to be cut (5). When fine powder, steam, etc. generated from the material to be cut (5) due to the heat of the beam (2) falls and adheres to the surface of the photodetection bag W (6), a fluid such as air or water (9) is released from the nozzle (10). ) on the surface to remove those contaminants.In this way, even when the device is used for a long period of time, the detection sensitivity of the photodetector (6) can be prevented from decreasing, ensuring high reliability. Degree of light detection device ft (6)
, thus a laser processing device is obtained.
ここで、噴射用流体(9)として液体を使用し、またレ
ーザとして炭酸ガスレーザなど液体を透過し難いものを
使用したときは、この第1レーザ源と同一の軌跡を描く
ように第2のレーザ源例えばヘリウムネオンレーザを設
けてこれを導波用に使用すればよい6
なお、上記実施例では、流#(9〉 をノズル(10)
により光検知装置く6)に吹き付ける場合を示したが、
光検知装置(6)を流体中に浸漬するようにしても同様
の効果を期待することができる。Here, when a liquid is used as the injection fluid (9) and a laser that is difficult to penetrate liquid, such as a carbon dioxide laser, the second laser source is For example, a helium neon laser may be provided as a source and used for waveguide.6 In the above embodiment, the flow #(9) is connected to the nozzle (10).
The case of spraying on the light detection device 6) was shown, but
A similar effect can be expected even if the photodetector (6) is immersed in the fluid.
[効 果]
この発明は、以上説明したとおり、被切断材の切断時に
切断部位を通過するレーザビームを検知する光検知装置
と、その出力に基づいて不良切断の有無を判別し、報知
する不良切断判別報知手段とを設けたことにより、簡単
なi造で切断不良を早期に発見でき、高信頼度の無人運
転が可能となる効果を奏する。[Effects] As explained above, the present invention includes a photodetection device that detects a laser beam passing through a cutting part when cutting a material to be cut, and a defective detection device that determines whether there is a defective cut based on the output of the photodetection device and notifies the user of the defective cut. By providing the cutting determination notification means, cutting defects can be detected early with a simple i-structure, and highly reliable unmanned operation is possible.
第1図はこの発明の一実施例を示す斜視図、第2図は他
の実施例を示す斜視図、第3図は従来のレーザ加工機を
示す断面図である。
図において、(2)レーザビーム、(3)は集光レンズ
、(5)は被切断材、(6)は光検知装置、(7)は判
別装置、(8)は警報装置である。
なお、各図中、同一符号は同一または相当部分を示す。
2° L−す゛°ヒ゛−ム
3 、集党 し〉ス゛
5°夜切断林
6、た挟□□□尺置FIG. 1 is a perspective view showing one embodiment of the present invention, FIG. 2 is a perspective view showing another embodiment, and FIG. 3 is a sectional view showing a conventional laser processing machine. In the figure, (2) is a laser beam, (3) is a condensing lens, (5) is a material to be cut, (6) is a light detection device, (7) is a discrimination device, and (8) is an alarm device. In each figure, the same reference numerals indicate the same or corresponding parts. 2° L-Swim 3, Gathering Swish 5° Night Cutting Forest 6, Sandwich □□□Size
Claims (1)
断材を支承する支承台と、前記レーザビーム発生手段か
ら発生された前記レーザビームを前記被切断材に集光し
、走査する光学手段と、前記レーザビームの走査移動方
向に配置され、前記被切断材の切断部を通過したレーザ
ビームを検知する複数の光電変換素子からなる光検知装
置と、この光検知装置に電気的に接続され、その出力信
号に基づいて前記被切断材の切断不良を判別し、外部に
報知する切断不良判別報知手段とを備えたことを特徴と
するレーザ加工装置。a laser beam generating means for generating a laser beam; a support base for supporting the material to be cut; an optical means for focusing and scanning the laser beam generated by the laser beam generating means on the material to be cut; a photodetection device including a plurality of photoelectric conversion elements disposed in the scanning movement direction of the laser beam and configured to detect the laser beam that has passed through the cutting section of the material to be cut; A laser processing apparatus characterized by comprising: defective cutting determination and notification means for determining defective cutting of the material to be cut based on a signal and notifying the outside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1209572A JPH0377790A (en) | 1989-08-15 | 1989-08-15 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1209572A JPH0377790A (en) | 1989-08-15 | 1989-08-15 | Laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0377790A true JPH0377790A (en) | 1991-04-03 |
Family
ID=16575055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1209572A Pending JPH0377790A (en) | 1989-08-15 | 1989-08-15 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0377790A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011004117A1 (en) | 2011-02-15 | 2012-08-16 | Trumpf Laser- Und Systemtechnik Gmbh | Method for controlling a cutting operation on a workpiece |
-
1989
- 1989-08-15 JP JP1209572A patent/JPH0377790A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011004117A1 (en) | 2011-02-15 | 2012-08-16 | Trumpf Laser- Und Systemtechnik Gmbh | Method for controlling a cutting operation on a workpiece |
WO2012110129A1 (en) | 2011-02-15 | 2012-08-23 | Trumpf Laser- Und Systemtechnik Gmbh | Method for monitoring cutting machining on a workpiece |
CN103370164A (en) * | 2011-02-15 | 2013-10-23 | 通快激光与系统工程有限公司 | Method for monitoring cutting machining on a workpiece |
CN103370164B (en) * | 2011-02-15 | 2015-02-25 | 通快激光与系统工程有限公司 | Method for monitoring cutting machining on a workpiece |
US9452544B2 (en) | 2011-02-15 | 2016-09-27 | TRUMF Laser- und Systemtechnik GmbH | Method for monitoring cutting processing on a workpiece |
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