JPH0377458U - - Google Patents
Info
- Publication number
- JPH0377458U JPH0377458U JP13878289U JP13878289U JPH0377458U JP H0377458 U JPH0377458 U JP H0377458U JP 13878289 U JP13878289 U JP 13878289U JP 13878289 U JP13878289 U JP 13878289U JP H0377458 U JPH0377458 U JP H0377458U
- Authority
- JP
- Japan
- Prior art keywords
- package
- lead terminal
- printed wiring
- mount component
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13878289U JPH0377458U (de) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13878289U JPH0377458U (de) | 1989-11-30 | 1989-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0377458U true JPH0377458U (de) | 1991-08-05 |
Family
ID=31685860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13878289U Pending JPH0377458U (de) | 1989-11-30 | 1989-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0377458U (de) |
-
1989
- 1989-11-30 JP JP13878289U patent/JPH0377458U/ja active Pending