JPH0377455U - - Google Patents
Info
- Publication number
- JPH0377455U JPH0377455U JP1990126262U JP12626290U JPH0377455U JP H0377455 U JPH0377455 U JP H0377455U JP 1990126262 U JP1990126262 U JP 1990126262U JP 12626290 U JP12626290 U JP 12626290U JP H0377455 U JPH0377455 U JP H0377455U
- Authority
- JP
- Japan
- Prior art keywords
- runner
- lead frame
- leads
- molding process
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019890017653U KR920005035Y1 (ko) | 1989-11-28 | 1989-11-28 | 리드프레임 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377455U true JPH0377455U (US07754267-20100713-C00017.png) | 1991-08-05 |
Family
ID=19292397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990126262U Pending JPH0377455U (US07754267-20100713-C00017.png) | 1989-11-28 | 1990-11-28 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5093709A (US07754267-20100713-C00017.png) |
| JP (1) | JPH0377455U (US07754267-20100713-C00017.png) |
| KR (1) | KR920005035Y1 (US07754267-20100713-C00017.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09115936A (ja) * | 1995-10-23 | 1997-05-02 | Mitsubishi Electric Corp | 半導体装置の樹脂封止用金型 |
| KR100531423B1 (ko) * | 2000-10-16 | 2005-11-28 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 제조용 리드프레임 및 이에 적용되는 몰드다이, 그리고 이를 이용한 패키지 제조장치. |
| US8205767B2 (en) * | 2006-10-31 | 2012-06-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Infinitely adjustable beverage container holder by spin actuation |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125159A (ja) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | 半導体装置の組立方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59150458A (ja) * | 1983-02-03 | 1984-08-28 | Toshiba Corp | リ−ドフレ−ム |
| JPS61104650A (ja) * | 1984-10-29 | 1986-05-22 | Rohm Co Ltd | リ−ドフレ−ム |
| JPS61135146A (ja) * | 1984-12-06 | 1986-06-23 | Toshiba Corp | 半導体リ−ドフレ−ム |
-
1989
- 1989-11-28 KR KR2019890017653U patent/KR920005035Y1/ko not_active IP Right Cessation
-
1990
- 1990-11-26 US US07/618,163 patent/US5093709A/en not_active Expired - Lifetime
- 1990-11-28 JP JP1990126262U patent/JPH0377455U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125159A (ja) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | 半導体装置の組立方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US5093709A (en) | 1992-03-03 |
| KR920005035Y1 (ko) | 1992-07-25 |
| KR910009946U (ko) | 1991-06-29 |
