JPH0377444U - - Google Patents
Info
- Publication number
- JPH0377444U JPH0377444U JP1989138262U JP13826289U JPH0377444U JP H0377444 U JPH0377444 U JP H0377444U JP 1989138262 U JP1989138262 U JP 1989138262U JP 13826289 U JP13826289 U JP 13826289U JP H0377444 U JPH0377444 U JP H0377444U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- tip
- lead wire
- probe
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/00—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138262U JPH0377444U (enExample) | 1989-11-28 | 1989-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138262U JPH0377444U (enExample) | 1989-11-28 | 1989-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377444U true JPH0377444U (enExample) | 1991-08-05 |
Family
ID=31685372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989138262U Pending JPH0377444U (enExample) | 1989-11-28 | 1989-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377444U (enExample) |
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1989
- 1989-11-28 JP JP1989138262U patent/JPH0377444U/ja active Pending