JPH037577U - - Google Patents

Info

Publication number
JPH037577U
JPH037577U JP6806389U JP6806389U JPH037577U JP H037577 U JPH037577 U JP H037577U JP 6806389 U JP6806389 U JP 6806389U JP 6806389 U JP6806389 U JP 6806389U JP H037577 U JPH037577 U JP H037577U
Authority
JP
Japan
Prior art keywords
partition wall
opening
shutter device
brim
flush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6806389U
Other languages
English (en)
Other versions
JP2515777Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989068063U priority Critical patent/JP2515777Y2/ja
Priority to EP19900306455 priority patent/EP0407044B1/en
Priority to DE1990606948 priority patent/DE69006948T2/de
Publication of JPH037577U publication Critical patent/JPH037577U/ja
Application granted granted Critical
Publication of JP2515777Y2 publication Critical patent/JP2515777Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/16—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together
    • F16K3/20—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the seats
    • F16K3/207—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the seats by means of hydraulic forces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Sliding Valves (AREA)
  • Lift Valve (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るシヤツター装置の正面図
、第２図は同シヤツター装置の平面図、第３図は
第１図の−線断面図、第４図は同シヤツター
装置の開状態を示す第３図と同様の図、第５図は
同シヤツター装置要部の分解斜視図、第６図は同
シヤツター装置のバルブシートに作用する力を示
す説明図である。 １……シヤツター装置、６，７……エアシリン
ダー（駆動手段）、１５……押圧部材、２０……
開口部、２３……バルブシート、３０……隔壁、
Ｓ１，Ｓ２……容器。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 容器内を区画する隔壁に沿つて移動するこ
    とによつて該隔壁に穿設された開口部を開閉する
    薄板フイルム状のバルブシートと、該バルブシー
    トを隔壁側に押圧してこれを前記開口部周縁に密
    着せしめる押圧部材と、これらバルブシートと押
    圧部材の駆動手段を含んで構成されることを特徴
    とするシヤツター装置。 (2) 前記隔壁によつて区画される容器に収容さ
    れた液体の各静圧が前記開口部において略等しく
    なるように、両液体の液位を調整するようにした
    ことを特徴とする請求項１記載のシヤツター装置
    。 (3) 前記押圧部材は、その下端を中心に傾動自
    在であつて、前記隔壁の上部にこれと平行に配さ
    れた軸を中心に回動するレバーと該レバーを駆動
    するアクチユエータから成る駆動機構によつて傾
    動せしめられることを特徴とする請求項１記載の
    シヤツター装置。
JP1989068063U 1989-06-13 1989-06-13 ウエ−ハ洗浄装置のシャッタ−装置 Expired - Lifetime JP2515777Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1989068063U JP2515777Y2 (ja) 1989-06-13 1989-06-13 ウエ−ハ洗浄装置のシャッタ−装置
EP19900306455 EP0407044B1 (en) 1989-06-13 1990-06-13 A shutter system
DE1990606948 DE69006948T2 (de) 1989-06-13 1990-06-13 Verschlusssystem.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989068063U JP2515777Y2 (ja) 1989-06-13 1989-06-13 ウエ−ハ洗浄装置のシャッタ−装置

Publications (2)

Publication Number Publication Date
JPH037577U true JPH037577U (ja) 1991-01-24
JP2515777Y2 JP2515777Y2 (ja) 1996-10-30

Family

ID=13362951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989068063U Expired - Lifetime JP2515777Y2 (ja) 1989-06-13 1989-06-13 ウエ−ハ洗浄装置のシャッタ−装置

Country Status (3)

Country Link
EP (1) EP0407044B1 (ja)
JP (1) JP2515777Y2 (ja)
DE (1) DE69006948T2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762184U (ja) * 1980-09-30 1982-04-13
JPS6435936U (ja) * 1987-08-31 1989-03-03
KR20160050588A (ko) * 2014-10-30 2016-05-11 주식회사 토박스코리아 신고 벗기 용이한 유아용 신발

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0817246B1 (en) * 1996-06-24 2005-02-02 Interuniversitair Microelektronica Centrum Vzw Apparatus and method for wet cleaning or etching of flat substrates
DE69732392T8 (de) 1996-06-24 2006-04-27 Interuniversitair Microelectronica Centrum Vzw Vorrichtung und Verfahren zur Nassreinigung oder zum Ätzen eines flachen Substrats
EP0849772A1 (en) * 1996-12-20 1998-06-24 Interuniversitair Micro-Elektronica Centrum Vzw Apparatus and method for wet cleaning or etching of flat substrates
CN103008282B (zh) * 2012-11-29 2015-07-15 北京七星华创电子股份有限公司 清洗兆声波换能器的装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139226A (en) * 1977-05-11 1978-12-05 Hitachi Ltd Air lock valve

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4418646A (en) * 1982-03-29 1983-12-06 Eaton Corporation Load lock valve
US4746397A (en) * 1986-01-17 1988-05-24 Matsushita Electric Industrial Co., Ltd. Treatment method for plate-shaped substrate
US4715764A (en) * 1986-04-28 1987-12-29 Varian Associates, Inc. Gate valve for wafer processing system
WO1987006862A1 (en) * 1986-05-16 1987-11-19 Eastman Kodak Company Ultrasonic cleaning method and apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139226A (en) * 1977-05-11 1978-12-05 Hitachi Ltd Air lock valve

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762184U (ja) * 1980-09-30 1982-04-13
JPS6435936U (ja) * 1987-08-31 1989-03-03
KR20160050588A (ko) * 2014-10-30 2016-05-11 주식회사 토박스코리아 신고 벗기 용이한 유아용 신발

Also Published As

Publication number Publication date
JP2515777Y2 (ja) 1996-10-30
EP0407044B1 (en) 1994-03-02
EP0407044A1 (en) 1991-01-09
DE69006948D1 (de) 1994-04-07
DE69006948T2 (de) 1994-08-25

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