JPH037577U - - Google Patents
Info
- Publication number
- JPH037577U JPH037577U JP6806389U JP6806389U JPH037577U JP H037577 U JPH037577 U JP H037577U JP 6806389 U JP6806389 U JP 6806389U JP 6806389 U JP6806389 U JP 6806389U JP H037577 U JPH037577 U JP H037577U
- Authority
- JP
- Japan
- Prior art keywords
- partition wall
- opening
- shutter device
- brim
- flush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract 4
- 239000010409 thin film Substances 0.000 claims abstract 2
- 230000003068 static effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
- F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
- F16K3/16—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together
- F16K3/20—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the seats
- F16K3/207—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the seats by means of hydraulic forces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Sliding Valves (AREA)
- Lift Valve (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989068063U JP2515777Y2 (ja) | 1989-06-13 | 1989-06-13 | ウエ−ハ洗浄装置のシャッタ−装置 |
| EP19900306455 EP0407044B1 (en) | 1989-06-13 | 1990-06-13 | A shutter system |
| DE1990606948 DE69006948T2 (de) | 1989-06-13 | 1990-06-13 | Verschlusssystem. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989068063U JP2515777Y2 (ja) | 1989-06-13 | 1989-06-13 | ウエ−ハ洗浄装置のシャッタ−装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH037577U true JPH037577U (US07122547-20061017-C00032.png) | 1991-01-24 |
| JP2515777Y2 JP2515777Y2 (ja) | 1996-10-30 |
Family
ID=13362951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989068063U Expired - Lifetime JP2515777Y2 (ja) | 1989-06-13 | 1989-06-13 | ウエ−ハ洗浄装置のシャッタ−装置 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0407044B1 (US07122547-20061017-C00032.png) |
| JP (1) | JP2515777Y2 (US07122547-20061017-C00032.png) |
| DE (1) | DE69006948T2 (US07122547-20061017-C00032.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5762184U (US07122547-20061017-C00032.png) * | 1980-09-30 | 1982-04-13 | ||
| JPS6435936U (US07122547-20061017-C00032.png) * | 1987-08-31 | 1989-03-03 | ||
| KR20160050588A (ko) * | 2014-10-30 | 2016-05-11 | 주식회사 토박스코리아 | 신고 벗기 용이한 유아용 신발 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0817246B1 (en) * | 1996-06-24 | 2005-02-02 | Interuniversitair Microelektronica Centrum Vzw | Apparatus and method for wet cleaning or etching of flat substrates |
| JP4421686B2 (ja) | 1996-06-24 | 2010-02-24 | インテルウニフェルシテール ミクロエレクトロニカ セントルム フェライニジンク ゾンダ ウィンストベヤーク | 平坦な基材を湿式でクリーニングまたはエッチングするための装置および方法 |
| EP0849772A1 (en) * | 1996-12-20 | 1998-06-24 | Interuniversitair Micro-Elektronica Centrum Vzw | Apparatus and method for wet cleaning or etching of flat substrates |
| CN103008282B (zh) * | 2012-11-29 | 2015-07-15 | 北京七星华创电子股份有限公司 | 清洗兆声波换能器的装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53139226A (en) * | 1977-05-11 | 1978-12-05 | Hitachi Ltd | Air lock valve |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4418646A (en) * | 1982-03-29 | 1983-12-06 | Eaton Corporation | Load lock valve |
| US4746397A (en) * | 1986-01-17 | 1988-05-24 | Matsushita Electric Industrial Co., Ltd. | Treatment method for plate-shaped substrate |
| US4715764A (en) * | 1986-04-28 | 1987-12-29 | Varian Associates, Inc. | Gate valve for wafer processing system |
| WO1987006862A1 (en) * | 1986-05-16 | 1987-11-19 | Eastman Kodak Company | Ultrasonic cleaning method and apparatus |
-
1989
- 1989-06-13 JP JP1989068063U patent/JP2515777Y2/ja not_active Expired - Lifetime
-
1990
- 1990-06-13 EP EP19900306455 patent/EP0407044B1/en not_active Expired - Lifetime
- 1990-06-13 DE DE1990606948 patent/DE69006948T2/de not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53139226A (en) * | 1977-05-11 | 1978-12-05 | Hitachi Ltd | Air lock valve |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5762184U (US07122547-20061017-C00032.png) * | 1980-09-30 | 1982-04-13 | ||
| JPS6435936U (US07122547-20061017-C00032.png) * | 1987-08-31 | 1989-03-03 | ||
| KR20160050588A (ko) * | 2014-10-30 | 2016-05-11 | 주식회사 토박스코리아 | 신고 벗기 용이한 유아용 신발 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69006948T2 (de) | 1994-08-25 |
| EP0407044A1 (en) | 1991-01-09 |
| EP0407044B1 (en) | 1994-03-02 |
| DE69006948D1 (de) | 1994-04-07 |
| JP2515777Y2 (ja) | 1996-10-30 |
