JPH037492B2 - - Google Patents

Description

[Detailed description of the invention] 【Technical field】

The present invention relates to a multi-pot type transfer molding apparatus for inserting and sealing electronic parts and the like.

[Background technology]

A sealed molding mold equipped with a molding pressure regulating valve that utilizes fluid pressure was previously filed as Utility Model Application No. 1971-71240. This means that when too much molding material is input, the molding pressure adjustment valve retracts against the fluid, making it possible to adjust the variation in the amount of molding material input and remotely adjusting the fluid pressure of the molding pressure adjustment valve. However, since the molding pressure regulating valve was built into the upper mold, the structure of the mold became complicated, making it difficult to process the mold, and it was necessary to install a molding pressure regulating valve for each molding die. There was a problem that the mold had to be assembled, and the mold cost was high. Moreover, since the fluid system mechanism is also provided within the upper mold, the fluid is easily affected by heat and it is difficult to seal the fluid.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned technical background, and its purpose is to simplify the mold structure by sharing a molding pressure regulating valve.

[Disclosure of the invention]

The molding pressure adjustment mechanism of the encapsulation molding apparatus of the present invention includes a plunger 3 that moves up and down relative to the lower mold 1 in a vertical hole 2 provided in the lower mold 1, and a plunger 3 that moves up and down with respect to the lower mold 1. A pot 4 for charging the molding material a is formed, a through hole 6 is bored through the upper mold 5 at a position opposite to the pot 4 facing the lower mold 1, and the upper mold 5 is attached. A retractable molding pressure regulating valve 9 provided on the upper die plate 8 of the molding device 7 is fitted into the through hole 6, and the molding pressure regulating valve 9 is urged to protrude by a fluid whose pressure can be freely adjusted. It is characterized by this. Therefore, when the plunger 3 is driven to inject the molding material a in the pot 4 into the molds (upper mold 5 and lower mold 1), the molding pressure regulating valve 9 moves back to remove the excess molding material a. Moreover, since the molding pressure regulating valve 9 is incorporated into the upper die plate 8 of the molding device 7, the molding pressure regulating valve 9 can be separated from the mold and used in common, and can be adjusted for each mold. Since there is no need to incorporate a molding pressure regulating valve 9 into the mold, the structure of the mold can be simplified. Furthermore, since the fluid system mechanism is also provided on the upper die plate 8, the fluid is less susceptible to heat effects and the fluid can be easily sealed. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. 1 is a lower mold, and a cavity 10, a runner 11, etc. are provided on the mating surface P of the lower mold 1 with the upper mold 5, and the lower mold 1 is provided at the end of the runner 11.
A vertical hole 2 is bored through the hole in the vertical direction.
12 is an ejector pin provided in accordance with the position of the cavity 10, 3 is a plunger slidably inserted into the vertical hole 2 from below, and the plunger 3 is adapted to move up and down within the vertical hole 2. There is. Further, a pot 4 is formed on the upper surface of the plunger 3 in the vertical hole 2 for charging the molding material a. Reference numeral 5 denotes an upper mold that moves up and down to face the lower mold 1, and a through hole 6 is bored in the upper mold 5 so as to face the pot 4. Upper mold 5 and lower mold 1
are detachably attached to the upper die plate 8 and lower die plate 13, respectively, with bolts 14 in the press section of the molding device 7, so that the molds can be replaced. The molding pressure regulating valve 9 is provided on the upper die plate 8 to which the upper mold 5 is attached, and the lower end of the molding pressure regulating valve 9 is slidably inserted into the through hole 6 of the upper mold 5. The molding pressure regulating valve 9 consists of a rod-shaped slide valve 15 and a drive part 16 driven by fluid pressure (hydraulic pressure). The lower end of the valve 15 is inserted into the through hole 6 as described above.
The drive unit 16 has a structure as shown in FIGS. 2 and 3, with a fluid chamber 18 formed at the end of a fluid passage 17, and a drive pair 19 installed in the fluid chamber 18. The opposing body 19 is elastically urged in the backward direction by a spring 20. And the driving body 19
The lower end of the slide valve 15 is brought into contact with the upper end of the slide valve 15 . Further, by connecting a pressure transmission pipe (not shown) to the fluid passage 17, the fluid pressure inside the fluid chamber 18 can be controlled from a distance. As described above, the pots 4, plungers 3, molding pressure regulating valves 9, etc. are provided at a plurality of locations, making it possible to take out a large number of molded products. Therefore, during molding, insert electronic components etc. are placed in the cavity 10 of the lower mold 1, and a predetermined amount of molding material a is put into the pot 4.
When the upper mold 5 is lowered from above and combined with the lower mold 1, the pot 4 is closed by the molding pressure regulating valve 9 (slide valve 15) inserted into the through hole 6. The molding pressure regulating valve 9 is configured such that fluid pressure is applied to the driver 19 in advance to cause the driver 19 to protrude against the spring 20, thereby lowering the slide valve 15. This fluid pressure can be remotely adjusted depending on molding conditions and the like. Simultaneously with the start of molding, the plunger 3 rises to narrow the inside of the pot 4, pressurizes the molding material a in the pot 4, and injects it into the cavity 10. If there is too much molding material a poured into the pot 4 at this time, the molding pressure regulating valve 9 is retracted by the injection pressure, as shown in FIG. By keeping the injection pressure constant, it is possible to avoid applying excessive pressure to electronic components, etc., and excess molding material a remains in the through hole 6 as a cull 21. Thereafter, when the mold is opened, the cull 21 is pushed out by the molding pressure regulating valve 9, and the molded product is pushed out by the ejector pin 12. In addition, the molding pressure adjustment valve 9 is shared, and when replacing the upper and lower molds 5 and 1, when the molds 5 and 1 are removed from the upper and lower die plates 8 and 13, the molding pressure adjustment valve 9 is removed from the upper die plate. remaining on the plate 8, another mold 5,1
When the molding pressure regulating valve 9 is attached to the die plates 8 and 13, the molding pressure regulating valve 9 is inserted into the through hole 6 of the upper mold 5.

【Effect of the invention】

As described above, in the present invention, the molding pressure regulating valve is built into the upper die plate of the molding device, so the molding pressure regulating valve can be separated from the mold and used in common, and the molding pressure regulating valve can be installed separately for each molding die. This has the advantage of simplifying the structure of the mold because there is no need to incorporate it, and therefore reducing mold costs. Furthermore, since the fluid system mechanism is also provided on the upper die plate, the fluid is less susceptible to heat effects and the fluid can be easily sealed.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway front view showing one embodiment of the present invention, FIG. 2 is an enlarged sectional view of the X section in FIG. 1, and FIG.
The figure is a Y arrow view in Figure 2, and Figure 4 is an explanatory view of the same operation as above, where 1 is the lower mold, 2 is the vertical hole, 3 is the plunger, 4 is the pot, 5 is the upper mold, and 6 is the upper mold. 7 is a molding device, 8 is an upper die plate, 9 is a molding pressure regulating valve, and a is a molding material.

Claims (1)

[Claims] 1. A plunger that moves up and down relative to the lower mold is housed in a vertical hole provided in the lower mold, and a pot for charging molding material is formed on the upper surface of the plunger in the vertical hole, facing the lower mold. A through hole penetrating vertically is bored at a position facing the pot of the upper mold, and a retractable molding pressure regulating valve provided on the upper die plate of the molding device to which the upper mold is attached is inserted into the through hole. 1. A molding pressure adjustment mechanism for a sealing molding apparatus, characterized in that a molding pressure adjustment valve is biased to protrude by a fluid that is inserted and whose pressure can be adjusted freely.