JPH0374523B2 - - Google Patents

Info

Publication number
JPH0374523B2
JPH0374523B2 JP11050283A JP11050283A JPH0374523B2 JP H0374523 B2 JPH0374523 B2 JP H0374523B2 JP 11050283 A JP11050283 A JP 11050283A JP 11050283 A JP11050283 A JP 11050283A JP H0374523 B2 JPH0374523 B2 JP H0374523B2
Authority
JP
Japan
Prior art keywords
cavity
inductor
support plate
high frequency
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11050283A
Other languages
Japanese (ja)
Other versions
JPS603204A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11050283A priority Critical patent/JPS603204A/en
Publication of JPS603204A publication Critical patent/JPS603204A/en
Publication of JPH0374523B2 publication Critical patent/JPH0374523B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/205Comb or interdigital filters; Cascaded coaxial cavities

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Description

【発明の詳細な説明】 この発明はUHF等の高周波信号を取り扱う様
にしている高周波フイルタ装置、詳しくは基板
に、キヤビテイと各々のキヤビテイ内に備えさせ
た内部導体要素とから成る高周波フイルタを備え
させて成る高周波フイルタ装置の組立方法に関す
るものである。
[Detailed Description of the Invention] The present invention relates to a high frequency filter device for handling high frequency signals such as UHF, and more specifically, a high frequency filter device comprising a cavity and an internal conductor element provided in each cavity on a substrate. The present invention relates to a method of assembling a high-frequency filter device made of the following methods.

従来の高周波フイルタ装置の組立方法にあつて
基板にキヤビテイを取付け、そのキヤビテイの狭
い内部空間に対してインダクタを組み込むと共
に、更に上記内部空間において上記のインダクタ
の両側に夫々結合要素を組込むようにしていた方
法は、非常に細かい作業をせねばならぬ関係上、
その作業がやりにくく、またそのような作業によ
つて出来上つた製品は高周波特性が予め予定され
たものから狂つてしまうという欠点があつた。
In the conventional method of assembling a high frequency filter device, a cavity is attached to a substrate, an inductor is installed in the narrow internal space of the cavity, and coupling elements are installed on both sides of the inductor in the internal space. This method requires very detailed work, so
This work is difficult to perform, and the products produced by such work have the disadvantage that the high frequency characteristics deviate from the predetermined ones.

そこで本発明は、上述の欠点を除くようにした
もので、組立作業が容易でしかも出来上つたもの
の高周波特性も良好となるようにした高周波フイ
ルタ装置の組立方法を提供しようとするものであ
る。
SUMMARY OF THE INVENTION The present invention aims to eliminate the above-mentioned drawbacks and provide a method for assembling a high-frequency filter device that is easy to assemble and has good high-frequency characteristics.

以下本願の実施例を示す図面について説明す
る。第1図乃至第8図において、高周波フイルタ
装置Aは基板1とその基板に取付けた高周波フイ
ルタ(バンドパスフイルタ)Bとから成る。上記
基板1は絶縁板2の表面と裏面に夫々導体箔(銅
箔)3,4を貼り付けて形成してある。それら導
体箔3,4はアース導体を形成している。尚この
基板1は銅板、鉄板などの導電性の良好な金属板
で形成してもよい。上記基板1において、5はコ
ンデンサ止付部、6はインダクタ止付部で、これ
らは夫々透孔をもつて構成してある。7はキヤビ
テイ止付部を示し、複数の角孔8をもつて構成し
てある。次に高周波フイルタBにおいて、10,
10は夫々キヤビテイを示し、本実施例において
は夫々銅板あるいは鉄板に銅メツキを施したもの
など導電性の良好な金属板で形成された側板11
を3枚と妻板12を2枚図示されるように組み合
わせ、相互に半田付して結合することによつて、
二つのキヤビテイ10,10が一体に形成されて
いる。(中間の側板11は両キヤビテイ10,1
0に兼用されている。)上記側板11及び妻板1
2において、13は嵌合部、14は嵌合片で、こ
れらは側板11と妻板12を組合わす際に相互の
位置関係が所定の通りとなるようにする為に設け
られたものである。15は支持板取付部で、側板
11の一部を曲げ起こすことによつて形成されて
おり、またねじ孔16が穿設されている。17は
欠如部で、その下縁17aの高さは取付部15の
高さよりも低く形成して、後述の支持板が接触せ
ぬようにしてある。18は蓋体止付片で、基部1
8aを図示される如く細く形成してある。19は
止付片を示す。次にキヤビテイ10内に備えさせ
た部材について説明する。21はバリコンで、接
地端子22とインダクタ接続端子23を有してお
り、接地端子22を止付ねじ棒24によつて基板
1に止め付けてある。尚止付ねじ棒24としては
導電材料(金属)で形成したものが用いてあり、
このねじ棒24によつて接地端子22と基板1の
裏面の導体箔4が相互に導通するようにしてあ
る。25はインダクタで、本体25aと支持部2
5bとから成る。支持部25bは基板1に対し本
体25aを機械的に止付ける役割と本体25aの
一端を基板1のアース導体(導体箔4)に電気的
に接続する役割をもつている。支持部25bは位
置決片26を有しており、支持部25bの下端を
基板1に取り付けた状態において、インダクタ2
5の本体25aが基板1から所定の高さのところ
に位置するようにしてある。次に28は支持板
で、絶縁板29の一面に導体箔(銅箔)を貼り付
けたもの(プリント基板と称される)で形成され
ている。この支持板28において、30,30は
キヤビテイ内在部で、ちようどキヤビテイ10,
10内に納まるようキヤビテイ10の内寸と対応
した寸法に形成してある。31は切欠き部、3
2,32は端子部、33は止付ねじ棒挿通用の透
孔を夫々示す。34は調整孔で、バリコン21の
回転軸と投影的に重合する位置に形成してある。
次に導体箔に印刷配線手段(エツチング手段)を
施すことによつて形成された種々の導体におい
て、35,35はアース部、36,36は端子
で、一方は入力端子、他方は出力端子として夫々
利用される。37は接続導体である。38,39
は夫々結合要素を示し、各々の一端はアース部3
5につながつていると共に、他端は端子36ある
いは接続導体37につながつている。次に40は
調整用のトリマコンデンサで、接続導体37とア
ース部35との間に接続してある。41は蓋で、
導電性の良好な材料(例えば銅板)をプレスして
形成されており、前記バリコン21の軸、トリマ
コンデンサ40の軸と夫々投影的に重合する箇所
に調整棒挿入用の透孔42,43を有しており、
又止付用の透孔44も有している。尚この蓋41
はキヤビテイ10の内部の空間を遮蔽するように
なつている。
The drawings showing the embodiments of the present application will be described below. 1 to 8, a high frequency filter device A consists of a substrate 1 and a high frequency filter (bandpass filter) B attached to the substrate. The substrate 1 is formed by pasting conductor foils (copper foils) 3 and 4 on the front and back surfaces of an insulating plate 2, respectively. These conductor foils 3 and 4 form a ground conductor. Note that this substrate 1 may be formed of a metal plate with good conductivity, such as a copper plate or an iron plate. In the substrate 1, 5 is a capacitor fixing part, and 6 is an inductor fixing part, each of which has a through hole. Reference numeral 7 indicates a cavity fixing portion, which is constructed with a plurality of square holes 8. Next, in the high frequency filter B, 10,
Reference numerals 10 indicate cavities, and in this embodiment, side plates 11 each made of a metal plate with good conductivity, such as a copper plate or an iron plate plated with copper.
By combining the three pieces and the two end plates 12 as shown in the figure and joining them by soldering to each other,
Two cavities 10, 10 are integrally formed. (The middle side plate 11 has both cavities 10, 1
It is also used as 0. ) Said side plate 11 and end plate 1
2, 13 is a fitting portion, and 14 is a fitting piece, which are provided to ensure that the mutual positional relationship is as specified when the side plate 11 and end plate 12 are combined. Reference numeral 15 denotes a support plate attachment part, which is formed by bending and raising a part of the side plate 11, and has a screw hole 16 bored therein. Reference numeral 17 denotes a recessed portion, and the height of the lower edge 17a thereof is formed lower than the height of the mounting portion 15 so that a supporting plate, which will be described later, does not come into contact with it. 18 is a lid fixing piece, which is attached to the base 1.
8a is formed thin as shown in the figure. 19 indicates a fastening piece. Next, the members provided inside the cavity 10 will be explained. Reference numeral 21 denotes a variable capacitor, which has a ground terminal 22 and an inductor connection terminal 23, and the ground terminal 22 is fixed to the board 1 by a fixing threaded rod 24. The threaded rod 24 with a stopper is made of a conductive material (metal).
This threaded rod 24 allows the ground terminal 22 and the conductor foil 4 on the back surface of the substrate 1 to be electrically connected to each other. 25 is an inductor, which includes the main body 25a and the support part 2.
5b. The support portion 25b has the role of mechanically fixing the main body 25a to the substrate 1 and the role of electrically connecting one end of the main body 25a to the ground conductor (conductor foil 4) of the substrate 1. The support portion 25b has a positioning piece 26, and when the lower end of the support portion 25b is attached to the substrate 1, the inductor 2
5 is positioned at a predetermined height from the substrate 1. Next, reference numeral 28 denotes a support plate, which is formed by pasting a conductor foil (copper foil) on one surface of an insulating plate 29 (referred to as a printed circuit board). In this support plate 28, 30, 30 are internal parts of the cavity, just like the cavity 10,
It is formed to have dimensions corresponding to the inner dimensions of the cavity 10 so as to fit within the cavity 10. 31 is a notch, 3
2 and 32 are terminal portions, and 33 is a through hole through which a set screw rod is inserted. Reference numeral 34 denotes an adjustment hole, which is formed at a position that overlaps the rotation axis of the variable capacitor 21 in projection.
Next, in various conductors formed by printing wiring means (etching means) on conductor foil, 35, 35 are ground parts, 36, 36 are terminals, one as an input terminal and the other as an output terminal. Each is used. 37 is a connecting conductor. 38, 39
each represents a coupling element, and one end of each is connected to the ground part 3.
5, and the other end is connected to a terminal 36 or a connecting conductor 37. Next, 40 is a trimmer capacitor for adjustment, which is connected between the connecting conductor 37 and the ground portion 35. 41 is the lid,
It is formed by pressing a material with good conductivity (for example, a copper plate), and has through holes 42 and 43 for inserting adjustment rods at locations that projectively overlap with the axis of the variable capacitor 21 and the axis of the trimmer capacitor 40, respectively. has,
It also has a through hole 44 for fastening. Furthermore, this lid 41
is adapted to shield the space inside the cavity 10.

次に上記構成のものの組み立手順を説明する。
先ず第4図に示されるように基板1のバリコン止
付部5にバリコン21を止付ねじ棒で止付ける。
次にインダクタ25の支持部25bを止付部6に
挿通してアース導体4に半田付すると共に、イン
ダクタ本体25aの一端を接続端子23に半田付
けする。なお上記支持部25bの半田付けは基板
の表面にあるアース導体3と半田付けしても、あ
るいは両方3,4に半田付けしてもよい。
Next, the procedure for assembling the above structure will be explained.
First, as shown in FIG. 4, the variable capacitor 21 is fixed to the variable condenser fixing portion 5 of the substrate 1 with a fixing threaded rod.
Next, the support portion 25b of the inductor 25 is inserted through the fastening portion 6 and soldered to the ground conductor 4, and one end of the inductor body 25a is soldered to the connection terminal 23. Note that the support portion 25b may be soldered to the ground conductor 3 on the surface of the board, or may be soldered to both 3 and 4.

次に予め第4図に示されるように組立てておい
たキヤビテイ10,10を組み付ける。この組付
けは、各止付片19を各角孔8に差し通し、その
先端を導体箔4に半田付することにより行なう。
Next, the cavities 10, which have been assembled in advance as shown in FIG. 4, are assembled. This assembly is carried out by inserting each fastening piece 19 into each square hole 8 and soldering its tip to the conductor foil 4.

尚キヤビテイ10の止付は、コンデンサ21及
びインダクタ25の組付より先に行なつてもよ
い。
Incidentally, the cavity 10 may be fixed before the capacitor 21 and the inductor 25 are assembled.

次に予めトリマコンデンサ40が取付けられた
支持板28を、キヤビテイ内在部30,30が各
キヤビテイ10,10内に納まつてそれらの縁部
が取付部15の上に乗るように組み込み、止付ね
じ棒45を透孔33を通してねじ孔16に螺着さ
せて、上記支持板28をキヤビテイ10に一体化
固定する。これにより、アース部35は取付部1
5を介してキヤビテイ10と導通状態(同電位の
状態)となる。また各キヤビテイ10内における
結合要素38,39は第3図に示される如くイン
ダクタ25の両側において設計上予定された位置
関係で並設状態となる。
Next, the support plate 28 to which the trimmer capacitor 40 is attached in advance is assembled so that the cavity internal parts 30, 30 are housed in each cavity 10, 10, and their edges rest on the mounting part 15, and fixed. The support plate 28 is integrally fixed to the cavity 10 by screwing the threaded rod 45 into the screw hole 16 through the through hole 33. As a result, the ground portion 35 is connected to the mounting portion 1.
It becomes electrically conductive (at the same potential) with the cavity 10 via the capacitor 5. Further, the coupling elements 38 and 39 in each cavity 10 are arranged side by side on both sides of the inductor 25 in a designed positional relationship as shown in FIG.

次に蓋41を止付片18が透孔44に差し通る
ように被せつけ、止付片18の透孔44から突出
した部分をねじり変形させることによつて蓋41
をキヤビテイ10に固定する。
Next, cover the lid 41 so that the fastening piece 18 passes through the through hole 44, and twist and deform the portion of the fastening piece 18 that protrudes from the through hole 44.
is fixed to the cavity 10.

以上のような操作によつてフイルタ装置Aが完
成する。
The filter device A is completed by the above operations.

上記構成のものにあつては、図示外のリード線
を介して一方の端子36(入力端子)に入力され
た高周波信号(例えばUHFのテレビ信号)は一
方のキヤビテイ10内においてその端子36に連
なる結合要素38に伝わり、更にキヤビテイ10
内の各部材相互の周知の電気的結合を通して結合
要素39に伝わる。更にその信号は接続導体37
を通して他方のキヤビテイ10内の結合要素39
に伝えられ、そのキヤビテイ10内の部材の周知
の電気的結合を通して結合要素38に伝わり、そ
こを通して他方の端子36(出力端子)に伝わ
る。このようにして上記信号が高周波フイルタB
を通過する過程で周知のフイルタ作用が行なわ
れ、フイルタBに入力する信号が多数であつて
も、そのうちの所定の帯域の信号のみが出力側の
端子36に現われる。
In the case of the above configuration, a high frequency signal (for example, a UHF television signal) inputted to one terminal 36 (input terminal) via a lead wire not shown is connected to that terminal 36 within one cavity 10. is transmitted to the coupling element 38 and further to the cavity 10.
The signal is transmitted to the coupling element 39 through well-known electrical coupling between the members within. Furthermore, the signal is transmitted to the connecting conductor 37
coupling element 39 in the other cavity 10 through
is transmitted to the coupling element 38 through well-known electrical coupling of components within the cavity 10, and therethrough to the other terminal 36 (output terminal). In this way, the above signal is passed through the high frequency filter B.
In the process of passing through the filter B, a well-known filtering effect is performed, and even if there are a large number of signals input to the filter B, only signals in a predetermined band among them appear at the output terminal 36.

次に本願の異なる実施例を示す図面第9図につ
いて説明する。この図は支持板28eに更に他の
回路導体を備えさせた例を示すものである。図に
おいて、支持板28eは絶縁板29eの表裏両面
に導体箔を備えたもので形成してある。裏面の導
体箔には前実施例と同様の種々の導体が形成して
ある一方、表面の導体箔にはアース部45,45
及び結合度調整要素46が形成してある。尚この
結合度調整要素46は、該支持板28eをキヤビ
テイに取付けた状態において前記インダクタと投
影的に重合する位置に形成してある。
Next, FIG. 9, which shows a different embodiment of the present application, will be described. This figure shows an example in which the support plate 28e is further provided with other circuit conductors. In the figure, the support plate 28e is formed of an insulating plate 29e with conductive foil on both sides. The conductor foil on the back side has various conductors similar to those in the previous embodiment, while the conductor foil on the front side has ground parts 45, 45.
and a coupling degree adjusting element 46 are formed. The degree of coupling adjustment element 46 is formed at a position where it overlaps the inductor in projection when the support plate 28e is attached to the cavity.

上記のような構成のものは、それを前記キヤビ
テイに取付けて使用した場合、第10図に2点鎖
線で示されるような特性を示して帯域を広くする
ことができる。このような特性をもつフイルタは
複数のチヤンネルを通過させるバンドパスフイル
タとして用いるに好都合である。また上記使用状
態において調整要素46とアース部45とを符号
47,47…で示される位置で半田付して接続す
ると、第10図で実線で示されるような特性を示
して帯域を狭くすることができる。このような特
性をもつフイルタは単チヤンネルを通過させるバ
ンドパスフイルタとして用いるに好都合である。
When the device having the above structure is used by being attached to the cavity, it exhibits the characteristics shown by the two-dot chain line in FIG. 10 and can widen the band. A filter with such characteristics is conveniently used as a bandpass filter that passes a plurality of channels. Furthermore, when the adjustment element 46 and the grounding part 45 are connected by soldering at the positions indicated by numerals 47, 47, etc. in the above-mentioned state of use, the characteristic shown by the solid line in FIG. 10 is exhibited and the band is narrowed. I can do it. A filter with such characteristics is conveniently used as a bandpass filter that passes a single channel.

尚上記調整要素46は両端がアース部45,4
5に夫々つながつた状態に形成しておいて、所望
によりその接続部分をナイフ等でカツトするよう
にしてもよい。
The adjustment element 46 has both ends connected to the ground portions 45, 4.
5, and the connected portions may be cut with a knife or the like, if desired.

尚機能上前図のものと同一又は均等構成と考え
られる部分には、前図と同一の符号にアルフアベ
ツトのeを付して重複する説明を省略した。(ま
た次図のものにおいても同様の考えでfを付して
重複する説明を省略する。) 次に第11図は本願の更に異なる実施例を示す
もので、より多数のフイルタが並設されているフ
イルタ装置の例を示すものである。
It should be noted that parts that are functionally the same or equivalent to those in the previous figure are given the same reference numerals as those in the previous figure with an alphanumeric letter "e", and redundant explanations are omitted. (Also, in the following figure, the same idea is given by f and redundant explanation is omitted.) Next, Fig. 11 shows a further different embodiment of the present application, in which a larger number of filters are arranged in parallel. This figure shows an example of a filter device.

以上のようにこの発明にあつては、 (イ) 組立に当つてインダクタ25を組付ける場
合、結合要素38,39の組付に先立つてそれ
を行なうから、インダクタ25を1本単独で組
付ければよく(両横に結合要素38,39を並
べて取付ける必要がないから)、極めて作業性
良く(3本を並べて取付けるのに比べて大巾に
簡単に)組付けできる効果がある。
As described above, in this invention, (a) When the inductor 25 is assembled during assembly, it is done before the coupling elements 38 and 39 are assembled, so it is not necessary to assemble one inductor 25 alone. (because there is no need to mount the coupling elements 38, 39 side by side on both sides) and workability is very good (much easier than mounting three pieces side by side).

(ロ) またキヤビテイ10の組付に関しても同様
に、その止付はキヤビテイ単独で容易に行ない
得る効果がある。
(b) Also, regarding the assembly of the cavity 10, there is an effect that the attachment can be easily carried out by the cavity alone.

(ハ) 更にインダクタ25及びキヤビテイ10を基
板1に止付けた状態においては、キヤビテイ1
0及びインダクタ25を基板1を中心に位置決
でき、相互の位置関係を設計上予定された位置
関係にすることができる特長がある。
(c) Furthermore, when the inductor 25 and the cavity 10 are fixed to the substrate 1, the cavity 1
0 and the inductor 25 can be positioned centering on the substrate 1, and the mutual positional relationship can be set to the designed positional relationship.

(ニ) その上、2本の結合要素38,39をインダ
クタ25の両側に各1本宛位置するように組付
ける場合、それらの結合要素38,39は、予
めキヤビテイ10との位置関係が定まるように
してある支持板28に印刷配線手段で形成して
あるから、上記支持板28をキヤビテイ10に
設けられた取付部15に取付けるだけでそれら
両結合要素38,39の所定位置への組付を完
了でき、組付作業を極めて簡易に行ない得る効
果もある。
(d) Furthermore, when assembling the two coupling elements 38 and 39 so that one each is located on both sides of the inductor 25, the positional relationship of the coupling elements 38 and 39 with the cavity 10 is determined in advance. Since the supporting plate 28 is formed using printed wiring means, the connecting elements 38 and 39 can be assembled at predetermined positions simply by attaching the supporting plate 28 to the mounting portion 15 provided in the cavity 10. This also has the effect of making the assembly work extremely easy.

(ホ) しかも上記のようにして個々別々に組付を行
なうものでも、組付完了状態においては、上記
のようにキヤビテイ10とインダクタ25、キ
ヤビテイ10と両結合要素38,39、インダ
クタ25と両結合要素38,39の位置関係が
定まり、設計上予定された高周波特性を正しく
得ることのできる効果がある。
(e) Moreover, even if the assembly is performed individually as described above, in the assembled state, the cavity 10 and the inductor 25, the cavity 10 and both coupling elements 38 and 39, and the inductor 25 and both The positional relationship between the coupling elements 38 and 39 is determined, and there is an effect that the designed high frequency characteristics can be correctly obtained.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本願の実施例を示すもので、第1図は斜
視図、第2図は−線断面図、第3図は−
線断面図、第4図はキヤビテイを組付ける前の状
態を示す斜視図、第5図は支持板を組付ける前の
状態を示す斜視図、第6図は支持板の裏面図、第
7図は立体回路図、第8図はキヤビテイの分解斜
視図、第9図は支持板の異なる例を示す斜視図、
第10図は特性図、第11図は複数連結状のフイ
ルタ装置において支持板のみを離間させて内部構
造が認視できるようにした状態の図。 1…基板、10…キヤビテイ、25…インダク
タ、28…支持板、38,39…結合要素。
The drawings show an embodiment of the present application, and FIG. 1 is a perspective view, FIG. 2 is a cross-sectional view taken along the - line, and FIG. 3 is a - line sectional view.
4 is a perspective view showing the state before the cavity is assembled, FIG. 5 is a perspective view showing the state before the support plate is assembled, FIG. 6 is a back view of the support plate, and FIG. 7 is a three-dimensional circuit diagram, FIG. 8 is an exploded perspective view of the cavity, and FIG. 9 is a perspective view showing different examples of the support plate.
FIG. 10 is a characteristic diagram, and FIG. 11 is a diagram of a multi-connected filter device in which only the support plates are separated so that the internal structure can be seen. DESCRIPTION OF SYMBOLS 1... Substrate, 10... Cavity, 25... Inductor, 28... Support plate, 38, 39... Coupling element.

Claims (1)

【特許請求の範囲】[Claims] 1 基板には、キヤビテイとキヤビテイ内に備え
させた内部導体要素とから成る高周波フイルタを
付設し、しかも上記内部導体要素は、インダクタ
とそのインダクタの両側に各1本宛並設させた結
合要素とにより構成している高周波フイルタ装置
の組立方法において、上記基板にはキヤビテイ止
付部とインダクタ止付部とを予め設けておき、一
方上記キヤビテイには支持板取付部を予め設けて
おき、他方、上記結合要素は、上記支持板取付部
への取付を可能に形成した支持板に対して、印刷
配線手段でもつて予め付設しておき、組立に当つ
ては、上記キヤビテイ止付部及びインダクタ止付
部に夫々キヤビテイ及びインダクタを止付け、然
る後、上記結合要素が付設されている支持板を上
記支持板取付部に取付けることを特徴とする高周
波フイルタ装置の組立方法。
1. A high frequency filter consisting of a cavity and an internal conductor element provided in the cavity is attached to the board, and the internal conductor element has an inductor and a coupling element arranged in parallel on each side of the inductor. In the method for assembling a high frequency filter device, the substrate is provided with a cavity fixing portion and an inductor fixing portion in advance, the cavity is provided with a support plate attaching portion in advance, and the other, The above-mentioned coupling element is attached in advance by printed wiring means to the support plate formed so as to be able to be attached to the above-mentioned support plate attachment part. A method for assembling a high frequency filter device, comprising the steps of: fixing a cavity and an inductor to the respective portions; and then attaching a support plate to which the coupling element is attached to the support plate mounting portion.
JP11050283A 1983-06-20 1983-06-20 Assembling method of high frequency filter device Granted JPS603204A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11050283A JPS603204A (en) 1983-06-20 1983-06-20 Assembling method of high frequency filter device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11050283A JPS603204A (en) 1983-06-20 1983-06-20 Assembling method of high frequency filter device

Publications (2)

Publication Number Publication Date
JPS603204A JPS603204A (en) 1985-01-09
JPH0374523B2 true JPH0374523B2 (en) 1991-11-27

Family

ID=14537387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11050283A Granted JPS603204A (en) 1983-06-20 1983-06-20 Assembling method of high frequency filter device

Country Status (1)

Country Link
JP (1) JPS603204A (en)

Also Published As

Publication number Publication date
JPS603204A (en) 1985-01-09

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