JPH0229718Y2 - - Google Patents

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Publication number
JPH0229718Y2
JPH0229718Y2 JP1983065620U JP6562083U JPH0229718Y2 JP H0229718 Y2 JPH0229718 Y2 JP H0229718Y2 JP 1983065620 U JP1983065620 U JP 1983065620U JP 6562083 U JP6562083 U JP 6562083U JP H0229718 Y2 JPH0229718 Y2 JP H0229718Y2
Authority
JP
Japan
Prior art keywords
capacitor
capacitor elements
metal substrate
shaped metal
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983065620U
Other languages
Japanese (ja)
Other versions
JPS59171327U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6562083U priority Critical patent/JPS59171327U/en
Publication of JPS59171327U publication Critical patent/JPS59171327U/en
Application granted granted Critical
Publication of JPH0229718Y2 publication Critical patent/JPH0229718Y2/ja
Granted legal-status Critical Current

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  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【考案の詳細な説明】 技術分野 本考案はVHFチユーナの高周波回路のバイパ
スコンデンサとして最適な磁器コンデンサブロツ
クに関するものである。
[Detailed Description of the Invention] Technical Field The present invention relates to a ceramic capacitor block that is optimal as a bypass capacitor for the high frequency circuit of a VHF tuner.

従来技術 従来のVHFチユーナのバイパスコンデンサブ
ロツクは、例えば実公昭51−45463号公報に開示
されているように、プリント基板に多数の個別の
円筒貫通型磁器コンデンサを装着するか、又は共
通の誘電体磁器基板に多数のコンデンサを設ける
ことによつて構成されている。
Prior Art The bypass capacitor block of a conventional VHF tuner is constructed by mounting a large number of individual cylindrical through-type ceramic capacitors on a printed circuit board, or by mounting a common dielectric It is constructed by providing a large number of capacitors on a ceramic substrate.

ところで、前者の個別の円筒貫通型磁器コンデ
ンサを使用してブロツクを構成する場合には、円
筒型誘電体磁器の内部電極に貫通導体を半田付け
し且つ外部電極に鍔状外部端子を半田付けした円
筒貫通型磁器コンデンサを予め用意し、これをプ
リント基板に装着しなければならなかつた。従つ
て、組立工程が必然的に複雑になつた。一方、後
者の共通の磁器基板に多数の貫通型コンデンサを
形成する場合には、1つのコンデンサが不良にな
ればコンデンサブロツク全体が不良になるという
問題及び破損し易いという問題があつた。更に、
コンデンサブロツクに於けるコンデンサ素子の数
を変える必要がある場合には、コンデンサ素子の
数に対応した基板を用意する必要があり、必然的
にコスト高になつた。
By the way, in the case of constructing a block using the former individual cylindrical through-type ceramic capacitors, a through conductor is soldered to the internal electrode of the cylindrical dielectric ceramic, and a flange-shaped external terminal is soldered to the external electrode. It was necessary to prepare a cylindrical through-type ceramic capacitor in advance and attach it to the printed circuit board. Therefore, the assembly process has necessarily become complicated. On the other hand, in the latter case where a large number of feedthrough capacitors are formed on a common ceramic substrate, there is a problem that if one capacitor becomes defective, the entire capacitor block becomes defective and is easily damaged. Furthermore,
When it is necessary to change the number of capacitor elements in a capacitor block, it is necessary to prepare a board corresponding to the number of capacitor elements, which inevitably increases costs.

考案の目的 そこで、本考案の目的は製造が容易で且つコス
トの低減が可能である貫通型磁器コンデンサブロ
ツクを提供することにある。
OBJECT OF THE INVENTION Therefore, an object of the present invention is to provide a through-type ceramic capacitor block that is easy to manufacture and can reduce costs.

考案の構成 上記目的を達成するための本考案は、理解を容
易にするために実施例を示す図面の符号を参照し
て説明すると、円筒型誘電体磁器9と該磁器9の
内周面に設けられた内部電極10と前記磁器9の
外周面に設けられた外部電極11とから成る複数
の貫通型磁器コンデンサ素子2と、前記コンデン
サ素子2の両端に突出するように前記複数のコン
デンサ素子2を貫通孔13に夫々挿通され且つ前
記複数のコンデンサ素子2の前記内部電極10に
夫々結合されている複数の貫通導線3と、前記複
数のコンデンサ素子2を一定間隔で支持する帯状
金属基板1とから成り、前記帯状金属基板1はそ
の長手方向に沿つて一定間隔に設けられた複数の
開口7で前記複数のコンデンサ素子2を夫々支持
し、前記コンデンサ素子2の前記外部電極11を
弾性を有して保持する突出部8が前記開口7の縁
に設けられ、前記外部電極11が前記突出部8に
よる支持と半田14とによつて電気的及び機械的
に前記帯状金属基板1に結合され、且つ前記帯状
金属基板1に前記複数のコンデンサ素子2の相互
間を区画する切り込み溝5,6が設けられている
ことを特徴とする磁器コンデンサブロツクに係わ
るものである。
Structure of the Invention The present invention to achieve the above object will be described with reference to the reference numerals in the drawings showing the embodiments for ease of understanding. A plurality of through-type ceramic capacitor elements 2 each consisting of an internal electrode 10 provided and an external electrode 11 provided on the outer peripheral surface of the ceramic 9, and a plurality of capacitor elements 2 protruding from both ends of the capacitor element 2. a plurality of through conducting wires 3 respectively inserted into through holes 13 and coupled to the internal electrodes 10 of the plurality of capacitor elements 2; and a strip-shaped metal substrate 1 supporting the plurality of capacitor elements 2 at regular intervals. The band-shaped metal substrate 1 supports each of the plurality of capacitor elements 2 with a plurality of openings 7 provided at regular intervals along its longitudinal direction, and the outer electrode 11 of the capacitor element 2 has elasticity. A protrusion 8 is provided at the edge of the opening 7 to hold the external electrode 11, and the external electrode 11 is electrically and mechanically coupled to the strip metal substrate 1 by the support by the protrusion 8 and solder 14. The present invention also relates to a ceramic capacitor block characterized in that the band-shaped metal substrate 1 is provided with cut grooves 5 and 6 that partition the plurality of capacitor elements 2 from each other.

考案の作用効果 上記考案によれば次の作用効果が得られる。Effects of invention According to the above invention, the following effects can be obtained.

(イ) 弾性突出部8によつてコンデンサ素子2を金
属基板1に仮固定し、しかる後半田14で結合
することが可能な構成であるので、貫通型磁器
コンデンサ素子2に外部電極接続端子を特別に
設けないで基板1にコンデンサ素子2を装着す
ることが出来る。従つて、製造が簡略化され且
つコストが低減される。
(a) Since the structure allows the capacitor element 2 to be temporarily fixed to the metal substrate 1 by the elastic protrusion 8 and then connected with the solder 14, it is possible to connect the external electrode connection terminal to the through-type ceramic capacitor element 2. Capacitor element 2 can be mounted on substrate 1 without special provision. Therefore, manufacturing is simplified and costs are reduced.

(ロ) 帯状金属基板1に多数のコンデンサ素子2が
装着され且つ各素子2の間に切り込み溝5,6
が設けられているので、要求された任意数のコ
ンデンサ素子2を含むブロツクを溝5,6で切
断することによつて容易に提供することが出来
る。従つて、コストの低減が可能になる。
(b) A large number of capacitor elements 2 are mounted on a band-shaped metal substrate 1, and cut grooves 5, 6 are formed between each element 2.
, so that a block containing any required number of capacitor elements 2 can be easily provided by cutting with the grooves 5 and 6. Therefore, it is possible to reduce costs.

実施例 次に、第1図〜第6図を参照して本考案の実施
例に係わるVHFチユーナのバイパスコンデンサ
として使用するための貫通型磁器コンデンサブロ
ツクについて述べる。
Embodiment Next, a feedthrough ceramic capacitor block for use as a bypass capacitor for a VHF tuner according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6.

第5図及び第6図に示す完成したコンデンサブ
ロツクは、第2図に示す帯状金属基板1と第3図
に示す貫通型磁器コンデンサ素子2と第4図に示
す貫通導線3との組立体である。
The completed capacitor block shown in FIGS. 5 and 6 is an assembly of the strip-shaped metal substrate 1 shown in FIG. 2, the through-type ceramic capacitor element 2 shown in FIG. 3, and the through-hole conductor 3 shown in FIG. be.

帯状金属基板1は、まず、第1図に示す如く複
数のコンデンサ素子の装着予定部に切欠部4を設
け且つコンデンサ素子装着予定部相互間を区画す
るように両側面から切り込まれた切り込み溝5,
6を設け、これ等の作業と同時又は連続的に、第
2図に示す円形開口7及び突出部8が生じるよう
にプレス加工することにより得られる。突出部8
は第6図から明らから明らかなように基板1の裏
面側に円筒状に突出した部分であり、この実施例
では第1図の切欠部4を囲む4つの突出片に基づ
いて形成されている。金属基板1はリン青銅板も
しくは銅板の表面に半田メツキを施したものであ
り、突出部8は弾性を有している。また、コンデ
ンサ素子2を嵌装する前には、コンデンサ素子2
の外径よりも僅かに小さい内径を有して先細にな
るように突出部8が形成されている。
As shown in FIG. 1, the band-shaped metal substrate 1 is first provided with notches 4 in the parts where a plurality of capacitor elements are to be mounted, and grooves cut from both sides to partition the parts to which the capacitor elements are to be mounted. 5,
6, and press working simultaneously or continuously with these operations so that the circular opening 7 and protrusion 8 shown in FIG. 2 are formed. Projection part 8
As is clear from FIG. 6, this is a cylindrical portion projecting from the back side of the substrate 1, and in this embodiment, it is formed based on the four projecting pieces surrounding the notch 4 shown in FIG. . The metal substrate 1 is a phosphor bronze plate or a copper plate whose surface is soldered, and the protrusion 8 has elasticity. In addition, before fitting the capacitor element 2,
The protrusion 8 is formed to be tapered and have an inner diameter slightly smaller than the outer diameter.

磁器コンデンサ素子2は、第3図から明らかな
如く、円筒型誘電体磁器9と、この磁器9の円筒
内周面に形成された内部電極10と、磁器9の外
周面に形成された外部電極11とから成る。
As is clear from FIG. 3, the ceramic capacitor element 2 includes a cylindrical dielectric ceramic 9, an internal electrode 10 formed on the inner circumferential surface of the cylinder of the ceramic 9, and an external electrode formed on the outer circumferential surface of the ceramic 9. It consists of 11.

第4図に示す貫通導線3はコンデンサ素子2の
両端から夫々突出する長さに形成され且つ鍔部1
2を有している。
The through conductor wires 3 shown in FIG.
It has 2.

バイパスコンデンサブロツクを組立てる際に
は、弾性変形可能な先細突出部8を縁に有する
夫々の開口7にコンデンサ素子2を嵌合される。
コンデンサ素子2を開口7即ち先細突出部8の中
に挿入すると突出部8がその径が大になるように
弾性変形し、コンデンサ素子2の外部電極11を
弾性的に保持し、コンデンサ素子2の仮固定が達
成される。次に各コンデンサ素子2の貫通孔13
に導線3を挿入する。
When assembling the bypass capacitor block, a capacitor element 2 is fitted into each opening 7 having an elastically deformable tapered projection 8 at the edge.
When the capacitor element 2 is inserted into the opening 7, that is, the tapered protrusion 8, the protrusion 8 is elastically deformed to increase its diameter, elastically holding the external electrode 11 of the capacitor element 2, and reducing the diameter of the capacitor element 2. Temporary fixation is achieved. Next, the through hole 13 of each capacitor element 2
Insert conductor 3 into.

上述の如くして金属基板1とコンデンサ素子2
と導線3との組立体が用意出来たら、これを溶融
半田に浸漬し、第6図に示す如く、金属基板1と
外部電極11との間及び導線3と内部電極10と
の間を半田14で電気的及び機械的に結合する。
完成したコンデンサブロツクをVHFチユーナに
使用する場合には、チユーナで要求する数のコン
デンサ素子2を含むように、金属基板1を切り込
み溝5,6を利用して切断し、チユーナのシヤー
シに金属基板1を結合させる。
The metal substrate 1 and the capacitor element 2 are assembled as described above.
Once the assembly of the conductive wire 3 and the conductive wire 3 is prepared, it is immersed in molten solder, and as shown in FIG. electrically and mechanically connected.
When using the completed capacitor block in a VHF tuner, cut the metal substrate 1 using the grooves 5 and 6 so that it contains the number of capacitor elements 2 required by the tuner, and attach the metal substrate to the chassis of the tuner. Combine 1.

上述から明らかなように、本実施例によれば前
記イ,ロ項の作用効果が得られる。また、本実施
例によれば、ブロツク化のための帯状金属基板1
へのコンデンサ素子2の結合と貫通導線3の結合
とを同時に行うことが出来る。また、単一の貫通
型磁器コンデンサを容易に得ることが出来る。
As is clear from the above, according to this embodiment, the effects of items (a) and (b) above can be obtained. Further, according to this embodiment, the strip-shaped metal substrate 1 for blocking
The coupling of the capacitor element 2 to the capacitor element 2 and the coupling of the through conductive wire 3 can be performed simultaneously. Furthermore, a single through-type ceramic capacitor can be easily obtained.

以上本考案の実施例について述べたが、本考案
はこれに限定されるものでなく、更に変形可能な
ものである。例えば、第4図の貫通導線3を第3
図のコンデンサ素子2に予め半田結合したものを
糎第2図の基板1に装着してもよい。また、突出
部8をほぼ完全な円筒に形成してもよい。また、
基板1に一定間隔でシヤーシ等に取付けるための
貫通孔を設けてもよい。また、貫通導線3の鍔部
12を省いた構成とすることも出来る。
Although the embodiments of the present invention have been described above, the present invention is not limited thereto and can be further modified. For example, if the through conductor 3 in FIG.
The capacitor element 2 shown in the figure may be soldered in advance and attached to the substrate 1 shown in FIG. Further, the protrusion 8 may be formed into a substantially perfect cylinder. Also,
Through holes may be provided in the substrate 1 at regular intervals for attachment to a chassis or the like. Further, it is also possible to have a configuration in which the flange portion 12 of the through conductor 3 is omitted.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第6図は本考案の実施例に係わるコン
デンサブロツクを示すものであり、第1図は金属
基板の完成直前の状態を示す平面図、第2図は完
成した金属基板の平面図、第3図はコンデンサ素
子の断面図、第4図は貫通導線の一部を示す正面
図、第5図はコンデンサブロツクを半田を省いて
示す平面図、第6図はコンデンサブロツクの断面
図である。 1……帯状金属基板、2……磁器コンデンサ素
子、3……貫通導線、5,6……切り込み溝、7
……開口、8……突出部、9……円筒型誘電体磁
器、10……内部電極、11……外部電極、14
……半田。
1 to 6 show a capacitor block according to an embodiment of the present invention. FIG. 1 is a plan view showing the state of the metal substrate just before completion, and FIG. 2 is a plan view of the completed metal substrate. , Fig. 3 is a sectional view of the capacitor element, Fig. 4 is a front view showing part of the through conductor, Fig. 5 is a plan view showing the capacitor block without soldering, and Fig. 6 is a sectional view of the capacitor block. be. DESCRIPTION OF SYMBOLS 1... Band-shaped metal substrate, 2... Magnetic capacitor element, 3... Penetrating conductor, 5, 6... Cut groove, 7
... Opening, 8 ... Protrusion, 9 ... Cylindrical dielectric ceramic, 10 ... Internal electrode, 11 ... External electrode, 14
……solder.

Claims (1)

【実用新案登録請求の範囲】 円筒型誘電体磁器9と該磁器9の内周面に設け
られた内部電極10と前記磁器9の外周面に設け
られた外部電極11とから成る複数の貫通型磁器
コンデンサ素子2と、 前記コンデンサ素子2の両端に突出するように
前記複数のコンデンサ素子2の貫通孔13に夫々
挿通され且つ前記複数のコンデンサ素子2の前記
内部電極10に夫々結合されている複数の貫通導
線3と、 前記複数のコンデンサ素子2を一定間隔で支持
する帯状金属基板1と から成り、前記帯状金属基板1はその長手方向に
沿つて一定間隔に設けられた複数の開口7で前記
複数のコンデンサ素子2を夫々支持し、前記コン
デンサ素子2の前記外部電極11を弾性を有して
保持する突出部8が前記開口7の縁に設けられ、
前記外部電極11が前記突出部8による支持と半
田14とによつて電気的及び機械的に前記帯状金
属基板1に結合され、且つ前記帯状金属基板1に
前記複数のコンデンサ素子2の相互間を区画する
切り込み溝5,6が設けられていることを特徴と
する磁器コンデンサブロツク。
[Claims for Utility Model Registration] A plurality of penetrating types consisting of a cylindrical dielectric porcelain 9, an internal electrode 10 provided on the inner peripheral surface of the porcelain 9, and an external electrode 11 provided on the outer peripheral surface of the porcelain 9. a plurality of ceramic capacitor elements 2; and a plurality of ceramic capacitor elements 2, which are respectively inserted into the through holes 13 of the plurality of capacitor elements 2 so as to protrude from both ends of the capacitor element 2, and are respectively coupled to the internal electrodes 10 of the plurality of capacitor elements 2. and a band-shaped metal substrate 1 that supports the plurality of capacitor elements 2 at regular intervals, and the band-shaped metal substrate 1 has a plurality of openings 7 provided at regular intervals along its longitudinal direction. A protrusion 8 that supports each of the plurality of capacitor elements 2 and elastically holds the external electrode 11 of the capacitor element 2 is provided at the edge of the opening 7,
The external electrode 11 is electrically and mechanically coupled to the band-shaped metal substrate 1 through support by the protrusion 8 and solder 14, and the plurality of capacitor elements 2 are connected to each other on the band-shaped metal substrate 1. A porcelain capacitor block characterized in that it is provided with dividing grooves 5 and 6.
JP6562083U 1983-04-30 1983-04-30 porcelain capacitor block Granted JPS59171327U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6562083U JPS59171327U (en) 1983-04-30 1983-04-30 porcelain capacitor block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6562083U JPS59171327U (en) 1983-04-30 1983-04-30 porcelain capacitor block

Publications (2)

Publication Number Publication Date
JPS59171327U JPS59171327U (en) 1984-11-16
JPH0229718Y2 true JPH0229718Y2 (en) 1990-08-09

Family

ID=30195821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6562083U Granted JPS59171327U (en) 1983-04-30 1983-04-30 porcelain capacitor block

Country Status (1)

Country Link
JP (1) JPS59171327U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51130889A (en) * 1975-04-28 1976-11-13 Amp Inc Electric connector
JPS52102585A (en) * 1976-02-23 1977-08-27 Bendix Corp Connector
JPS5749131U (en) * 1980-09-04 1982-03-19

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54184445U (en) * 1978-06-20 1979-12-27
JPS6320063Y2 (en) * 1979-05-18 1988-06-03
JPS57119527U (en) * 1981-01-17 1982-07-24

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51130889A (en) * 1975-04-28 1976-11-13 Amp Inc Electric connector
JPS52102585A (en) * 1976-02-23 1977-08-27 Bendix Corp Connector
JPS5749131U (en) * 1980-09-04 1982-03-19

Also Published As

Publication number Publication date
JPS59171327U (en) 1984-11-16

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