JPH0373452U - - Google Patents

Info

Publication number
JPH0373452U
JPH0373452U JP13386589U JP13386589U JPH0373452U JP H0373452 U JPH0373452 U JP H0373452U JP 13386589 U JP13386589 U JP 13386589U JP 13386589 U JP13386589 U JP 13386589U JP H0373452 U JPH0373452 U JP H0373452U
Authority
JP
Japan
Prior art keywords
wafer
dedicated
size
recess
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13386589U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0727628Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989133865U priority Critical patent/JPH0727628Y2/ja
Publication of JPH0373452U publication Critical patent/JPH0373452U/ja
Application granted granted Critical
Publication of JPH0727628Y2 publication Critical patent/JPH0727628Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
JP1989133865U 1989-11-20 1989-11-20 ウエハ保持治具 Expired - Lifetime JPH0727628Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989133865U JPH0727628Y2 (ja) 1989-11-20 1989-11-20 ウエハ保持治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989133865U JPH0727628Y2 (ja) 1989-11-20 1989-11-20 ウエハ保持治具

Publications (2)

Publication Number Publication Date
JPH0373452U true JPH0373452U (h) 1991-07-24
JPH0727628Y2 JPH0727628Y2 (ja) 1995-06-21

Family

ID=31681251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989133865U Expired - Lifetime JPH0727628Y2 (ja) 1989-11-20 1989-11-20 ウエハ保持治具

Country Status (1)

Country Link
JP (1) JPH0727628Y2 (h)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006035484A1 (ja) * 2004-09-27 2008-05-15 三菱電機株式会社 半導体製造装置および半導体製造方法
WO2014162627A1 (ja) * 2013-04-02 2014-10-09 独立行政法人産業技術総合研究所 半導体プロセス用キャリア
WO2016010158A1 (ja) * 2014-07-14 2016-01-21 国立研究開発法人産業技術総合研究所 半導体プロセス用キャリア
JP2018066894A (ja) * 2016-10-20 2018-04-26 マッパー・リソグラフィー・アイピー・ビー．ブイ． 基板支持ユニット上に基板を位置合わせする方法および装置
US10133186B2 (en) 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
JP2022110940A (ja) * 2021-01-19 2022-07-29 株式会社アドバンテスト プローブカード及び電子部品試験装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02108331U (h) * 1989-02-15 1990-08-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02108331U (h) * 1989-02-15 1990-08-29

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006035484A1 (ja) * 2004-09-27 2008-05-15 三菱電機株式会社 半導体製造装置および半導体製造方法
JP4597137B2 (ja) * 2004-09-27 2010-12-15 三菱電機株式会社 半導体製造装置および半導体製造方法
WO2014162627A1 (ja) * 2013-04-02 2014-10-09 独立行政法人産業技術総合研究所 半導体プロセス用キャリア
JP5621142B2 (ja) * 2013-04-02 2014-11-05 独立行政法人産業技術総合研究所 半導体プロセス用キャリア
WO2016010158A1 (ja) * 2014-07-14 2016-01-21 国立研究開発法人産業技術総合研究所 半導体プロセス用キャリア
JP2016021465A (ja) * 2014-07-14 2016-02-04 国立研究開発法人産業技術総合研究所 半導体プロセス用キャリア
JP2018066894A (ja) * 2016-10-20 2018-04-26 マッパー・リソグラフィー・アイピー・ビー．ブイ． 基板支持ユニット上に基板を位置合わせする方法および装置
US10133186B2 (en) 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
JP2022110940A (ja) * 2021-01-19 2022-07-29 株式会社アドバンテスト プローブカード及び電子部品試験装置

Also Published As

Publication number Publication date
JPH0727628Y2 (ja) 1995-06-21

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