JPH0372755B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a decorative material suitable for floor and wall materials, and more particularly to a decorative material having a new scale. An object of the present invention is to produce a decorative material with a clear chip pattern and a rich three-dimensional effect even in the final product.

Methods for manufacturing decorative materials such as chip-patterned tiles have been known for a long time, and a method for manufacturing tiles is disclosed in Japanese Patent Publication No. 49-35815, but this method lacks a three-dimensional effect, and the inventors of the present invention The previously filed method (Japanese Patent Application No. 82259/1982) used a large amount of transparent resin, which was disadvantageous in terms of cost, and there was a need for an inexpensive method that would provide excellent three-dimensional effect.

The present invention forms an overlapping layer of thermoplastic resin chips of uniform thickness, overlies a thin layer of transparent resin that flows at a temperature lower than the softening temperature of the chips, and only the thin layer of transparent resin flows. The fluidized resin is heated to such an extent that it flows and penetrates between the chips, and a part of the thin layer-forming resin is coated on the surface of the chip layer, and then the chip layer and the thin layer are heated and heated. The object of the present invention is to provide a method for manufacturing a decorative material with a smooth surface and excellent durability, which is characterized by pressure-integration.

Examples will be described in detail below with reference to the drawings. However, the configurations described in this specification are merely illustrative examples and are not intended to limit the scope of the present invention to them unless specifically stated.

FIG. 1 is a process diagram for manufacturing the decorative material of the present invention.

1 is a backing material. The backing material may be a soft sheet such as polyvinyl chloride (PVC), a non-woven fabric such as glass fiber, a scrim material such as Kansai, or a composite thereof, with a thickness of 0.2 to 1 mm.
Synthetic resin chips (hereinafter referred to as chips) 4 are scattered from a hopper 3 onto a backing material 1 pulled out from a roll 2 and placed on a conveyor 16, and formed into a uniform thickness of 2 to 5 mm by a doctor blade 5.

The chips are made of PVC, acrylic resin, or polyurethane resin, and plasticizers, fillers, stabilizers, and colorants may be added as necessary. The size of the chips is preferably 20 mesh or more.

For example, the softening temperature of chips is 170 ~ in the case of PVC.
Although 220°C is preferred, it can also be carried out at other temperatures. Note that the chips may be colored in a plurality of colors, and the chips may be granulated after imparting a motsuru pattern or a marble pattern to the sheet.

The obtained chip layer is preheated, and a transparent resin thin layer (hereinafter referred to as thin layer) 6 which starts flowing at a temperature preferably lower than the softening temperature of the chips by 15° C. or more is overlaid from a roll 7 on this chip layer. The heating rolls 8 and 9 heat the chips in a temperature range that does not soften them but allows the film to flow, allowing the fluidized resin to penetrate into the gaps between the chips, and partially covering the surface of the chip layer with the thin layer-forming resin, thereby forming the chips. Smooth the surface of the layer.

As the thin layer, hot melt resins such as PVC, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl acetate copolymer, polyolefin, acrylic resin, and thermoplastic polyurethane are used, and the difference in composition of these resins ( The flow of the resin is started at a temperature lower than the softening temperature of the chips, preferably at least 15 degrees Celsius, by appropriately utilizing differences in the amount of plasticizer), the degree of polymerization, the copolymer components, and the type of resin. That's fine.

The thin layer is 10 to 500 μm, more preferably 50 μm
A thickness of ~300 μm is desirable. Furthermore, the present invention can be implemented even with a thickness greater than this. In this way, a wear-resistant transparent film 11 is layered on the sheet 10 in which the thin layer and the chip layer are in close contact with each other, if desired, and heated and pressed together with press rolls 12 and 12'.
It is wound into a roll as a finished product 13 of mm. Note that the abrasion-resistant film is not limited to lamination of previously prepared transparent films, but may also be made by coating and drying paste, latex, emulsion, or the like.

In addition, as a manufacturing method of the present invention, the above-mentioned backing material, chip, thin layer, and wear-resistant film may be superimposed on a flat press machine and integrated by heating and pressing.
When using chips larger than 10 meshes, it is recommended to use a flat press to obtain a more uniform and smooth surface.

FIG. 2 is a sectional view of a flooring material obtained according to the present invention.

1 is a backing material and 4 is an overlapping chip. The gap in the chip outer shell 14 is filled with the resin 15 that has flowed in from the thin layer 6 formed on the chip, so that a decorative material 13 with a three-dimensional effect can be obtained without impairing the shape of the chip outer shell. .

If desired, the resin forming the transparent wear-resistant resin layer 11 on the surface may be PVC, thermoplastic polyurethane,
Film, paste, sol, emulsion or latex of acrylic resin or ultraviolet curable resin are suitable.

The flooring material obtained by the present invention has a thin layer that melts and flows and penetrates into the gaps between the chips, and is integrated without any loss of the original contour of the chips, and has a smooth surface and a transparent resin layer. By looking through the layers, the three-dimensional effect of the overlapping chip patterns was further improved, making it possible to provide excellent design at a low price.

Furthermore, durability can be improved by forming a transparent wear-resistant layer on the surface.

Example 1 Chips (softening temperature: 170° C.) having an average size of about 18 meshes were prepared from PVC of the following formulation A. Parts are parts by weight.

Composition A PVC (=740) 100 parts Plasticizer 25〃 Heavy calcium carbonate 500〃 Stabilizer 1〃 Pigment Small amount Place a 0.5 mm thick PVC backing sheet on a conveyor belt, and place the above chips on the backing sheet. was applied to form a 3.5 mm thick layer. A 0.2 mm thick ethylene-vinyl acetate copolymer layer (softening temperature 84°C) was placed on the chip layer, and a 0.3 mm thick transparent calendar film, which would serve as the surface wear-resistant layer of Formulation B, was placed and preheated at 160°C. Then, it was heated and pressed at the same temperature using a press roll. A decorative sheet with a thickness of 3 mm and an excellent three-dimensional effect was obtained.

Formulation B PVC 100 parts Plasticizer 30〃 Stabilizer 3〃 Processing aid 3〃 Example 2 Chips of formulation A with an average size of about 8 meshes were prepared using a flat press machine on which a PVC backing material with a thickness of 0.5 mm was placed in advance. A layer with a thickness of 3.5 mm was spread on the bed and heated and pressed in the same manner as in Example 1 to obtain a decorative sheet with a total thickness of 3 mm.

In both Examples 1 and 2, the ethylene-vinyl acetate copolymer film was heated and fluidized and penetrated into the gaps between the chips, while the shape of the chips remained sharp without changing in the slightest, making decorative materials with excellent design at low cost. obtained.

[Brief explanation of drawings]

FIG. 1 is a manufacturing process diagram of the decorative material of the present invention, and FIG. 2 is a sectional view of the decorative material of the present invention. 4 is a synthetic resin chip, 6 is a transparent resin thin layer, and 11 is a wear-resistant resin layer.

Claims (1)

[Claims] 1. Forming an overlapping layer of thermoplastic resin chips of uniform thickness, overlaying the layer with a thin layer of transparent resin that flows at a temperature lower than the softening temperature of the chips, and only the thin layer of transparent resin flowing between the chips. The fluidized resin is heated to such an extent that it flows and penetrates into the chips, and a part of the thin layer-forming resin is coated on the surface of the chip layer, and then the chip layer and the thin layer are heated and pressed together. A method for producing a highly durable decorative material with a smooth surface.