JPH0372410U - - Google Patents
Info
- Publication number
- JPH0372410U JPH0372410U JP13523489U JP13523489U JPH0372410U JP H0372410 U JPH0372410 U JP H0372410U JP 13523489 U JP13523489 U JP 13523489U JP 13523489 U JP13523489 U JP 13523489U JP H0372410 U JPH0372410 U JP H0372410U
- Authority
- JP
- Japan
- Prior art keywords
- heating device
- cavity surface
- mold
- molding
- movable mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図Ａは本考案の成形装置の構成図。第１図
Ｂは前記成形装置の動作のフローチヤート図。第
２図は本考案による成形方法の金型の温度曲線図
。第３図は第１図装置の各構成ユニツトのタイミ
ングチヤート図。第４図は加熱手段の位置決め手
段の説明図。第５図は成形機ユニツト、加熱手段
、位置決め手段の動作説明図。第６図は加熱手段
のコイル部分の斜視図。第７図は第６図のＢ１−
Ｂ２方向の斜視図。
FIG. 1A is a configuration diagram of the molding apparatus of the present invention. FIG. 1B is a flowchart of the operation of the molding apparatus. FIG. 2 is a temperature curve diagram of the mold of the molding method according to the present invention. FIG. 3 is a timing chart of each constituent unit of the apparatus shown in FIG. 1. FIG. 4 is an explanatory diagram of the positioning means of the heating means. FIG. 5 is an explanatory diagram of the operation of the molding machine unit, heating means, and positioning means. FIG. 6 is a perspective view of the coil portion of the heating means. Figure 7 is B 1 - of Figure 6.
B. Perspective view from two directions.
Claims (1)
形装置に用いる加熱装置において、 前記固定側金型及び可動側金型の各キヤビテイ
面に対向する位置に加熱手段を移動する手段と、 前記加熱手段は前記キヤビテイ面に対して対向
する螺旋状に回巻したコイルからなることを特徴
とする成形装置に用いる加熱装置。[Scope of Claim for Utility Model Registration] In a heating device used in a molding device that moves forward and backward between a fixed mold and a movable mold, a heating device located at a position facing each cavity surface of the fixed mold and the movable mold. A heating device for use in a molding device, characterized in that: means for moving a heating device; and the heating device comprises a spirally wound coil facing the cavity surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13523489U JPH0513531Y2 (en) | 1989-11-20 | 1989-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13523489U JPH0513531Y2 (en) | 1989-11-20 | 1989-11-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0372410U true JPH0372410U (en) | 1991-07-22 |
| JPH0513531Y2 JPH0513531Y2 (en) | 1993-04-09 |
Family
ID=31682514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13523489U Expired - Lifetime JPH0513531Y2 (en) | 1989-11-20 | 1989-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513531Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010083122A (en) * | 2008-09-30 | 2010-04-15 | Mitac Precision Technology (Kunshan) Corp | High-speed injection molding system |
| JP2010083123A (en) * | 2008-09-30 | 2010-04-15 | Mitac Precision Technology (Kunshan) Corp | Compound high-speed molding system |
-
1989
- 1989-11-20 JP JP13523489U patent/JPH0513531Y2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010083122A (en) * | 2008-09-30 | 2010-04-15 | Mitac Precision Technology (Kunshan) Corp | High-speed injection molding system |
| JP2010083123A (en) * | 2008-09-30 | 2010-04-15 | Mitac Precision Technology (Kunshan) Corp | Compound high-speed molding system |
| JP4653209B2 (en) * | 2008-09-30 | 2011-03-16 | 漢達精密電子（昆山）有限公司 | Combined high speed molding system |
| JP4653208B2 (en) * | 2008-09-30 | 2011-03-16 | 漢達精密電子（昆山）有限公司 | High speed injection molding system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513531Y2 (en) | 1993-04-09 |
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