JPH0371649U - - Google Patents
Info
- Publication number
- JPH0371649U JPH0371649U JP13259789U JP13259789U JPH0371649U JP H0371649 U JPH0371649 U JP H0371649U JP 13259789 U JP13259789 U JP 13259789U JP 13259789 U JP13259789 U JP 13259789U JP H0371649 U JPH0371649 U JP H0371649U
- Authority
- JP
- Japan
- Prior art keywords
- outer lead
- lead bonding
- carrier tape
- bonding parts
- lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13259789U JPH0371649U (ko) | 1989-11-15 | 1989-11-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13259789U JPH0371649U (ko) | 1989-11-15 | 1989-11-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0371649U true JPH0371649U (ko) | 1991-07-19 |
Family
ID=31680048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13259789U Pending JPH0371649U (ko) | 1989-11-15 | 1989-11-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0371649U (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5284968A (en) * | 1976-01-07 | 1977-07-14 | Hitachi Ltd | Carrier tape |
JPS6223451B2 (ko) * | 1977-03-04 | 1987-05-22 | Nippon Electric Co | |
JPS6312141A (ja) * | 1986-07-02 | 1988-01-19 | Shindo Denshi Kogyo Kk | フレキシブルテ−プへの半導体実装方法 |
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1989
- 1989-11-15 JP JP13259789U patent/JPH0371649U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5284968A (en) * | 1976-01-07 | 1977-07-14 | Hitachi Ltd | Carrier tape |
JPS6223451B2 (ko) * | 1977-03-04 | 1987-05-22 | Nippon Electric Co | |
JPS6312141A (ja) * | 1986-07-02 | 1988-01-19 | Shindo Denshi Kogyo Kk | フレキシブルテ−プへの半導体実装方法 |