JPH0371571U - - Google Patents
Info
- Publication number
- JPH0371571U JPH0371571U JP13251789U JP13251789U JPH0371571U JP H0371571 U JPH0371571 U JP H0371571U JP 13251789 U JP13251789 U JP 13251789U JP 13251789 U JP13251789 U JP 13251789U JP H0371571 U JPH0371571 U JP H0371571U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wiring pattern
- multilayer board
- chip
- pattern provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000011093 chipboard Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13251789U JPH0371571U (sl) | 1989-11-16 | 1989-11-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13251789U JPH0371571U (sl) | 1989-11-16 | 1989-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0371571U true JPH0371571U (sl) | 1991-07-19 |
Family
ID=31679970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13251789U Pending JPH0371571U (sl) | 1989-11-16 | 1989-11-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0371571U (sl) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332415A (ja) * | 2005-05-27 | 2006-12-07 | Sharp Corp | 半導体装置 |
WO2010116469A1 (ja) * | 2009-03-30 | 2010-10-14 | 富士通株式会社 | 差動経路入れ替え部品、プリント基板及び電子装置 |
-
1989
- 1989-11-16 JP JP13251789U patent/JPH0371571U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332415A (ja) * | 2005-05-27 | 2006-12-07 | Sharp Corp | 半導体装置 |
WO2010116469A1 (ja) * | 2009-03-30 | 2010-10-14 | 富士通株式会社 | 差動経路入れ替え部品、プリント基板及び電子装置 |
JP5083460B2 (ja) * | 2009-03-30 | 2012-11-28 | 富士通株式会社 | 差動経路入れ替え部品、プリント基板及び電子装置 |