JPH036938Y2 - - Google Patents
Info
- Publication number
- JPH036938Y2 JPH036938Y2 JP1985025109U JP2510985U JPH036938Y2 JP H036938 Y2 JPH036938 Y2 JP H036938Y2 JP 1985025109 U JP1985025109 U JP 1985025109U JP 2510985 U JP2510985 U JP 2510985U JP H036938 Y2 JPH036938 Y2 JP H036938Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- insulating substrate
- conductive wires
- light emitting
- emitting display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985025109U JPH036938Y2 (xx) | 1985-02-22 | 1985-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985025109U JPH036938Y2 (xx) | 1985-02-22 | 1985-02-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS629287U JPS629287U (xx) | 1987-01-20 |
| JPH036938Y2 true JPH036938Y2 (xx) | 1991-02-21 |
Family
ID=30824955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985025109U Expired JPH036938Y2 (xx) | 1985-02-22 | 1985-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036938Y2 (xx) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3862723B2 (ja) * | 2002-10-25 | 2006-12-27 | 森山産業株式会社 | 発光モジュール |
| JP2013058771A (ja) * | 2005-10-28 | 2013-03-28 | Proteras Co Ltd | フレキシブル発光体 |
| DE102007025749A1 (de) * | 2007-06-01 | 2008-12-11 | Wacker Chemie Ag | Leuchtkörper-Silicon-Formteil |
| WO2009054048A1 (ja) * | 2007-10-23 | 2009-04-30 | Kazuhiro Miyashita | 発光ダイオードを光源とする軟性発光帯 |
| EP2421062A4 (en) | 2009-04-13 | 2013-08-28 | Panasonic Corp | ELECTROLUMINESCENT DIODE UNIT |
| JP5031011B2 (ja) * | 2009-10-21 | 2012-09-19 | エイテックス株式会社 | フレキシブル発光装置およびその製造方法 |
-
1985
- 1985-02-22 JP JP1985025109U patent/JPH036938Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS629287U (xx) | 1987-01-20 |
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