JPH036938Y2 - - Google Patents

Info

Publication number
JPH036938Y2
JPH036938Y2 JP1985025109U JP2510985U JPH036938Y2 JP H036938 Y2 JPH036938 Y2 JP H036938Y2 JP 1985025109 U JP1985025109 U JP 1985025109U JP 2510985 U JP2510985 U JP 2510985U JP H036938 Y2 JPH036938 Y2 JP H036938Y2
Authority
JP
Japan
Prior art keywords
light
insulating substrate
conductive wires
light emitting
emitting display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985025109U
Other languages
English (en)
Japanese (ja)
Other versions
JPS629287U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985025109U priority Critical patent/JPH036938Y2/ja
Publication of JPS629287U publication Critical patent/JPS629287U/ja
Application granted granted Critical
Publication of JPH036938Y2 publication Critical patent/JPH036938Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP1985025109U 1985-02-22 1985-02-22 Expired JPH036938Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985025109U JPH036938Y2 (enrdf_load_html_response) 1985-02-22 1985-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985025109U JPH036938Y2 (enrdf_load_html_response) 1985-02-22 1985-02-22

Publications (2)

Publication Number Publication Date
JPS629287U JPS629287U (enrdf_load_html_response) 1987-01-20
JPH036938Y2 true JPH036938Y2 (enrdf_load_html_response) 1991-02-21

Family

ID=30824955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985025109U Expired JPH036938Y2 (enrdf_load_html_response) 1985-02-22 1985-02-22

Country Status (1)

Country Link
JP (1) JPH036938Y2 (enrdf_load_html_response)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100585274C (zh) * 2002-10-25 2010-01-27 森山产业株式会社 发光模块
JP2013058771A (ja) * 2005-10-28 2013-03-28 Proteras Co Ltd フレキシブル発光体
DE102007025749A1 (de) * 2007-06-01 2008-12-11 Wacker Chemie Ag Leuchtkörper-Silicon-Formteil
WO2009054048A1 (ja) * 2007-10-23 2009-04-30 Kazuhiro Miyashita 発光ダイオードを光源とする軟性発光帯
EP2421062A4 (en) 2009-04-13 2013-08-28 Panasonic Corp LED UNIT
JP5031011B2 (ja) * 2009-10-21 2012-09-19 エイテックス株式会社 フレキシブル発光装置およびその製造方法

Also Published As

Publication number Publication date
JPS629287U (enrdf_load_html_response) 1987-01-20

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