JPH0369246U - - Google Patents

Info

Publication number
JPH0369246U
JPH0369246U JP1989130589U JP13058989U JPH0369246U JP H0369246 U JPH0369246 U JP H0369246U JP 1989130589 U JP1989130589 U JP 1989130589U JP 13058989 U JP13058989 U JP 13058989U JP H0369246 U JPH0369246 U JP H0369246U
Authority
JP
Japan
Prior art keywords
main surface
semiconductor chip
resin
solder
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989130589U
Other languages
English (en)
Japanese (ja)
Other versions
JPH069518Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989130589U priority Critical patent/JPH069518Y2/ja
Publication of JPH0369246U publication Critical patent/JPH0369246U/ja
Application granted granted Critical
Publication of JPH069518Y2 publication Critical patent/JPH069518Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/00—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989130589U 1989-11-10 1989-11-10 樹脂封止形半導体装置 Expired - Lifetime JPH069518Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989130589U JPH069518Y2 (ja) 1989-11-10 1989-11-10 樹脂封止形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989130589U JPH069518Y2 (ja) 1989-11-10 1989-11-10 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPH0369246U true JPH0369246U (enExample) 1991-07-09
JPH069518Y2 JPH069518Y2 (ja) 1994-03-09

Family

ID=31678155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989130589U Expired - Lifetime JPH069518Y2 (ja) 1989-11-10 1989-11-10 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPH069518Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006066717A (ja) * 2004-08-27 2006-03-09 Fuji Electric Holdings Co Ltd 半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2231487B1 (en) 2007-12-10 2012-07-11 AstraZeneca AB Vial cap 187

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006066717A (ja) * 2004-08-27 2006-03-09 Fuji Electric Holdings Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH069518Y2 (ja) 1994-03-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term