JPH036861U - - Google Patents
Info
- Publication number
- JPH036861U JPH036861U JP1335590U JP1335590U JPH036861U JP H036861 U JPH036861 U JP H036861U JP 1335590 U JP1335590 U JP 1335590U JP 1335590 U JP1335590 U JP 1335590U JP H036861 U JPH036861 U JP H036861U
- Authority
- JP
- Japan
- Prior art keywords
- line pattern
- pattern
- substrate
- insulating layer
- power line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1335590U JPH036861U (fr) | 1989-02-21 | 1990-02-14 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1922089 | 1989-02-21 | ||
| JP1335590U JPH036861U (fr) | 1989-02-21 | 1990-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036861U true JPH036861U (fr) | 1991-01-23 |
Family
ID=31717259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1335590U Pending JPH036861U (fr) | 1989-02-21 | 1990-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036861U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008098507A (ja) * | 2006-10-13 | 2008-04-24 | Denso Corp | 樹脂基板および樹脂基板を用いた超音波センサ |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530822A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Printed board |
| JPS6132644A (ja) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | ト−キ−供給方式 |
| JPS62190727A (ja) * | 1986-02-17 | 1987-08-20 | Fujitsu Ltd | 半導体ウエハの処理方法 |
-
1990
- 1990-02-14 JP JP1335590U patent/JPH036861U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530822A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Printed board |
| JPS6132644A (ja) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | ト−キ−供給方式 |
| JPS62190727A (ja) * | 1986-02-17 | 1987-08-20 | Fujitsu Ltd | 半導体ウエハの処理方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008098507A (ja) * | 2006-10-13 | 2008-04-24 | Denso Corp | 樹脂基板および樹脂基板を用いた超音波センサ |