JPH036838U - - Google Patents
Info
- Publication number
- JPH036838U JPH036838U JP1989065832U JP6583289U JPH036838U JP H036838 U JPH036838 U JP H036838U JP 1989065832 U JP1989065832 U JP 1989065832U JP 6583289 U JP6583289 U JP 6583289U JP H036838 U JPH036838 U JP H036838U
- Authority
- JP
- Japan
- Prior art keywords
- cooling module
- cooling structure
- facing
- cooling
- immersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 9
- 238000009835 boiling Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989065832U JPH036838U (ru) | 1989-06-07 | 1989-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989065832U JPH036838U (ru) | 1989-06-07 | 1989-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036838U true JPH036838U (ru) | 1991-01-23 |
Family
ID=31598019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989065832U Pending JPH036838U (ru) | 1989-06-07 | 1989-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036838U (ru) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004297069A (ja) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | 露出されている集積回路ダイ表面の直接的対流冷却用のシステム及び方法 |
| JP2010134693A (ja) * | 2008-12-04 | 2010-06-17 | Fujitsu Ltd | 冷却ジャケット、冷却ユニット、冷却システム及び電子機器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61135144A (ja) * | 1984-12-05 | 1986-06-23 | Fujitsu Ltd | 電子部品の冷却装置 |
-
1989
- 1989-06-07 JP JP1989065832U patent/JPH036838U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61135144A (ja) * | 1984-12-05 | 1986-06-23 | Fujitsu Ltd | 電子部品の冷却装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004297069A (ja) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | 露出されている集積回路ダイ表面の直接的対流冷却用のシステム及び方法 |
| JP4657617B2 (ja) * | 2003-03-27 | 2011-03-23 | エスティーマイクロエレクトロニクス，インコーポレイテッド | 露出されている集積回路ダイ表面の直接的対流冷却用のシステム及び方法 |
| JP2010134693A (ja) * | 2008-12-04 | 2010-06-17 | Fujitsu Ltd | 冷却ジャケット、冷却ユニット、冷却システム及び電子機器 |
| US8422228B2 (en) | 2008-12-04 | 2013-04-16 | Fujitsu Limited | Cooling jacket, cooling unit, and electronic apparatus |