JPH0367471U - - Google Patents

Info

Publication number
JPH0367471U
JPH0367471U JP12865589U JP12865589U JPH0367471U JP H0367471 U JPH0367471 U JP H0367471U JP 12865589 U JP12865589 U JP 12865589U JP 12865589 U JP12865589 U JP 12865589U JP H0367471 U JPH0367471 U JP H0367471U
Authority
JP
Japan
Prior art keywords
insulating substrate
conductive via
layer thin
back sides
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12865589U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12865589U priority Critical patent/JPH0367471U/ja
Publication of JPH0367471U publication Critical patent/JPH0367471U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP12865589U 1989-11-02 1989-11-02 Pending JPH0367471U (US07655688-20100202-C00548.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12865589U JPH0367471U (US07655688-20100202-C00548.png) 1989-11-02 1989-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12865589U JPH0367471U (US07655688-20100202-C00548.png) 1989-11-02 1989-11-02

Publications (1)

Publication Number Publication Date
JPH0367471U true JPH0367471U (US07655688-20100202-C00548.png) 1991-07-01

Family

ID=31676347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12865589U Pending JPH0367471U (US07655688-20100202-C00548.png) 1989-11-02 1989-11-02

Country Status (1)

Country Link
JP (1) JPH0367471U (US07655688-20100202-C00548.png)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218525A (ja) * 2002-01-18 2003-07-31 Fujitsu Ltd 回路基板及びその製造方法
JP2004219318A (ja) * 2003-01-16 2004-08-05 Hamamatsu Photonics Kk 放射線検出器
WO2004110116A1 (ja) * 2003-06-03 2004-12-16 Hitachi Metals, Ltd. 貫通電極付き基板の製造方法
JP2013098209A (ja) * 2011-10-28 2013-05-20 Seiko Epson Corp 回路基板、電子デバイス、電子機器、及び回路基板の製造方法
JP2020199748A (ja) * 2019-06-13 2020-12-17 セイコーエプソン株式会社 配線基板、配線基板の製造方法、インクジェットヘッド、memsデバイスおよび発振器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218525A (ja) * 2002-01-18 2003-07-31 Fujitsu Ltd 回路基板及びその製造方法
JP2004219318A (ja) * 2003-01-16 2004-08-05 Hamamatsu Photonics Kk 放射線検出器
WO2004110116A1 (ja) * 2003-06-03 2004-12-16 Hitachi Metals, Ltd. 貫通電極付き基板の製造方法
JP2013098209A (ja) * 2011-10-28 2013-05-20 Seiko Epson Corp 回路基板、電子デバイス、電子機器、及び回路基板の製造方法
JP2020199748A (ja) * 2019-06-13 2020-12-17 セイコーエプソン株式会社 配線基板、配線基板の製造方法、インクジェットヘッド、memsデバイスおよび発振器

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