JPH0367463U - - Google Patents

Info

Publication number
JPH0367463U
JPH0367463U JP1989129832U JP12983289U JPH0367463U JP H0367463 U JPH0367463 U JP H0367463U JP 1989129832 U JP1989129832 U JP 1989129832U JP 12983289 U JP12983289 U JP 12983289U JP H0367463 U JPH0367463 U JP H0367463U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lead wire
reflective surface
reflecting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989129832U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989129832U priority Critical patent/JPH0367463U/ja
Publication of JPH0367463U publication Critical patent/JPH0367463U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1989129832U 1989-11-07 1989-11-07 Pending JPH0367463U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989129832U JPH0367463U (enFirst) 1989-11-07 1989-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989129832U JPH0367463U (enFirst) 1989-11-07 1989-11-07

Publications (1)

Publication Number Publication Date
JPH0367463U true JPH0367463U (enFirst) 1991-07-01

Family

ID=31677432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989129832U Pending JPH0367463U (enFirst) 1989-11-07 1989-11-07

Country Status (1)

Country Link
JP (1) JPH0367463U (enFirst)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494573B1 (enFirst) * 1970-12-04 1974-02-01
JPS6273786A (ja) * 1985-09-27 1987-04-04 Toshiba Corp 半導体発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494573B1 (enFirst) * 1970-12-04 1974-02-01
JPS6273786A (ja) * 1985-09-27 1987-04-04 Toshiba Corp 半導体発光装置

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